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公开(公告)号：US20200058693A1
公开(公告)日：2020-02-20
申请号：US16662362
申请日：2019-10-24
Applicant: OLYMPUS CORPORATION
Inventor： Takuro SUYAMA , Takatoshi IGARASHI
IPC: H01L27/146 , H01L23/00 , A61B1/00 , A61B1/05
Abstract: An endoscope includes an image pickup module, and the image pickup module includes: an image pickup device an external electrode being disposed on a back surface of the image pickup device; a wiring element provided with a through-hole passing through a first main surface and a second main surface, a first electrode on the first main surface being bonded with the external electrode; a signal cable bonded with a second electrode on the second main surface of the wiring element; and a first resin that seals a first bump bonding the first electrode and the external electrode and a second bump bonding the second electrode and the signal cable, and fills the through-hole.
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公开(公告)号：US20200046210A1
公开(公告)日：2020-02-13
申请号：US16656648
申请日：2019-10-18
Applicant: OLYMPUS CORPORATION
Inventor： Takatoshi IGARASHI , Takahiro SHIMOHATA , Takuro SUYAMA
Abstract: An image pickup module includes a stacked device in which a plurality of elements are stacked, adjacent elements are electrically connected together by element joints and a rear surface electrode is arranged on a rear surface, a wiring board in which a first electrode electrically connected to the rear surface electrode by a relay joint and a second electrode electrically connected to the first electrode via a relay wiring pattern are arranged, and a signal cable electrically connected to the second electrode via a cable joint, and in the stacked device, of a first region and a second region obtained by dividing the rear surface into two portions, the element joints are arranged only in a first space in which the first region is extended in an optical axis direction and the rear surface electrode is arranged only in the second region.
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公开(公告)号：US20190029496A1
公开(公告)日：2019-01-31
申请号：US16151480
申请日：2018-10-04
Applicant: OLYMPUS CORPORATION
Inventor： Takatoshi IGARASHI
Abstract: A method for manufacturing optical units for endoscope includes: a step of fabricating device wafers; a step of laminating the device wafers to fabricate a bonded wafer; a first fixation step of fixing the bonded wafer to a first substrate; a first cutting step of cutting the bonded wafer along first cutting lines to divide the bonded wafer into slice bodies; a second fixation step of fixing cutting surfaces of the slice bodies to a second substrate; a second cutting step of cutting the slice bodies along second cutting lines to divide the slice bodies into the optical units for endoscope; and a step of removing the optical units for endoscope from the second substrate; and an area of each side face fixed to the second substrate is larger than an area of a light incident surface.
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公开(公告)号：US20170265721A1
公开(公告)日：2017-09-21
申请号：US15613399
申请日：2017-06-05
Applicant: OLYMPUS CORPORATION , PANASONIC CORPORATION
Inventor： Hironobu ICHIMURA , Tomohisa TAKAHASHI , Tomokazu YAMASHITA , Noriyuki FUJIMORI , Takatoshi IGARASHI , Yoshiki TAKAYAMA
CPC classification number: A61B1/00096 , A61B1/0011 , A61B1/04 , A61B1/05 , A61B1/051 , G02B23/24 , G02B23/2423 , G02B23/2476 , G02B23/2484 , H04N5/2253 , H04N2005/2255
Abstract: An endoscope includes: an imaging unit disposed at a distal end portion of an insertion section inserted into a body of a subject; and a built-in component provided parallel with the imaging unit at the distal end portion, and extending substantially parallel with an axial direction of the insertion section. The imaging unit includes: a solid state image sensor including a light receiving unit; a flexible circuit board electrically connecting the solid state image sensor; and a rigid circuit board at least partially disposed on a proximal end side of the endoscope relative to the solid state image sensor, and electrically connected to the flexible circuit board.
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公开(公告)号：US20130334643A1
公开(公告)日：2013-12-19
申请号：US13975578
申请日：2013-08-26
Applicant: OLYMPUS CORPORATION
Inventor： Takatoshi IGARASHI
IPC: H01L31/0203
CPC classification number: H01L31/0203 , H01L23/16 , H01L27/14618 , H01L27/14627 , H01L2924/0002 , H01L2924/00
Abstract: An image pickup apparatus includes a semiconductor chip including a light receiving section, a frame-like spacer arranged on the semiconductor chip to surround the light receiving section, a transparent flat plate section arranged on the semiconductor chip via the spacer and having a plan view dimension larger than a plan view dimension of the spacer and smaller than a plan view dimension of the semiconductor chip, and a reinforcing member for filling a gap between the semiconductor chip and the transparent flat plate section on the outer side of the spacer and having a plan view dimension larger than the plan view dimension of the transparent flat plate section and smaller than the plan view dimension of the semiconductor chip.
Abstract translation: 一种图像拾取装置包括：半导体芯片，包括光接收部分，布置在半导体芯片上以围绕光接收部分的框状间隔件;透明平板部分，其经由间隔件布置在半导体芯片上，并且具有平面图尺寸 大于所述间隔件的平面图尺寸并且小于所述半导体芯片的平面图尺寸;以及加强构件，用于填充所述间隔件的外侧上的所述半导体芯片和所述透明平板部之间的间隙，并具有计划 视图尺寸大于透明平板部分的平面视图尺寸并且小于半导体芯片的平面图尺寸。
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Patent Agency Ranking
公开(公告)号：US20220028782A1
公开(公告)日：2022-01-27
申请号：US17375314
申请日：2021-07-14
Applicant: OLYMPUS CORPORATION
Inventor： Katsumi HOSOGAI , Satoru ADACHI , Takatoshi IGARASHI , Satoshi NASUNO
IPC: H01L23/522 , A61B1/05 , H01L27/146
Abstract: A semiconductor device includes a semiconductor substrate, a trench capacitor arranged on the semiconductor substrate, a first wiring layer, a second wiring layer, a first TSV penetrating the semiconductor substrate outside the trench capacitor, a second TSV penetrating the semiconductor substrate outside the trench capacitor, a first connecting terminal connected to the first TSV, a second connecting terminal connected to the first TSV, a third connecting terminal connected to the second TSV, and a fourth connecting terminal connected to the second TSV. A plurality of connecting terminals including the first through fourth connecting terminals are arranged dispersively over an entire area of the first wiring layer and the second wiring layer of the semiconductor device, thereby stabilizing voltage supplied to an image unit and achieving a stable image signal.
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公开(公告)号：US20210099620A1
公开(公告)日：2021-04-01
申请号：US17079628
申请日：2020-10-26
Applicant: OLYMPUS CORPORATION
Inventor： Takatoshi IGARASHI
IPC: H04N5/225 , H01L27/146
Abstract: An image pickup apparatus includes: a first member, in which a plurality of optical members are laminated; a second member including an image pickup device; and a third member including a spacer and a frame, a first through-hole that penetrates through the spacer and a second through-hole that has a larger sectional area in a direction that perpendicularly intersects an optical axis than a sectional area of the first through-hole and that penetrates through the frame are provided in the third member, the third member is glued to the first member, the second member is disposed in the second through-hole, and a front surface of the second member abuts on a second main surface of the spacer, and the frame is a frame body that shields light that is incident on the second through-hole from an image pickup side surface that is a side surface of the second member.
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公开(公告)号：US20200049972A1
公开(公告)日：2020-02-13
申请号：US16656788
申请日：2019-10-18
Applicant: OLYMPUS CORPORATION
Inventor： Takatoshi IGARASHI , Takahiro SHIMOHATA , Takuro SUYAMA
IPC: G02B23/24 , H04N5/225 , H01L27/146
Abstract: An image pickup module includes a stacked element in which an external electrode is disposed on a rear surface, a first wiring board where a front electrode connected to the external electrode by an interconnecting bonding section and a first electrode are disposed, and a first signal cable connected to the first electrode by a cable bonding section, in which the first wiring board is flexible and includes a bent section in a space defined by extending a first region out of the first region and a second region obtained by dividing the rear surface into two regions in an optical axis direction, and a length of the first wiring board from the interconnecting bonding section to the cable bonding section is longer than a length of the stacked element from the interconnecting bonding section to an end side in the first region.
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公开(公告)号：US20180310813A1
公开(公告)日：2018-11-01
申请号：US15962098
申请日：2018-04-25
Applicant: OLYMPUS CORPORATION
Inventor： Takatoshi IGARASHI
CPC classification number: A61B1/04
Abstract: An imaging unit includes: an imaging chip generating an image signal by receiving light via a light receiving surface and performing photoelectric conversion; at least one semiconductor chip having a size fitting into a plane, orthogonal to an optical axis direction, of projection of the imaging chip; a reinforcement member arranged on at least one side of the semiconductor chip; and a cover glass covering the light receiving unit of the imaging chip. The semiconductor chip is layered and mounted on a back of the light receiving surface of the imaging chip, the reinforcement member covers a connection interface between the imaging chip and the semiconductor chip, or a connection interface between the semiconductor chips, and interfaces between the reinforcement member and the imaging chip and the semiconductor chip are positioned in a plane of projection in an optical axis direction the imaging chip or the cover glass.
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公开(公告)号：US20180067298A1
公开(公告)日：2018-03-08
申请号：US15802512
申请日：2017-11-03
Applicant: OLYMPUS CORPORATION
Inventor： Takatoshi IGARASHI
CPC classification number: G02B23/2407 , A61B1/00096 , A61B1/0011 , A61B1/042 , A61B1/045 , A61B1/051 , G02B7/00 , G02B7/025 , G02B23/2423 , H04N5/225 , H04N5/2254 , H04N2005/2255
Abstract: An imaging apparatus includes: an optical system configured to collect incident light; an imaging element including a light receiver configured to receive light input from the optical system and perform photoelectric conversion to generate an electrical signal; and an optical system adhesive layer configured to bond the optical system to a principal surface of the imaging element where the light receiver is provided. The optical system adhesive layer is a photosensitive transparent adhesive for which patterning is performed through a photolithography process and which has a function of determining a position of the optical system relative to the light receiver.
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