Abstract:
An organic optoelectronic component and a method for operating an organic optoelectronic component are disclosed. In an embodiment an organic optoelectronic component includes an organic light emitting element including an organic functional layer stack having an organic light emitting layer between two electrodes and an organic light detecting element including a first organic light detecting element including a first organic light detecting layer, and a second organic light detecting element including a second organic light detecting layer, wherein the organic light emitting element and the organic light detecting element are arranged laterally adjacent on a common substrate, wherein the first organic light detecting element is configured to detect ambient light, wherein the second organic light detecting layer of the second organic light detecting element is arranged between two non-transparent layers, the non-transparent layers shade the second organic light detecting layer of the second organic light detecting element from ambient light.
Abstract:
An optoelectronic component may include a carrier, a first electrode over the carrier, an organically functional layer structure over the first electrode, a second electrode over the organically functional layer structure, and an encapsulation layer structure over the second electrode, the encapsulation layer structure encapsulating the organically functional layer structure and including a first layer structure facing toward the second electrode and a second layer structure facing away from the second electrode, the first layer structure alternately including first layers having a first expansion coefficient and second layers having a second expansion coefficient, which is not equal to the first expansion coefficient, and the second layer structure alternately including third layers having a third expansion coefficient and fourth layers having a fourth expansion coefficient, which is not equal to the third expansion coefficient.
Abstract:
A light-emitting device includes a substrate having a substrate upper side, a layer sequence arranged on the substrate upper side and having at least one active, light-emitting, organic layer, wherein the layer sequence includes a plurality of emission regions that emit light, current-conducting rails which are a part of the layer sequence, wherein, in a plan view of the substrate upper side, the emissionr egions of the layer sequence are arranged next to the current-conducting rails, an encapsulation glass, wherein the layer sequence is arranged between the substrate and the encapsulation glass, and spacers formed as elevations on an encapsulation glass underside and facing towards the layer sequence of the encapsulation glass, wherein, in a plan view of the substrate upper side, the spacers at least partly overlap with the current-conducting rails, and the spacers prevent direct contact between the encapsulation glass and the layer sequence in the emission regions.
Abstract:
A dimming mirror device has a substrate having an electrochromic material that has a controllable transparency. At least one organic optoelectronic element, which has an organically functional layer stack, is arranged on the substrate. This element has at least one organic optoelectronic layer between two electrodes. The layer detects, in a first operational state of the mirror device, ambient light through the substrate such that the organic optoelectronic element acts, in the first operational state, as an element detecting organic light. The transparency of the substrate can be controlled in the first operational state in accordance with a measurement signal from the organic optoelectronic element.
Abstract:
An optoelectronic component is provided with a carrier; a zinc oxide layer arranged on the carrier and having the first and second regions, wherein the first region is a first electrode structure which is doped with aluminum so that the first region is transparent and electrically conductive; an organic optically functional layer structure arranged at least partially over the first electrode structure; and a second electrode structure arranged at least partially over the organic optically functional layer structure. The first and second electrode structures electrically contact the organic optically functional layer structure. The zinc oxide layer has a lower doping in the second region than the first electrode structure. The zinc oxide layer is configured in the second region as a varistor layer structure, which is arranged between the first and second electrode structures and contacts the two electrode structures. The varistor layer structure adjoins the optically transparent first region.
Abstract:
A method for producing a light-emitting device and light-emitting device are disclosed. In an embodiment the method includes providing a carrier layer comprising a substrate, applying a first electrode layer, applying a layer sequence for generating light, applying a second electrode layer and structuring at least one layer for varying an optical thickness in a first region of the light-emitting device differently from the layer in a second region of the light-emitting device, wherein the second region is laterally arranged relative to the first region.
Abstract:
A method for producing an optoelectronic component may include forming an optoelectronic layer structure having a first adhesion layer, which comprises a first metallic material, above a carrier, providing a covering body with a second adhesion layer, which comprises a second metallic material, applying a first alloy to one of the two adhesion layers, the melting point of the first alloy being so low that the first alloy is liquid, coupling the covering body to the optoelectronic layer structure in such a way that both adhesion layers are in direct contact with the liquid first alloy, and reacting at least part of the liquid first alloy chemically with the metallic materials, as a result of which at least one second alloy is formed, which has a higher melting point than the first alloy, wherein the second alloy solidifies and fixedly connects the covering body to the optoelectronic layer structure.
Abstract:
An optoelectronic device with a first electrode is disclosed. The first electrode includes a plurality of electrode elements, which are arranged separately from one another, such that an intermediate space is located between them. The first electrode further includes a conductive structure, which is designed in such a way that it connects adjacent electrode elements to one another in an electrically conductive manner and in the process forms a fuse which acts between the connected adjacent electrode elements. The conductive structure includes a conductive structure layer, which adjoins the electrode elements and connects the adjacent electrode elements to one another in an electrically conductive manner and in the process acts as the fuse, and/or the conductive structure extends in the space between the electrode elements, and connects the adjacent electrode elements to one another in an electrically conductive manner via the intermediate space and thereby acts as the fuse.
Abstract:
An organic optoelectronic component and a method for operating the organic optoelectronic component are disclosed. In an embodiment the organic optoelectronic component includes at least one organic light emitting element including an organic functional layer stack having at least one organic light emitting layer between two electrodes and at least one organic light detecting element including at least one organic light detecting layer, wherein the at least one organic light detecting element and the at least one organic light emitting element are laterally arranged on a common substrate.
Abstract:
Various embodiments may relate to a method for producing an organic optoelectronic component, including forming a first layer on or over a substrate, the substrate including at least one contact pad of the organic optoelectronic component, at least one electrode of the organic optoelectronic component being electrically connected to the at least one contact pad, forming a second layer on or over the first layer, and removing at least the second layer in at least one region of the substrate with the first layer and the contact pad. The adhesion of the substance or of the substance mixture of the first layer on the interface with the substrate is less than the adhesion of the substance or of the substance mixture of the second layer on the interface with the substrate.