公开(公告)号：US20210199507A1

公开(公告)日：2021-07-01

申请号：US17200713

申请日：2021-03-12

Applicant: PIXART IMAGING INC.

Inventor： MING-HAN TSAI ,  CHIH-MING SUN ,  JIAN-CHENG LIAO

IPC: G01J5/04 ,  G01J5/12 ,  G01J5/08 ,  G01J5/00

Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

公开(公告)号：US20200319033A1

公开(公告)日：2020-10-08

申请号：US16906002

申请日：2020-06-19

Applicant: PIXART IMAGING INC.

Inventor： MING-HAN TSAI ,  CHIH-MING SUN ,  JIAN-CHENG LIAO

IPC: G01J5/04 ,  G01J5/12 ,  G01J5/08 ,  G01J5/00

Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

公开(公告)号：US20200240846A1

公开(公告)日：2020-07-30

申请号：US16850187

申请日：2020-04-16

Applicant: PIXART IMAGING INC.

Inventor： CHIH-MING SUN ,  MING-HAN TSAI ,  CHENG-NAN TSAI

IPC: G01J5/02 ,  H04N5/33 ,  B81B7/00 ,  G01J5/06 ,  G01J5/04 ,  H04N5/225

Abstract: A wearable device includes a case and a far infrared temperature sensing device. The case has a first opening. The far infrared temperature sensing device is disposed inside the case of the wearable device. The far infrared temperature sensing device includes an assembly structure, a sensor chip, a filter structure, and a metal shielding structure. The assembly structure has an accommodating space and a top opening. The sensor chip is disposed in the accommodating space of the assembly structure. The filter structure is disposed above the sensor chip. The metal shielding structure is disposed above the sensor chip, and has a second opening to expose the filter structure. The first and second openings are communicated to cooperatively define a through hole.

公开(公告)号：US20250044157A1

公开(公告)日：2025-02-06

申请号：US18922683

申请日：2024-10-22

Applicant: PIXART IMAGING INC.

Inventor： MING-HAN TSAI ,  CHIH-MING SUN ,  JIAN-CHENG LIAO

IPC: G01J5/04 ,  G01J5/00 ,  G01J5/05 ,  G01J5/0802 ,  G01J5/0875 ,  G01J5/12

Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

公开(公告)号：US20210053817A1

公开(公告)日：2021-02-25

申请号：US17091062

申请日：2020-11-06

Applicant: PixArt Imaging Inc.

Inventor： CHIH-MING SUN ,  MING-HAN TSAI ,  YU-TAO LEE

IPC: B81B3/00 ,  H01L27/146 ,  H01L23/00 ,  B81C1/00

Abstract: A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members.

公开(公告)号：US20200172391A1

公开(公告)日：2020-06-04

申请号：US16783627

申请日：2020-02-06

Applicant: PixArt Imaging Inc.

Inventor： CHIH-MING SUN ,  MING-HAN TSAI ,  YU-TAO LEE

IPC: B81B3/00 ,  H01L27/146 ,  B81C1/00 ,  H01L23/00

Abstract: A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members.

公开(公告)号：US20190025127A1

公开(公告)日：2019-01-24

申请号：US16144249

申请日：2018-09-27

Applicant: PIXART IMAGING INC.

Inventor： MING-HAN TSAI ,  CHIH-MING SUN ,  JIAN-CHENG LIAO

IPC: G01J5/04 ,  G01J5/12 ,  G01J5/08 ,  G01J5/00

CPC classification number: G01J5/048 ,  G01J5/0025 ,  G01J5/043 ,  G01J5/0862 ,  G01J5/0875 ,  G01J5/12

Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case for sealing up the opening of the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.