公开(公告)号：US20150187731A1

公开(公告)日：2015-07-02

申请号：US14141342

申请日：2013-12-26

Applicant: QUALCOMM Incorporated

Inventor： Dong Wook KIM ,  Kyu-Pyung HWANG ,  Chin-Kwan KIM ,  Young Kyu SONG ,  Hong Bok WE

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L25/0655 ,  H01L23/4985 ,  H01L23/5383 ,  H01L23/5385 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15313

Abstract: A high-speed, high-density Input/Output bridge couples dies on a substrate to each other using a flexible connector that is attached to the substrate using solder balls disposed in openings in the substrate. Thus, the bulky, male-to-female connectors and/or silicon bridges are eliminated while still permitting dies disposed on the substrate to be coupled together.

Abstract translation: 高速，高密度输入/输出桥接器使用使用设置在基板中的开口中的焊球附接到基板的柔性连接器将基板上的管芯相互连接。 因此，消除了庞大的公对母连接器和/或硅桥，同时仍然允许设置在衬底上的管芯耦合在一起。