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公开(公告)号:US20180192545A1
公开(公告)日:2018-07-05
申请号:US15397437
申请日:2017-01-03
Applicant: QUANTA COMPUTER INC.
Inventor: Chao-Jung CHEN , Yu-Nien HUANG , Ching-Yu CHEN , Tsung-Ta LI
CPC classification number: H05K7/20336 , F28D15/0266 , F28D15/0275 , F28F3/02 , F28F3/06 , F28F3/12 , F28F2215/04 , F28F2215/06 , H05K7/20409
Abstract: A heat dissipation apparatus having a base, a heat dissipater, and a plurality of fin arrays. The base has at least one horizontal portion disposed in the base and at least one vertical portion extending therefrom. At least one of the plurality of fin arrays coupled with the at least one horizontal portion of the heat dissipater and at least one of the plurality of fin arrays coupled with the at least one vertical portion of the heat dissipater.
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公开(公告)号:US20180003192A1
公开(公告)日:2018-01-04
申请号:US15197507
申请日:2016-06-29
Applicant: Quanta Computer Inc.
Inventor: Chao-Jung CHEN , Yu-Nien HUANG , Ching-Yu CHEN , Tsung-Ta LI
CPC classification number: F04D29/542 , F04D19/002 , F04D29/325 , H05K7/20727 , H05K7/20736
Abstract: A cooling system includes a fan and a system component. The fan includes a plurality of fan blades and configured to rotate in a fan direction. The system component is located downstream of the fan, and includes a cutout for passing of airflow from the fan, and a bridge spanning the cutout. The bridge includes a center section and at least one arm section extending from the center section to an edge of the cutout along a curved path offset towards the fan direction.
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公开(公告)号:US20140290918A1
公开(公告)日:2014-10-02
申请号:US13914496
申请日:2013-06-10
Applicant: Quanta Computer, Inc
Inventor: Ching-Yu CHEN
CPC classification number: G06F1/203 , F28D15/0233 , F28D15/0275
Abstract: A heat dissipation module includes a centrifugal fan, a second heat dissipation fin array, and a heat pipe. The centrifugal fan includes an outer housing, a first heat dissipation fin array, an impeller and a rotation-driving device. The outer housing has an axial air inlet and a radial air outlet. The rotation-driving device is located within the outer housing and used to drive the impeller to rotate. The second heat dissipation fin array is attached to the radial air outlet. An end of the heat pipe is in contact with both the second heat dissipation fin array and a flat wall of the outer housing on which the axial air inlet is located.
Abstract translation: 散热模块包括离心风扇,第二散热翅片阵列和热管。 离心风扇包括外壳,第一散热翅片阵列,叶轮和旋转驱动装置。 外壳具有轴向空气入口和径向空气出口。 旋转驱动装置位于外壳内并用于驱动叶轮旋转。 第二散热片阵列连接到径向空气出口。 热管的一端与第二散热翅片阵列和外壳体的平坦壁与轴向空气入口所在的位置接触。
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