中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

15 records (took 0.032 seconds)

    SUBSTRATE STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME
    11.
    发明申请
    SUBSTRATE STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME 有权

    公开(公告)号：US20210289629A1

    公开(公告)日：2021-09-16

    申请号：US16902738

    申请日：2020-06-16

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Seung Eun LEE ,  Yong Hoon KIM ,  Jin Won LEE

    IPC: H05K1/18 ,  H05K1/14 ,  H05K1/11 ,  H01L23/498

    Abstract: A substrate structure includes a first printed circuit board having a first side and a second side opposing each other, and a plurality of passive components connected to the first side of the first printed circuit board. The plurality of passive components includes a first group, including a plurality of first passive components disposed adjacent to each other, and a second group, including a plurality of second passive components disposed adjacent to each other. A smallest distance between the first and second groups is greater than at least one of a smallest distance between adjacent first passive components of the plurality of first passive components and a smallest distance between adjacent second passive components of the plurality of second passive components. An electronic device includes a first printed circuit board disposed on a mainboard and having, on opposite sides thereof, a semiconductor chip and a plurality of passive components.

    PRINTED CIRCUIT BOARD
    12.
    发明公开
    PRINTED CIRCUIT BOARD 审中-公开

    公开(公告)号：US20240090121A1

    公开(公告)日：2024-03-14

    申请号：US18517393

    申请日：2023-11-22

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dae Jung BYUN ,  Jung Soo KIM ,  Sang Hyun SIM ,  Chang Min HA ,  Tae Hong MIN ,  Jin Won LEE

    IPC: H05K1/02

    CPC classification number: H05K1/0218 ,  H05K1/024 ,  H05K1/0256 ,  H05K1/0298 ,  H05K2201/0141

    Abstract: A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.

    ANTENNA MODULE
    13.
    发明申请
    ANTENNA MODULE 有权

    公开(公告)号：US20220013893A1

    公开(公告)日：2022-01-13

    申请号：US17208172

    申请日：2021-03-22

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jae Woong CHOI ,  Jin Won LEE

    IPC: H01Q1/40 ,  H05K1/02 ,  H05K1/11

    Abstract: An antenna module includes a wiring structure including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers; an antenna disposed on an upper surface of the wiring structure; and an encapsulant disposed on the upper surface of the wiring structure and covering at least a portion of the antenna. An uppermost wiring layer of the plurality of wiring layers is connected to the antenna through a connection via of an uppermost via layer of the plurality of via layers. The connection via penetrates at least a portion of the encapsulant.

    SUBSTRATE HAVING EMBEDDED INTERCONNECT STRUCTURE
    14.
    发明申请
    SUBSTRATE HAVING EMBEDDED INTERCONNECT STRUCTURE 审中-公开

    公开(公告)号：US20200083179A1

    公开(公告)日：2020-03-12

    申请号：US16203053

    申请日：2018-11-28

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Doo Hwan LEE ,  Yong Hoon KIM ,  Tae Je CHO ,  Jin Won LEE

    IPC: H01L23/00 ,  H01L23/498

    Abstract: A substrate having an embedded interconnect structure includes an interconnect structure including a circuit member including circuit layers and a passive device disposed in parallel with the circuit member and including an external electrode, and a printed circuit board including an insulating layer covering the interconnect structure, a first wiring layer disposed on the insulating layer, a first wiring via penetrating through at least a portion of the insulating layer and electrically connecting the first wiring layer to an uppermost circuit layer, among the circuit layers, and a second wiring via penetrating through at least a portion of the insulating layer and electrically connecting the first wiring layer to the external electrode of the passive device. A top surface of the uppermost circuit layer, contacting the first wiring via, is coplanar with a top surface of the external electrode, contacting the second wiring via.

Patent Agency Ranking