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公开(公告)号：US20210410285A1
公开(公告)日：2021-12-30
申请号：US17215916
申请日：2021-03-29
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seung Eun LEE , Jae Woong CHOI , Joo Hwan JUNG , Yong Hoon KIM , Jin Won LEE
Abstract: A printed circuit board includes a first insulating layer, a second insulating layer disposed on a lower surface of the first insulating layer, an electronic component embedded in the second insulating layer and at least partially in contact with the first insulating layer, a first wiring layer disposed on an upper surface of the first insulating layer, a second wiring layer disposed on a lower surface of the second insulating layer, and a first wiring via penetrating through the first and second insulating layers and connecting at least portions of the first and second wiring layers to each other.
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2.发明公开公开(公告)号：US20240032202A1
公开(公告)日：2024-01-25
申请号：US18108846
申请日：2023-02-13
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kwang Yun KIM , Kyung Sang LIM , Seung Eun LEE , Yong Hoon KIM
CPC classification number: H05K1/185 , G02B6/12004 , H05K1/0274 , H05K1/115 , H05K1/183 , H05K2201/10378 , H05K2201/096 , H05K2201/09827 , H05K2201/10121
Abstract: A photonic integrated circuit embedded substrate may include: an embedded insulating layer on which a photonic integrated circuit is disposed, and at least one first insulating layer stacked on one surface of the embedded insulating layer. The at least one first insulating layer may have an optical path extending in a stacking direction of the at least one first insulating layer.
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公开(公告)号：US20220087025A1
公开(公告)日：2022-03-17
申请号：US17213850
申请日：2021-03-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yun Je JI , Yong Hoon KIM
Abstract: An electronic component-embedded substrate includes a wiring structure including a plurality of insulating layers and a plurality of wiring layers and having a cavity penetrating through at least one of the plurality of insulating layers, a first electronic component disposed in the cavity, a dam structure disposed on the wiring structure and having a through-portion, a first insulating material disposed in at least a portion of each of the cavity and the through-portion, and covering at least a portion of each of the wiring structure and the first electronic component, and a first circuit layer disposed on the first insulating material.
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公开(公告)号：US20210183754A1
公开(公告)日：2021-06-17
申请号：US16800201
申请日：2020-02-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Hoon KIM , Seung Eun LEE , Young Kwan LEE , Hak Chun KIM
IPC: H01L23/498 , H01L23/00 , H01L25/16
Abstract: A substrate-on-substrate structure and an electronic device including the same are provided, and the substrate-on-substrate structure includes: a first printed circuit board having a first side and a second side, opposite to the first side; a second printed circuit board disposed on the second side of the first printed circuit board, and having a first side connected to the second side of the first printed circuit board and a second side opposite to the first side connected to the second side of the first printed circuit board; a reinforcing structure attached to the first side of the second printed circuit board, and spaced apart from the second side of the first printed circuit board; and an underfill resin disposed between the second side of the first printed circuit board and the first side of the second printed circuit board, and covering at least a portion of the reinforcing structure.
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公开(公告)号：US20230171895A1
公开(公告)日：2023-06-01
申请号：US17715266
申请日：2022-04-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kwang Yun KIM , Seung Eun LEE , Yong Hoon KIM
CPC classification number: H05K1/186 , H05K1/0298 , H01S5/183
Abstract: A printed circuit board (PCB) includes a substrate including a first insulating layer and first wiring patterns disposed on the first insulating layer, an optical sensing chip including a vertical cavity surface emitting laser (VCSEL) and a photodiode, disposed on the first insulating layer to be in contact with at least one of the first wiring patterns, a transimpedance amplifier (TIA) chip disposed to be spaced apart from the optical sensing chip on the first insulating layer and disposed to be in contact with at least one first wiring pattern, different from the first wiring pattern connected to the optical sensing chip, among the first wiring patterns, and a dielectric layer stacked on the substrate and having a hole exposing the VCSEL and the photodiode of the optical sensing chip. The optical sensing chip and the transimpedance amplifier chip are connected through a wiring pattern disposed on the dielectric layer.
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Patent Agency Ranking
公开(公告)号：US20220361324A1
公开(公告)日：2022-11-10
申请号：US17459212
申请日：2021-08-27
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yun Je JI , Seung Eun LEE , Yong Hoon KIM
Abstract: The present disclosure relates to a printed circuit board. The printed circuit board includes: a plurality of insulating layers; a plurality of circuit layers disposed on at least one of an interior and an exterior of the plurality of insulating layers; and a reinforcing layer disposed on one surface of the plurality of insulating layers, and having a first opening having a first width and a second opening having a second width, different from the first width.
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公开(公告)号：US20220192020A1
公开(公告)日：2022-06-16
申请号：US17196651
申请日：2021-03-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Joo Hwan JUNG , Jae Woong CHOI , Seung Eun LEE , Yong Hoon KIM , Jin Won LEE
Abstract: A connection structure embedded substrate includes a printed circuit board including a first insulating body and a plurality of first wiring layers disposed on at least one of an external region or an internal region of the first insulating body; and a connection structure embedded in the first insulating body and including first and second substrates. The first and second substrates are disposed adjacent to each other.
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公开(公告)号：US20230207197A1
公开(公告)日：2023-06-29
申请号：US17721808
申请日：2022-04-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jae Hoon KIM , Ji Hoon KIM , Gyoung Heon KO , Yong Hoon KIM
CPC classification number: H01G4/012 , H01G4/30 , H01G4/232 , H01G4/1227
Abstract: A multilayer electronic component may include a first internal electrode layer including a first dielectric layer and first to fourth internal electrodes disposed to be spaced apart from each other on the first dielectric layer, a second internal electrode layer including a second dielectric layer and a fifth internal electrode disposed on the second dielectric layer, a body including a capacitance forming portion in which the first internal electrode layer and the second internal electrode layer are alternately disposed, a connection electrode penetrating through the first and second internal electrode layers, spaced apart from the first to fourth internal electrodes, and connected to the fifth internal electrode, first to fourth external electrodes disposed to be connected to the first to fourth internal electrodes, respectively, on the body, and a fifth external electrode disposed to be connected to the connection electrode on the body.
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公开(公告)号：US20230171900A1
公开(公告)日：2023-06-01
申请号：US17704303
申请日：2022-03-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jae Woong CHOI , Yun Je JI , Seung Eun LEE , Yong Hoon KIM
IPC: H05K3/46 , H05K1/11 , H05K3/34 , H01L23/498
CPC classification number: H05K3/4697 , H01L23/49822 , H01L23/49838 , H05K1/115 , H05K3/34 , H05K3/4644 , H05K2201/096 , H05K2201/10015 , H05K2201/10734
Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a wiring substrate including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers and having a cavity penetrating through a portion of the plurality of insulating layers, a passive component disposed in the cavity and including an external electrode electrically connected to at least one of the plurality of wiring layers, and a bridge disposed on the passive component in the cavity and including one or more circuit layers electrically connected to the external electrode.
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公开(公告)号：US20220210913A1
公开(公告)日：2022-06-30
申请号：US17198672
申请日：2021-03-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seon Ha KANG , Yong Hoon KIM
IPC: H05K1/02
Abstract: A printed circuit board includes: an insulating layer; a first circuit pattern embedded in one surface of the insulating layer; and a second circuit pattern disposed on the one surface of the insulating layer and including a first metal layer and a second metal layer disposed on the first metal layer. An average width of the first metal layer is wider than an average width of the second metal layer.
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