公开(公告)号：US20230015405A1

公开(公告)日：2023-01-19

申请号：US17679472

申请日：2022-02-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Kyung LEE ,  Sung Joon PARK ,  Kwang Su KIM ,  Jae Goon AUM ,  Sung HAN

IPC: H03H9/10 ,  H03H9/13

Abstract: A bulk acoustic resonator package is provided. The bulk acoustic resonator package includes a substrate; a cap; a resonance portion including a first electrode, a piezoelectric layer, and a second electrode, stacked in a first direction in which the substrate and the cap face each other, and disposed between the substrate and the cap; and a cap melting member disposed to surround the resonance portion, and disposed to be in contact with a portion of a surface of the cap facing the substrate, when viewed in the first direction, and including a material or a structure that is based on a melting of the portion of the surface of the cap.

公开(公告)号：US20170237410A1

公开(公告)日：2017-08-17

申请号：US15271646

申请日：2016-09-21

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Yun Sung KANG ,  Ji Hye NAM ,  Kwang Su KIM ,  Pil Joong KANG ,  Jeong Il LEE

IPC: H03H9/54 ,  H01L41/29 ,  H03H9/64

CPC classification number: H03H9/54 ,  H01L41/29 ,  H03H9/1014 ,  H03H9/1064 ,  H03H9/64

Abstract: An acoustic wave filter device includes a base comprising an acoustic wave filter part formed on one surface thereof and including a bonding part formed to surround the acoustic wave filter part, and a cap including a depression groove formed therein and a bonding counterpart formed to correspond to the bonding part. The depression groove is positioned over the acoustic wave filter part. The bonding part and the bonding counterpart receive a voltage to deform and bond the bonding part and the bonding counterpart to each other.

公开(公告)号：US20230208381A1

公开(公告)日：2023-06-29

申请号：US17994706

申请日：2022-11-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Moon Chul LEE ,  Kwang Su KIM ,  Jin Woo YI ,  Jae Hyoung GIL ,  Yong Suk KIM ,  Dong Hyun PARK

IPC: H03H9/02 ,  H03H9/13 ,  H03H9/54

CPC classification number: H03H9/02015 ,  H03H9/132 ,  H03H9/131 ,  H03H9/54

Abstract: A bulk acoustic resonator includes a substrate, a frequency control layer changing a resonant frequency or antiresonant frequency of the bulk acoustic resonator according to a thickness of the frequency control layer, a piezoelectric layer disposed between the frequency control layer and the substrate, a first electrode disposed between the piezoelectric layer and the substrate, a second electrode disposed between the piezoelectric layer and the frequency control layer, a metal layer connected to the first electrode or the second electrode, and a protective layer disposed between the second electrode and the frequency control layer, wherein the frequency control layer covers a larger area than that of the protective layer.

公开(公告)号：US20200087141A1

公开(公告)日：2020-03-19

申请号：US16357588

申请日：2019-03-19

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Tae Hun LEE ,  Kwang Su KIM ,  Tae Yoon KIM

IPC: B81B7/00 ,  B81B7/02 ,  B81C1/00

Abstract: A MEMS device includes a substrate, a MEMS element portion disposed on a surface of the substrate, a cap having a cavity formed to oppose the MEMS element portion, and a diffusion prevention layer formed on at least a portion of the cap, wherein at least one of the cap and the substrate includes a bonding layer disposed outside of the cavity, and wherein the cap includes a spreading prevention portion disposed between the bonding layer and the cavity and having a V-shape in cross-section.

公开(公告)号：US20180062619A1

公开(公告)日：2018-03-01

申请号：US15673498

申请日：2017-08-10

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jin Woo YI ,  Chan Hee PARK ,  Kwang Su KIM ,  Sang Jin KIM

IPC: H03H9/54 ,  H03H9/02 ,  H03H9/13 ,  H03H3/02

CPC classification number: H03H9/54 ,  H03H3/02 ,  H03H9/02007 ,  H03H9/1014 ,  H03H9/105 ,  H03H9/133 ,  H03H9/173 ,  H03H9/174 ,  H03H2003/021 ,  H03H2003/023

Abstract: A bulk acoustic filter device includes: a substrate including a through hole formed by a first recess and a second recess adjacent to the first recess; a membrane layer forming a cavity with the substrate; a filter including a lower electrode disposed on the membrane layer, a piezoelectric layer disposed to cover a portion of the lower electrode, and an upper electrode formed to cover a portion of the piezoelectric layer; and an electrode connecting member disposed in the substrate, and connected to either one of the lower electrode and the upper electrode, wherein the electrode connecting member includes an insertion electrode disposed in the first recess, and a via electrode connected to the insertion electrode, and disposed on an inner peripheral surface of the second recess and a surface of the substrate.

公开(公告)号：US20170230032A1

公开(公告)日：2017-08-10

申请号：US15276986

申请日：2016-09-27

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Yun Sung KANG ,  Pil Joong KANG ,  Kwang Su KIM ,  Ji Hye NAM ,  Jeong Suong YANG ,  Jeong Il LEE ,  Jong Hyeong SONG

IPC: H03H9/56 ,  H03H9/64

CPC classification number: H03H9/56 ,  H03H3/02 ,  H03H3/08 ,  H03H9/1014 ,  H03H9/1071 ,  H03H9/64

Abstract: An acoustic wave filter device includes a base having an acoustic wave filter part and a bonding part disposed thereon, the bonding part surrounding the acoustic wave filter part, and a cap having a bonding counterpart disposed thereon, the bonding counterpart being bonded to the bonding part of the base, and the bonding part includes a first bonding layer including gold, and the bonding counterpart includes a second bonding layer bonded to the first bonding layer and including tin.