公开(公告)号：US20240128136A1

公开(公告)日：2024-04-18

申请号：US18110478

申请日：2023-02-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Wook PARK ,  Seong Hun NA ,  Jae Hyun JUNG ,  Kwang Su KIM ,  Sung Jun LEE ,  Yong Suk KIM ,  Dong Hyun PARK

IPC: H01L23/10 ,  H01L21/48 ,  H01L23/043

CPC classification number: H01L23/10 ,  H01L21/4817 ,  H01L23/043

Abstract: A wafer level package includes: a substrate; an element portion disposed on one surface of the substrate; a cap disposed on the substrate to cover the element portion; a connection portion electrically connected to the element portion; and a bonding portion disposed on an outer side of the connection portion, wherein the bonding portion is disposed on a first surface of one of the substrate and the cap, wherein one end portion of the connection portion is disposed on a second surface having a step difference from the first surface, and wherein the connection portion and the bonding portion are formed of a eutectic material.

公开(公告)号：US20230370048A1

公开(公告)日：2023-11-16

申请号：US18101267

申请日：2023-01-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Su KIM ,  Jae Hyoung GIL ,  Moon Chul LEE ,  Yong Suk KIM ,  Dong Hyun PARK ,  Tae Kyung LEE

IPC: H03H9/17 ,  H03H9/13 ,  H03H9/02

CPC classification number: H03H9/174 ,  H03H9/131 ,  H03H9/02015 ,  H03H9/173

Abstract: A bulk-acoustic wave resonator includes a substrate; a lower electrode, disposed on the substrate, comprising a first inclined surface and a second inclined surface; and an insertion layer disposed on an edge of the lower electrode. The first inclined surface extends from an inclined surface of the insertion layer in a region disposed inside the insertion layer. The second inclined surface extends from the first inclined surface in a region inside a region of the first inclined surface.

公开(公告)号：US20200021265A1

公开(公告)日：2020-01-16

申请号：US16271158

申请日：2019-02-08

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Tae Kyung LEE ,  Kwang Su KIM ,  Jin Suk SON ,  Yeong Gyu LEE ,  Sung Sun KIM ,  Sang Jin KIM

IPC: H03H9/02 ,  H03H9/15 ,  H03H9/54

Abstract: An acoustic resonator package includes: a substrate; an acoustic resonator disposed on the substrate; a cap disposed on the substrate and the acoustic resonator; and a bonding portion bonding the substrate and the cap to each other, wherein the cap includes a trench formed around the bonding portion and a protective layer covering a surface of the trench in the cap, and wherein a portion of the bonding portion fills at least a portion of the trench.

公开(公告)号：US20170179919A1

公开(公告)日：2017-06-22

申请号：US15073851

申请日：2016-03-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jeong Suong YANG ,  Jeong Il LEE ,  Yun Sung KANG ,  Kwang Su KIM ,  Pil Joong KANG

IPC: H03H9/02 ,  H03H9/05 ,  H03H3/02 ,  H03H9/17

CPC classification number: H03H9/02007 ,  H03H3/02 ,  H03H9/0504 ,  H03H9/1014 ,  H03H9/17 ,  H03H9/173

Abstract: An acoustic resonator and a method of manufacturing the same are provided. An acoustic resonator includes a resonating part disposed on a substrate, a cap accommodating the resonating part and bonded to the substrate, and a bonded part bonding the cap and the substrate to each other, the bonding part including at least one block disposed between a bonding surface of the cap and a bonding surface of the substrate to block a leakage of a bonding material that forms the bonded part during a bonding operation.

公开(公告)号：US20230188114A1

公开(公告)日：2023-06-15

申请号：US17875503

申请日：2022-07-28

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Tae Kyung LEE ,  Sung Tae KIM ,  Kwang Su KIM ,  Jae Goon AUM

IPC: H03H9/56 ,  H03H9/205 ,  H03H9/02

CPC classification number: H03H9/566 ,  H03H9/205 ,  H03H9/02157

Abstract: A bulk acoustic resonator filter includes a plurality of bulk acoustic resonators connected between first and second radio frequency (RF) ports to form a frequency band, wherein each of the plurality of bulk acoustic resonators includes a first electrode, a second electrode, and a piezoelectric layer disposed between the first and second electrodes, the plurality of bulk acoustic resonators include first and second bulk acoustic resonators having different differences between a resonant frequency and an antiresonant frequency, and different ratios of a thickness of the piezoelectric layer to a total thickness of the first and second electrodes, and/or different thicknesses of the piezoelectric layer.

公开(公告)号：US20180068915A1

公开(公告)日：2018-03-08

申请号：US15807805

申请日：2017-11-09

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Pil Joong KANG ,  Kwang Su KIM ,  Ji Hye NAM ,  Jeong Il LEE ,  Jong Hyeong SONG ,  Yun Sung KANG ,  Seung Joo SHIN ,  Nam Jung LEE

IPC: H01L23/10 ,  H03H3/02 ,  H03H9/13 ,  H03H9/02 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L23/10 ,  H01L21/4817 ,  H01L23/055 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49827 ,  H03H3/02 ,  H03H9/02007 ,  H03H9/1014 ,  H03H9/13 ,  H03H2003/021

Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.

公开(公告)号：US20170271573A1

公开(公告)日：2017-09-21

申请号：US15272618

申请日：2016-09-22

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Pil Joong KANG ,  Kwang Su KIM ,  Jeong Il LEE ,  Jong Hyeong SONG ,  Hyun Kee LEE ,  Yun Sung KANG ,  Seung Joo SHIN ,  Jeong Suong YANG

IPC: H01L41/053 ,  H03H9/54 ,  H03H9/17

Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, a cap enclosing the element, a bonding portion bonding the substrate to the cap, and blocking portions disposed on both sides of the bonding portion.

公开(公告)号：US20170271222A1

公开(公告)日：2017-09-21

申请号：US15275603

申请日：2016-09-26

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Pil Joong KANG ,  Kwang Su KIM ,  Ji Hye NAM ,  Jeong Il LEE ,  Jong Hyeong SONG ,  Yun Sung KANG ,  Seung Joo SHIN ,  Nam Jung LEE

IPC: H01L23/10 ,  H03H9/13 ,  H03H9/02 ,  H03H3/02 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L23/10 ,  H01L21/4817 ,  H01L23/055 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49827 ,  H03H3/02 ,  H03H9/02007 ,  H03H9/1014 ,  H03H9/13 ,  H03H2003/021

Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.

公开(公告)号：US20240080011A1

公开(公告)日：2024-03-07

申请号：US18112609

申请日：2023-02-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Moon Chul LEE ,  Jae Hyoung GIL ,  Kwang Su KIM ,  Sung Jun LEE ,  Yong Suk KIM ,  Dong Hyun PARK ,  Tae Kyung LEE

IPC: H03H9/17 ,  H03H3/02

CPC classification number: H03H9/172 ,  H03H3/02

Abstract: A bulk-acoustic wave (BAW) resonator includes a central portion in which a first electrode, a piezoelectric layer, and a second electrode are sequentially stacked on a substrate, and an extension portion extending externally from the central portion, and an insertion layer and a loss prevention film are disposed in the extension portion between the substrate and the second electrode. The loss prevention film is formed to have a thickness of 50 Å to 500 Å. The insertion layer is stacked on the loss prevention film, and has a side surface opposing the central portion, the side surface is formed as a first inclined surface having a first inclination angle. The loss prevention film has a side surface opposing the central portion, the side surface is formed as a second inclined surface having a second inclination angle. The second inclination angle is formed to be greater than the first inclination angle.

公开(公告)号：US20230087049A1

公开(公告)日：2023-03-23

申请号：US17689333

申请日：2022-03-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Kyung LEE ,  Sang Heon HAN ,  Kwang Su KIM ,  Sung Joon PARK ,  Jae Goon AUM

IPC: H03H9/02 ,  H03H9/17

Abstract: A bulk acoustic resonator includes: a substrate; a protective layer; and a resonant portion including a piezoelectric layer, a first electrode disposed between the piezoelectric layer and the substrate, and a second electrode disposed between the piezoelectric layer and the protective layer. The protective layer covers a central portion of the resonant portion and a reflective portion surrounding the central portion and formed in a region in which an upper surface of the second electrode rises relative to the central portion. An upper surface of a portion of the protective layer covering the reflective portion is more gently inclined than the upper surface of a portion of the second electrode in the reflective portion.