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公开(公告)号:US20240128136A1
公开(公告)日:2024-04-18
申请号:US18110478
申请日:2023-02-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Seung Wook PARK , Seong Hun NA , Jae Hyun JUNG , Kwang Su KIM , Sung Jun LEE , Yong Suk KIM , Dong Hyun PARK
IPC: H01L23/10 , H01L21/48 , H01L23/043
CPC classification number: H01L23/10 , H01L21/4817 , H01L23/043
Abstract: A wafer level package includes: a substrate; an element portion disposed on one surface of the substrate; a cap disposed on the substrate to cover the element portion; a connection portion electrically connected to the element portion; and a bonding portion disposed on an outer side of the connection portion, wherein the bonding portion is disposed on a first surface of one of the substrate and the cap, wherein one end portion of the connection portion is disposed on a second surface having a step difference from the first surface, and wherein the connection portion and the bonding portion are formed of a eutectic material.
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公开(公告)号:US20230370048A1
公开(公告)日:2023-11-16
申请号:US18101267
申请日:2023-01-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Kwang Su KIM , Jae Hyoung GIL , Moon Chul LEE , Yong Suk KIM , Dong Hyun PARK , Tae Kyung LEE
CPC classification number: H03H9/174 , H03H9/131 , H03H9/02015 , H03H9/173
Abstract: A bulk-acoustic wave resonator includes a substrate; a lower electrode, disposed on the substrate, comprising a first inclined surface and a second inclined surface; and an insertion layer disposed on an edge of the lower electrode. The first inclined surface extends from an inclined surface of the insertion layer in a region disposed inside the insertion layer. The second inclined surface extends from the first inclined surface in a region inside a region of the first inclined surface.
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公开(公告)号:US20200021265A1
公开(公告)日:2020-01-16
申请号:US16271158
申请日:2019-02-08
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor: Tae Kyung LEE , Kwang Su KIM , Jin Suk SON , Yeong Gyu LEE , Sung Sun KIM , Sang Jin KIM
Abstract: An acoustic resonator package includes: a substrate; an acoustic resonator disposed on the substrate; a cap disposed on the substrate and the acoustic resonator; and a bonding portion bonding the substrate and the cap to each other, wherein the cap includes a trench formed around the bonding portion and a protective layer covering a surface of the trench in the cap, and wherein a portion of the bonding portion fills at least a portion of the trench.
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公开(公告)号:US20170179919A1
公开(公告)日:2017-06-22
申请号:US15073851
申请日:2016-03-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Jeong Suong YANG , Jeong Il LEE , Yun Sung KANG , Kwang Su KIM , Pil Joong KANG
CPC classification number: H03H9/02007 , H03H3/02 , H03H9/0504 , H03H9/1014 , H03H9/17 , H03H9/173
Abstract: An acoustic resonator and a method of manufacturing the same are provided. An acoustic resonator includes a resonating part disposed on a substrate, a cap accommodating the resonating part and bonded to the substrate, and a bonded part bonding the cap and the substrate to each other, the bonding part including at least one block disposed between a bonding surface of the cap and a bonding surface of the substrate to block a leakage of a bonding material that forms the bonded part during a bonding operation.
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公开(公告)号:US20230188114A1
公开(公告)日:2023-06-15
申请号:US17875503
申请日:2022-07-28
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor: Tae Kyung LEE , Sung Tae KIM , Kwang Su KIM , Jae Goon AUM
CPC classification number: H03H9/566 , H03H9/205 , H03H9/02157
Abstract: A bulk acoustic resonator filter includes a plurality of bulk acoustic resonators connected between first and second radio frequency (RF) ports to form a frequency band, wherein each of the plurality of bulk acoustic resonators includes a first electrode, a second electrode, and a piezoelectric layer disposed between the first and second electrodes, the plurality of bulk acoustic resonators include first and second bulk acoustic resonators having different differences between a resonant frequency and an antiresonant frequency, and different ratios of a thickness of the piezoelectric layer to a total thickness of the first and second electrodes, and/or different thicknesses of the piezoelectric layer.
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公开(公告)号:US20180068915A1
公开(公告)日:2018-03-08
申请号:US15807805
申请日:2017-11-09
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor: Pil Joong KANG , Kwang Su KIM , Ji Hye NAM , Jeong Il LEE , Jong Hyeong SONG , Yun Sung KANG , Seung Joo SHIN , Nam Jung LEE
CPC classification number: H01L23/10 , H01L21/4817 , H01L23/055 , H01L23/13 , H01L23/49816 , H01L23/49827 , H03H3/02 , H03H9/02007 , H03H9/1014 , H03H9/13 , H03H2003/021
Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.
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公开(公告)号:US20170271573A1
公开(公告)日:2017-09-21
申请号:US15272618
申请日:2016-09-22
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor: Pil Joong KANG , Kwang Su KIM , Jeong Il LEE , Jong Hyeong SONG , Hyun Kee LEE , Yun Sung KANG , Seung Joo SHIN , Jeong Suong YANG
IPC: H01L41/053 , H03H9/54 , H03H9/17
Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, a cap enclosing the element, a bonding portion bonding the substrate to the cap, and blocking portions disposed on both sides of the bonding portion.
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公开(公告)号:US20170271222A1
公开(公告)日:2017-09-21
申请号:US15275603
申请日:2016-09-26
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor: Pil Joong KANG , Kwang Su KIM , Ji Hye NAM , Jeong Il LEE , Jong Hyeong SONG , Yun Sung KANG , Seung Joo SHIN , Nam Jung LEE
CPC classification number: H01L23/10 , H01L21/4817 , H01L23/055 , H01L23/13 , H01L23/49816 , H01L23/49827 , H03H3/02 , H03H9/02007 , H03H9/1014 , H03H9/13 , H03H2003/021
Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.
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公开(公告)号:US20240080011A1
公开(公告)日:2024-03-07
申请号:US18112609
申请日:2023-02-22
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Moon Chul LEE , Jae Hyoung GIL , Kwang Su KIM , Sung Jun LEE , Yong Suk KIM , Dong Hyun PARK , Tae Kyung LEE
Abstract: A bulk-acoustic wave (BAW) resonator includes a central portion in which a first electrode, a piezoelectric layer, and a second electrode are sequentially stacked on a substrate, and an extension portion extending externally from the central portion, and an insertion layer and a loss prevention film are disposed in the extension portion between the substrate and the second electrode. The loss prevention film is formed to have a thickness of 50 Å to 500 Å. The insertion layer is stacked on the loss prevention film, and has a side surface opposing the central portion, the side surface is formed as a first inclined surface having a first inclination angle. The loss prevention film has a side surface opposing the central portion, the side surface is formed as a second inclined surface having a second inclination angle. The second inclination angle is formed to be greater than the first inclination angle.
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公开(公告)号:US20230087049A1
公开(公告)日:2023-03-23
申请号:US17689333
申请日:2022-03-08
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Tae Kyung LEE , Sang Heon HAN , Kwang Su KIM , Sung Joon PARK , Jae Goon AUM
Abstract: A bulk acoustic resonator includes: a substrate; a protective layer; and a resonant portion including a piezoelectric layer, a first electrode disposed between the piezoelectric layer and the substrate, and a second electrode disposed between the piezoelectric layer and the protective layer. The protective layer covers a central portion of the resonant portion and a reflective portion surrounding the central portion and formed in a region in which an upper surface of the second electrode rises relative to the central portion. An upper surface of a portion of the protective layer covering the reflective portion is more gently inclined than the upper surface of a portion of the second electrode in the reflective portion.
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