公开(公告)号：US09192050B2

公开(公告)日：2015-11-17

申请号：US13765650

申请日：2013-02-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Yeol Park ,  Suk Jin Ham ,  Jung Tae Park ,  Seung Heon Han ,  Jung Eun Noh

IPC: H05K3/30 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K1/185 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/15153 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y10T29/4913

Abstract: Disclosed herein is a method of manufacturing a printed circuit board, including; forming an electronic component including an electrode that is formed on at least one side of a body; forming terminals on an upper portion of the electrode and an upper portion of the body; providing a substrate in which a cavity is formed; mounting the electronic component formed with the terminals in the cavity of the substrate; and forming a buildup layer on an upper portion of the substrate and an upper portion of the electronic component.

Abstract translation: 本文公开了一种制造印刷电路板的方法，包括： 形成包括形成在主体的至少一侧的电极的电子部件; 在电极的上部形成端子和主体的上部; 提供其中形成空腔的基板; 将形成有端子的电子部件安装在基板的空腔中; 以及在所述基板的上部和所述电子部件的上部形成积聚层。

公开(公告)号：US20140130347A1

公开(公告)日：2014-05-15

申请号：US13765650

申请日：2013-02-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Yeol PARK ,  Suk Jin Ham ,  Jung Tae Park ,  Seung Heon Han ,  Jung Eun Noh

IPC: H05K3/30

CPC classification number: H05K1/185 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/15153 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y10T29/4913

Abstract: Disclosed herein is a method of manufacturing a printed circuit board, including; forming an electronic component including an electrode that is formed on at least one side of a body; forming terminals on an upper portion of the electrode and an upper portion of the body; providing a substrate in which a cavity is formed; mounting the electronic component formed with the terminals in the cavity of the substrate; and forming a buildup layer on an upper portion of the substrate and an upper portion of the electronic component.

Abstract translation: 本文公开了一种制造印刷电路板的方法，包括： 形成包括形成在主体的至少一侧的电极的电子部件; 在电极的上部形成端子和主体的上部; 提供其中形成空腔的基板; 将形成有端子的电子部件安装在基板的空腔中; 以及在所述基板的上部和所述电子部件的上部形成积聚层。

公开(公告)号：US20140085770A1

公开(公告)日：2014-03-27

申请号：US13827397

申请日：2013-03-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jung Tae Park ,  Seung Heon Han ,  Young Jun Choi ,  Ji Hee Moon ,  Ki Won Kim ,  Joon Hwan Kwag

IPC: H01G4/008

CPC classification number: H01G4/008 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30

Abstract: Disclosed herein is a chip device including: a multilayer body having a hexahedral shape; an external electrode covering both distal ends of the multilayer body; and a shape maintaining material contained in the external electrode to maintain a shape of the external electrode at the time of forming the external electrode.

Abstract translation: 这里公开了一种芯片装置，包括：具有六面体形状的多层体; 覆盖所述多层体的两端部的外部电极; 以及包含在外部电极中的形状保持材料，以在形成外部电极时保持外部电极的形状。