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公开(公告)号：US11289622B2
公开(公告)日：2022-03-29
申请号：US16832884
申请日：2020-03-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yoonsuk Lee , Sangmoo Park , Doyoung Kwag , Byungchul Kim , Eunhye Kim , Minsub Oh , Dongyeob Lee
Abstract: A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a relay substrate having at least one micro LED; a mask having openings corresponding to a position of the at least one micro LED; a first laser configured to irradiate a first laser light having a first wavelength to the mask; a second laser configured to irradiate a second laser light having a second wavelength different from the first wavelength to the mask; and a processor configured to: control the at least one micro LED to contact a coupling layer of a target substrate, and based on the coupling layer contacting the at least one micro LED, control the first laser to irradiate the first laser light toward the at least one micro LED, and subsequently control the second laser to irradiate the second laser light toward the at least one micro LED.
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公开(公告)号：US11289462B2
公开(公告)日：2022-03-29
申请号：US16866027
申请日：2020-05-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Doyoung Kwag , Byungchul Kim , Eunhye Kim , Sangmoo Park , Minsub Oh , Dongyeob Lee , Yoonsuk Lee
Abstract: A display module is provided. The display module includes: a substrate; a thin film transistor (TFT) layer formed on one surface of the substrate; and a plurality of micro LEDs disposed on the TFT layer. The plurality of micro LEDs are transferred from a transfer substrate to the TFT layer by a laser beam radiated to the transfer substrate through openings of a mask. The openings correspond to regions in which the respective micro LEDs of the transfer substrate are arranged and the openings correspond to a width, a length, or a unit area of each of the micro LEDs.
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公开(公告)号：US11063026B2
公开(公告)日：2021-07-13
申请号：US16808558
申请日：2020-03-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Eunhye Kim , Doyoung Kwag , Byungchul Kim , Sangmoo Park , Minsub Oh , Dongyeob Lee , Yoonsuk Lee
IPC: H01L25/075 , H01L33/62
Abstract: A method of manufacturing a display module is provided. The method may include providing a substrate including a pixel region on which a plurality of electrodes are disposed and a peripheral region that is a region other than the pixel region on the substrate; forming an adhesive layer on the pixel region of the substrate; transferring a plurality of micro light emitting diodes (LEDs) onto the adhesive layer; pre-curing the adhesive layer to shift the adhesive layer on the pixel region to the peripheral region; and bonding the plurality of micro LEDs to the plurality of electrodes.
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公开(公告)号：US20200335659A1
公开(公告)日：2020-10-22
申请号：US16850645
申请日：2020-04-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sangmoo PARK , Minsub Oh , Doyoung Kwag , Byungchul Kim , Eunhye Kim , Dongyeob Lee , Yoonsuk Lee
IPC: H01L33/00 , H01L25/075 , H01L33/24
Abstract: A light-emitting diode (LED) transferring method is provided. The LED transferring method includes disposing a transfer substrate, on which a plurality of LEDs of different colors are sequentially arranged in at least one row or at least one column, between a target substrate and a laser oscillator, and simultaneously transferring the plurality of LEDs from the transfer substrate to predetermined points of the target substrate by radiating a laser beam toward the target substrate from the laser oscillator.
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公开(公告)号：US10347985B2
公开(公告)日：2019-07-09
申请号：US15685363
申请日：2017-08-24
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyunjin Kim , Kwanghyun Baek , Byungchul Kim , Jungmin Park , Youngju Lee , Sungchul Park
Abstract: An electronic device is provided that includes a circuit board received in the electronic device and in which at least one board is layered, a communication module disposed at one surface of the circuit board and electrically connected to the circuit board, an antenna electrically connected to the communication module, and a metal structure whose one surface is separated from the other surface of the circuit board to form a space within the electronic device by enclosing the circuit board and in which at least one aperture is formed at one side thereof.
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Patent Agency Ranking
公开(公告)号：US11953983B2
公开(公告)日：2024-04-09
申请号：US17885216
申请日：2022-08-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Byungchul Kim , Kiseok Kim , Mingyu Kim , Jaemin Oh , Sanghyun Lee
IPC: G06F11/00 , G06F9/4401 , G06F11/07
CPC classification number: G06F11/0793 , G06F9/441 , G06F11/073
Abstract: The present disclosure refers to apparatuses and methods for initializing electronic devices. An electronic device according to various embodiments includes a memory, and a processor operatively connected to the memory. The processor is configured to record, in the memory, software binaries received from an external device during a download mode. The processor is further configured to, when the download mode has ended, perform booting in a normal mode using a bootloader based on a determination indicating that a predetermined software binary is present among the software binaries recorded in the memory, and perform booting in a recovery mode using the bootloader based on the determination indicating that the predetermined software binary is absent from among the software binaries recorded in the memory.
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公开(公告)号：US11695092B2
公开(公告)日：2023-07-04
申请号：US17674520
申请日：2022-02-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yoonsuk Lee , Sangmoo Park , Doyoung Kwag , Byungchul Kim , Eunhye Kim , Minsub Oh , Dongyeob Lee
CPC classification number: H01L33/0095 , H01L33/62
Abstract: A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a relay substrate having at least one micro LED; a mask having openings corresponding to a position of the at least one micro LED; a first laser configured to irradiate a first laser light having a first wavelength to the mask; a second laser configured to irradiate a second laser light having a second wavelength different from the first wavelength to the mask; and a processor configured to: control the at least one micro LED to contact a coupling layer of a target substrate, and based on the coupling layer contacting the at least one micro LED, control the first laser to irradiate the first laser light toward the at least one micro LED, and subsequently control the second laser to irradiate the second laser light toward the at least one micro LED.
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公开(公告)号：US11450652B2
公开(公告)日：2022-09-20
申请号：US16882914
申请日：2020-05-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Doyoung Kwag , Byungchul Kim , Sangmoo Park , Minsub Oh
IPC: H01L25/16 , H01L33/50 , H01L25/075
Abstract: A micro LED transferring method is provided. The transferring method includes selectively applying a color conversion material to a mono-color substrate, the mono-color substrate including first micro LEDs in a first color; obtaining a multi-color substrate based on a result of the applying, the multi-color substrate including the first micro LEDs in the first color and second micro LEDs in a second color different from the first color; and irradiating a laser beam toward the multi-color substrate to transfer the first micro LEDs and the second micro LEDs to a target substrate.
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公开(公告)号：US11387384B2
公开(公告)日：2022-07-12
申请号：US16850645
申请日：2020-04-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sangmoo Park , Minsub Oh , Doyoung Kwag , Byungchul Kim , Eunhye Kim , Dongyeob Lee , Yoonsuk Lee
IPC: H01L33/00 , H01L33/24 , H01L25/075
Abstract: A light-emitting diode (LED) transferring method is provided. The LED transferring method includes disposing a transfer substrate, on which a plurality of LEDs of different colors are sequentially arranged in at least one row or at least one column, between a target substrate and a laser oscillator, and simultaneously transferring the plurality of LEDs from the transfer substrate to predetermined points of the target substrate by radiating a laser beam toward the target substrate from the laser oscillator.
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公开(公告)号：US11240676B2
公开(公告)日：2022-02-01
申请号：US16641463
申请日：2018-09-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jungmin Park , Byungchul Kim , Youngju Lee , Dongkyu Choi , Junghwan Choi , Seungku Han
Abstract: The present disclosure relates to a communication technique for the convergence of IoT technology and a 5G communication system for supporting a higher data transfer rate than a 4G system, and a system therefor. The present disclosure can be applied to intelligent services (e.g., smart homes, smart buildings, smart cities, smart or connected cars, health care, digital education, retail business, and services associated with security and safety) on the basis of 5G communication technology and IoT-related technology. Disclosed is an analysis method and apparatus for performing an analysis procedure for network design at an improved speed while maintaining accuracy and reliability.
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