公开(公告)号：US11594499B2

公开(公告)日：2023-02-28

申请号：US17203007

申请日：2021-03-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeongkwon Ko ,  Un-Byoung Kang ,  Jaekyung Yoo ,  Teak Hoon Lee

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H01L23/13

Abstract: A semiconductor package including a package substrate, a connection substrate on the package substrate and having on a lower corner of the connection substrate a recession that faces a top surface of the package substrate, a semiconductor chip on the connection substrate, a plurality of first connection terminals connecting the connection substrate to the semiconductor chip, and a plurality of second connection terminals connecting the package substrate to the connection substrate. The recession is laterally spaced apart from the second connection terminals.

公开(公告)号：US11538792B2

公开(公告)日：2022-12-27

申请号：US17140241

申请日：2021-01-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaekyung Yoo ,  Jayeon Lee ,  Jae-eun Lee ,  Yeongkwon Ko ,  Jin-woo Park ,  Teak Hoon Lee

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/13 ,  H01L23/498 ,  H01L25/00

Abstract: Disclosed are semiconductor packages and/or methods of fabricating the same. The semiconductor package comprises a package substrate, a first semiconductor chip mounted on the package substrate, a second semiconductor chip mounted on a top surface of the first semiconductor chip, and a first under-fill layer that fills a space between the package substrate and the first semiconductor chip. The package substrate includes a cavity in the package substrate, and a first vent hole that extends from a top surface of the package substrate and is in fluid communication with the cavity. The first under-fill layer extends along the first vent hole to fill the cavity.