公开(公告)号：US20240105703A1

公开(公告)日：2024-03-28

申请号：US18322795

申请日：2023-05-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyun Lim ,  Kwangjin Lee ,  Hyunjong Moon ,  Inho Choi

IPC: H01L25/18 ,  G06K19/073 ,  G06V40/13 ,  H01L23/00 ,  H01L23/538 ,  H01L25/00

CPC classification number: H01L25/18 ,  G06K19/07354 ,  G06V40/1306 ,  G06V40/1329 ,  H01L23/5388 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L25/50 ,  H01L24/16 ,  H01L24/73 ,  H01L24/84 ,  H01L2224/16145 ,  H01L2224/37013 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40101 ,  H01L2224/40106 ,  H01L2224/40157 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/41051 ,  H01L2224/41176 ,  H01L2224/73205 ,  H01L2224/84005 ,  H01L2924/01039 ,  H01L2924/0665

Abstract: A fingerprint sensor package includes: a first substrate including a core insulating layer including a first surface and a second surface and a through-hole, a first bonding pad on the second surface, and an external connection pad between an edge of the second surface and the first bonding pad; a second substrate in the through-hole and including a third surface and a fourth surface, and including first sensing patterns on the third surface, spaced apart in a first direction, and extending in a second direction, second sensing patterns spaced apart from each other in the second direction and extending in the first direction, and a second bonding pad on the fourth surface; a conductive support electrically connecting the first bonding pad and the second bonding pad and supporting the first substrate and the second substrate; a controller chip on the second substrate; and a molding layer on the second surface.

公开(公告)号：US11538268B2

公开(公告)日：2022-12-27

申请号：US17500434

申请日：2021-10-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyun Lim ,  Younghwan Park ,  Kwangjin Lee ,  Inho Choi ,  Hyuntaek Choi

IPC: G06V40/13

Abstract: A fingerprint sensor package includes a package substrate including an upper surface in which a sensing region and a peripheral region surrounding the sensing region are defined, and a lower surface facing the upper surface; a plurality of first sensing patterns located are arranged in the sensing region, are apart from each other in a first direction, and extend in a second direction crossing the first direction; a plurality of second sensing patterns that are arranged in the sensing region, are apart from each other in the second direction, and extend in the first direction; a coating member covering the sensing region; an upper ground pattern in the peripheral region and apart from the coating member to surround the coating member in the first and second directions; and a controller chip on the lower surface of the package substrate; and a plurality of capacitors.