公开(公告)号：US20250149777A1

公开(公告)日：2025-05-08

申请号：US19018406

申请日：2025-01-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngjoon LIM ,  Haeyeon KIM ,  Shinho YOON ,  Soonho HWANG

IPC: H01Q1/24 ,  H01Q1/42 ,  H01Q9/04 ,  H01Q21/08

Abstract: An electronic device is provided. The electronic device includes a first frame, a first opening formed in a first area of the first frame, a first antenna module, a cover that includes a first dielectric material and a second dielectric material and is disposed in the first area of the first frame, and a first wireless communication circuit. The first dielectric material includes an engagement groove, and the second dielectric material includes a protrusion corresponding to the engagement groove. The first dielectric material and the second dielectric material may come into contact as the protrusion of the second dielectric material engages with the engagement groove of the first dielectric material.

公开(公告)号：US20250149776A1

公开(公告)日：2025-05-08

申请号：US18977272

申请日：2024-12-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungkoo PARK ,  Seunghwan KIM ,  Haeyeon KIM ,  Hojung NAM ,  Kyungjae LEE ,  Kookjoo LEE ,  Jaebong CHUN ,  Soonho HWANG

IPC: H01Q1/24 ,  H01Q5/30 ,  H03H11/28 ,  H04M1/02

Abstract: An electronic device is provided. The electronic device includes a hinge module, a first housing having at least a portion coupled to a first side of the hinge module, a printed circuit board which is disposed inside the first housing and includes a wireless communication module, a processor, and a ground, and a second housing having at least a portion coupled to a second side of the hinge module and configured to be unfoldable and foldable with respect to the first housing using the hinge module, wherein the first housing includes a first conductive portion, a second conductive portion, and a third conductive portion which are electrically connected to the wireless communication module, a first non-conductive portion disposed between the first conductive portion and the third conductive portion, and a second non-conductive portion disposed between the second conductive portion and the third conductive portion, wherein the third conductive portion is configured to be electrically connected to a first matching circuit through a first point, wherein the first matching circuit is configured to be electrically connected to the processor through a first electrical path, wherein the processor is configured to control an impedance of the first matching circuit to correspond to a first impedance while the first conductive portion operates to radiate signals in a first frequency band and the second conductive portion operates to radiate signals in the first frequency band, and wherein the processor is further configured to control an impedance of the first matching circuit to correspond to a second impedance while the first conductive portion operates to radiate signals in a second frequency band and the second conductive portion operates to radiate signals in the second frequency band.

公开(公告)号：US20240222850A1

公开(公告)日：2024-07-04

申请号：US18609428

申请日：2024-03-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongjun OH ,  Taeik KIM ,  Haeyeon KIM ,  Sehyun PARK ,  Shinho YOON ,  Jonghyuck LEE

IPC: H01Q1/24 ,  H01Q5/328 ,  H01Q5/385 ,  H01Q21/28 ,  H04B1/40 ,  H04M1/02

CPC classification number: H01Q1/243 ,  H01Q5/328 ,  H01Q5/385 ,  H01Q21/28 ,  H04B1/40 ,  H04M1/0216 ,  H04M1/0268 ,  H04M1/0277

Abstract: An electronic device according to an embodiment may include a first housing structure, a second housing structure, and a foldable housing structure for connecting the first housing structure and the second housing structure. The first housing structure and the second housing structure may include a front plate for interconnecting front surfaces with a flexible display, a rear plate which is an opposite surface to the front plate, a side member which surrounds a space between the front plate and the rear plate, and includes at least in part a conductive portion and an insulating portion, a communication circuit and at least one switch electrically connected to the communication circuit. Other various embodiments are possible.

公开(公告)号：US20230092046A1

公开(公告)日：2023-03-23

申请号：US17994147

申请日：2022-11-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngjoon LIM ,  Haeyeon KIM ,  Shinho YOON ,  Soonho HWANG

IPC: H01Q1/24 ,  H01Q9/04 ,  H01Q21/08 ,  H01Q1/42

Abstract: An electronic device is provided. The electronic device includes a first frame, a first opening formed in a first area of the first frame, a first antenna module, a cover that includes a first dielectric material and a second dielectric material and is disposed in the first area of the first frame, and a first wireless communication circuit. The first dielectric material includes an engagement groove, and the second dielectric material includes a protrusion corresponding to the engagement groove. The first dielectric material and the second dielectric material may come into contact as the protrusion of the second dielectric material engages with the engagement groove of the first dielectric material.

公开(公告)号：US20220337276A1

公开(公告)日：2022-10-20

申请号：US17859273

申请日：2022-07-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taeyun LEE ,  Yongyoun KIM ,  Haeyeon KIM ,  Taekyung LEE ,  Dongil YANG ,  Hyoseok NA ,  Soyoung LEE

IPC: H04B1/16 ,  H05K5/00 ,  H05K5/02 ,  H05K1/11 ,  H05K1/02 ,  H05K7/14

Abstract: In an embodiment, an electronic device may include a housing including a hinge module, a first housing, and second housing. The first and second housings are rotatably coupled to each other via the hinge module to be in a folded state or an unfolded state. The electronic device may further include a flexible display, at least one conductive pattern disposed in the first housing, at least one conductor disposed at a position in the second housing corresponding to the at least one conductive pattern such that the at least one conductor is capacitively coupled to the conductive pattern when the electronic device is in the folded state, and a wireless communication circuit electrically connected to the at least one conductive pattern in the first housing. Other embodiments are also possible.

公开(公告)号：US20220115768A1

公开(公告)日：2022-04-14

申请号：US17431861

申请日：2020-02-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongjun OH ,  Taeik KIM ,  Haeyeon KIM ,  Sehyun PARK ,  Shinho YOON ,  Jonghyuck LEE

IPC: H01Q1/24 ,  H01Q21/28 ,  H01Q5/328 ,  H01Q5/385 ,  H04B1/40 ,  H04M1/02

Abstract: An electronic device is provided. The electronic device includes a first housing structure, a second housing structure, and a foldable housing structure for connecting the first housing structure and the second housing structure. The first housing structure and the second housing structure may include a front plate for interconnecting front surfaces with a flexible display, a rear plate which is an opposite surface to the front plate, a side member which surrounds a space between the front plate and the rear plate, and includes at least in part a conductive portion and an insulating portion, a communication circuit and at least one switch electrically connected to the communication circuit.