公开(公告)号：US20200227382A1

公开(公告)日：2020-07-16

申请号：US16835793

申请日：2020-03-31

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： David AUCHERE ,  Asma HAJJI ,  Fabien QUERCIA ,  Jerome LOPEZ

IPC: H01L23/00 ,  H01L23/552 ,  H01L23/31

Abstract: An electrical connection wire connects an electrical connection pad of an electrical chip and an electrical connection pad of a carrier substrate to which the electronic chip is mounted. A dielectric layer surrounds at least the bonding wire. The dielectric layer may be a dielectric sheath or a hardened liquid dielectric material. A dielectric material may also cover at least a portion of the electrical chip and carrier substrate. A liquid electrically conductive material is deposited and hardened to form a local conductive shield surrounding the dielectric layer at the bonding wire.

公开(公告)号：US20190214274A1

公开(公告)日：2019-07-11

申请号：US16240220

申请日：2019-01-04

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： David AUCHERE

IPC: H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L25/065 ,  H01L23/498 ,  H05K1/11 ,  H01L23/31

CPC classification number: H01L21/486 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49827 ,  H01L24/17 ,  H01L25/0655 ,  H01L2224/73103 ,  H05K1/113 ,  H05K2201/09563

Abstract: An insulating spacer provides electrical connection between first contacts of a package for an electronic chip and second contacts of a connector board. The insulating spacer includes conductive vias having rectilinear axes parallel to one another which extend between the first and second contacts. The package for an electronic chip is mounted to one side of the insulating spacer and the connector board is mounted to an opposite side of the insulating spacer.

公开(公告)号：US20150103489A1

公开(公告)日：2015-04-16

申请号：US14512214

申请日：2014-10-10

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： David AUCHERE ,  Yvon IMBS

IPC: H05K7/20 ,  H05K1/14 ,  H05K1/11

CPC classification number: H05K7/20 ,  H01L23/473 ,  H01L23/49816 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/73204 ,  H05K1/0201 ,  H05K1/0203 ,  H05K1/111 ,  H05K1/14 ,  H05K1/181 ,  H05K2201/064 ,  H01L2924/00014

Abstract: An electronic device includes a substrate wafer made of an insulating material and having an electrical connection network. An integrated circuit chip is mounted to a top side of the substrate wafer. The substrate wafer contains an internal duct. The duct is formed by a covered trench located in the top side of the substrate wafer. The trench contains a thermally conductive material, for example being a fluid. Openings in the top side of the substrate wafer that are offset from the trench permit the making of an electrical connection between the integrated circuit and the electrical connection network.

Abstract translation: 电子设备包括由绝缘材料制成并具有电连接网络的衬底晶片。 集成电路芯片安装在基板晶片的顶侧。 衬底晶片包含内部管道。 导管由位于基板晶片顶侧的覆盖沟槽形成。 沟槽包含导热材料，例如是流体。 偏离沟槽的衬底晶片顶部的开口允许在集成电路和电连接网络之间形成电连接。