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公开(公告)号：US11137299B2
公开(公告)日：2021-10-05
申请号：US16019092
申请日：2018-06-26
Applicant: STMicroelectronics S.r.l.
Inventor： Mohammad Abbasi Gavarti , Daniele Caltabiano , Francesco Braghin
Abstract: A microelectromechanical transducer includes a semiconductor body having first and second surfaces opposite to one another. A plurality of trenches extend in the semiconductor body from the first surface towards the second surface, including a first pair of trenches having a respective main direction of extension along a first axis, and a second pair of trenches having a respective main direction of extension along a second axis orthogonal to the first axis. A first piezoresistive sensor and a second piezoresistive sensor extend at the first surface of the semiconductor body respectively arranged between the first and second pair of trenches. The first piezoresistive sensor, the second piezoresistive sensor and the plurality of trenches form an active region. A first structural body is mechanically coupled to the first surface of the semiconductor body to form a first sealed cavity which encloses the active region.
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公开(公告)号：US11009412B2
公开(公告)日：2021-05-18
申请号：US16904123
申请日：2020-06-17
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Mohammad Abbasi Gavarti , Daniele Caltabiano , Andrea Picco , Anna Angela Pomarico , Giuditta Roselli , Francesco Braghin
Abstract: A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer is arranged between the front surface of the sensor die and the bottom surface of the cap die, patterned to define a groove traversing its entire thickness along the vertical direction; the piezoresistive elements are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied to the front surface of the cap die and/or bottom surface of the sensor die along the vertical direction into a planar stress distribution at the groove, acting in the horizontal plane.
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公开(公告)号：US10910500B2
公开(公告)日：2021-02-02
申请号：US15895513
申请日：2018-02-13
Applicant: STMicroelectronics S.r.l.
Inventor： Mohammad Abbasi Gavarti , Daniele Caltabiano , Marco Omar Ghidoni
Abstract: In an embodiment of the present invention, a load sensor package includes a housing having a cap, a column, a peripheral structure, and a base. The base includes a major surface configured to mount a stress sensor, while the cap includes a cap major surface configured to receive a load to be measured. The column is configured to transfer a predetermined fraction of the load to be measured to the base through the stress sensor. The peripheral structure is configured to transfer the remaining fraction of the load to be measured to the base.
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公开(公告)号：US20190257703A1
公开(公告)日：2019-08-22
申请号：US15899204
申请日：2018-02-19
Applicant: STMicroelectronics S.r.l.
Inventor： Daniele Caltabiano
Abstract: A semiconductor device includes a strain gauge on a substrate, the strain gauge configured to measure a stress of the substrate; and a temperature sensor disposed within the substrate, the temperature sensor being decoupled from the stress of the substrate.
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15.发明申请公开(公告)号：US20190088614A1
公开(公告)日：2019-03-21
申请号：US16124922
申请日：2018-09-07
Applicant: STMicroelectronics S.r.l.
Inventor： Daniele Caltabiano , Agatino Minotti
Abstract: A microelectronic device includes a chip housing a functional part and carrying first electrical contact regions in electrical connection with the functional part through first protected connections extending over or in the chip. A substrate has a first contact area and a second contact area, which is remote from the first contact area. The first contact area carries second electrical contact regions, and the second contact area carries external connection regions. The second contact regions and the external connection regions are in mutual electrical connection through second protected connections extending over or in the substrate. A protection-ring structure surrounds the first and second electrical contact regions and delimits a first chamber closed with respect to the outside. The first electrical contact regions and the second electrical contact regions are in mutual electrical contact.
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Patent Agency Ranking
公开(公告)号：US20180052066A1
公开(公告)日：2018-02-22
申请号：US15783894
申请日：2017-10-13
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Alberto Pagani , Bruno Murari , Marco Ferrera , Domenico Giusti , Daniele Caltabiano
Abstract: A pressure sensor with double measuring scale includes: a flexible body designed to undergo deflection as a function of a the pressure; piezoresistive transducers for detecting the deflection; a first focusing region designed to concentrate, during a first operating condition, a first value of the pressure in a first portion of the flexible body so as to generate a deflection of the first portion of the flexible body; and a second focusing region designed to concentrate, during a second operating condition, a second value of said pressure in a second portion of the flexible body so as to generate a deflection of the second portion of the flexible body. The piezoresistive transducers correlate the deflection of the first portion of the flexible body to the first pressure value and the deflection of the second portion of the flexible body to the second pressure value.
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公开(公告)号：US10782196B2
公开(公告)日：2020-09-22
申请号：US15899204
申请日：2018-02-19
Applicant: STMicroelectronics S.r.l.
Inventor： Daniele Caltabiano
IPC: G01L1/22 , G01B7/16 , G01D5/16 , G01L1/04 , G01L1/06 , G01L1/18 , G01L19/00 , G01L9/04 , G01L9/00
Abstract: A semiconductor device includes a strain gauge on a substrate, the strain gauge configured to measure a stress of the substrate; and a temperature sensor disposed within the substrate, the temperature sensor being decoupled from the stress of the substrate.
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公开(公告)号：US10724909B2
公开(公告)日：2020-07-28
申请号：US15894770
申请日：2018-02-12
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Mohammad Abbasi Gavarti , Daniele Caltabiano , Andrea Picco , Anna Angela Pomarico , Giuditta Roselli , Francesco Braghin
Abstract: A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer is arranged between the front surface of the sensor die and the bottom surface of the cap die, patterned to define a groove traversing its entire thickness along the vertical direction; the piezoresistive elements are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied to the front surface of the cap die and/or bottom surface of the sensor die along the vertical direction into a planar stress distribution at the groove, acting in the horizontal plane.
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公开(公告)号：US10345161B2
公开(公告)日：2019-07-09
申请号：US15464869
申请日：2017-03-21
Applicant: STMicroelectronics S.r.l.
Inventor： Daniele Caltabiano , Mohammad Abbasi Gavarti , Bruno Murari , Roberto Brioschi , Domenico Giusti
Abstract: A load-sensing device is arranged in a package forming a chamber. The package has a deformable substrate configured, in use, to be deformed by an external force. A sensor unit is positioned in direct contact with the deformable substrate and is configured to detect deformations of the deformable substrate. An elastic element within of the chamber is arranged to act between the package and the sensor unit to generate, on the sensor unit, a force keeping the sensor unit in contact with the deformable substrate. The deformable substrate may be a base of the package, and the elastic element may be a metal lamina arranged between the lid of the package and the sensor unit. The sensor unit may be a semiconductor die integrating piezoresistors.
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20.发明申请公开(公告)号：US20180372564A1
公开(公告)日：2018-12-27
申请号：US16019092
申请日：2018-06-26
Applicant: STMicroelectronics S.r.l.
Inventor： Mohammad Abbasi Gavarti , Daniele Caltabiano , Francesco Braghin
IPC: G01L1/18
Abstract: A microelectromechanical transducer includes a semiconductor body having first and second surfaces opposite to one another. A plurality of trenches extend in the semiconductor body from the first surface towards the second surface, including a first pair of trenches having a respective main direction of extension along a first axis, and a second pair of trenches having a respective main direction of extension along a second axis orthogonal to the first axis. A first piezoresistive sensor and a second piezoresistive sensor extend at the first surface of the semiconductor body respectively arranged between the first and second pair of trenches. The first piezoresistive sensor, the second piezoresistive sensor and the plurality of trenches form an active region. A first structural body is mechanically coupled to the first surface of the semiconductor body to form a first sealed cavity which encloses the active region.
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