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公开(公告)号：US20170343430A1
公开(公告)日：2017-11-30
申请号：US15464869
申请日：2017-03-21
Applicant: STMicroelectronics S.r.l.
Inventor： Daniele Caltabiano , Mohammad Abbasi Gavarti , Bruno Murari , Roberto Brioschi , Domenico Giusti
IPC: G01L1/18
CPC classification number: G01L1/18 , G01L1/04 , G01L9/0041
Abstract: A load-sensing device is arranged in a package forming a chamber. The package has a deformable substrate configured, in use, to be deformed by an external force. A sensor unit is positioned in direct contact with the deformable substrate and is configured to detect deformations of the deformable substrate. An elastic element within of the chamber is arranged to act between the package and the sensor unit to generate, on the sensor unit, a force keeping the sensor unit in contact with the deformable substrate. The deformable substrate may be a base of the package, and the elastic element may be a metal lamina arranged between the lid of the package and the sensor unit. The sensor unit may be a semiconductor die integrating piezoresistors.
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公开(公告)号：US09357635B2
公开(公告)日：2016-05-31
申请号：US14981056
申请日：2015-12-28
Applicant: STMicroelectronics, Inc. , STMicroelectronics S.r.l. , STMicroelectronics Asia Pacific Pte Ltd
Inventor： Simon Dodd , Joe Scheffelin , Dana Gruenbacher , Roberto Brioschi , Teck Khim Neo , Dave Hunt , Faiz Sherman
IPC: B41J2/14 , B41J2/175 , B05B1/14 , B32B38/04 , B32B38/14 , B32B37/00 , H05K1/02 , H05K1/09 , H05K3/30
CPC classification number: B41J2/1623 , B05B1/14 , B05B11/0054 , B05B15/40 , B41J2/14024 , B41J2/14145 , B41J2/1433 , B41J2/162 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/83 , H01L24/85 , H01L24/97 , H01L41/1132 , H01L2224/2732 , H01L2224/29011 , H01L2224/29013 , H01L2224/2919 , H01L2224/32225 , H01L2224/48096 , H01L2224/48097 , H01L2224/48106 , H01L2224/48227 , H01L2224/73265 , H01L2224/83192 , H01L2224/838 , H01L2224/83862 , H01L2224/83874 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/19106 , H05K1/0272 , H05K1/09 , H05K1/181 , H05K3/305 , H05K2201/10083 , H05K2201/10515 , H05K2201/10545 , Y02P70/613 , Y10T156/1089 , H01L2224/83 , H01L2224/85 , H01L2224/45099 , H01L2924/00
Abstract: Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instances, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.
Abstract translation: 实施例涉及微流体补充盒及其组装方法。 微流体补充盒包括微流体递送构件，其包括用于过滤通过其中的流体的过滤器。 过滤器可以被配置为阻挡高于阈值尺寸的颗粒以防止喷嘴中的堵塞。 例如，具有大于喷嘴直径的尺寸的颗粒可阻挡或减少通过喷嘴的流体流动。
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公开(公告)号：US20160107446A1
公开(公告)日：2016-04-21
申请号：US14981056
申请日：2015-12-28
Applicant: STMicroelectronics, Inc. , STMicroelectronics S.r.l. , STMicroelectronics Asia Pacific Pte Ltd
Inventor： Simon Dodd , Joe Scheffelin , Dana Gruenbacher , Roberto Brioschi , Teck Khim Neo , Dave Hunt , Faiz Sherman
IPC: B41J2/16
CPC classification number: B41J2/1623 , B05B1/14 , B05B11/0054 , B05B15/40 , B41J2/14024 , B41J2/14145 , B41J2/1433 , B41J2/162 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/83 , H01L24/85 , H01L24/97 , H01L41/1132 , H01L2224/2732 , H01L2224/29011 , H01L2224/29013 , H01L2224/2919 , H01L2224/32225 , H01L2224/48096 , H01L2224/48097 , H01L2224/48106 , H01L2224/48227 , H01L2224/73265 , H01L2224/83192 , H01L2224/838 , H01L2224/83862 , H01L2224/83874 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/19106 , H05K1/0272 , H05K1/09 , H05K1/181 , H05K3/305 , H05K2201/10083 , H05K2201/10515 , H05K2201/10545 , Y02P70/613 , Y10T156/1089 , H01L2224/83 , H01L2224/85 , H01L2224/45099 , H01L2924/00
Abstract: Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instances, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.
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公开(公告)号：US11622183B2
公开(公告)日：2023-04-04
申请号：US17204613
申请日：2021-03-17
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS (MALTA) LTD
Inventor： Roberto Brioschi , Paul Anthony Barbara
Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.
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公开(公告)号：US10345161B2
公开(公告)日：2019-07-09
申请号：US15464869
申请日：2017-03-21
Applicant: STMicroelectronics S.r.l.
Inventor： Daniele Caltabiano , Mohammad Abbasi Gavarti , Bruno Murari , Roberto Brioschi , Domenico Giusti
Abstract: A load-sensing device is arranged in a package forming a chamber. The package has a deformable substrate configured, in use, to be deformed by an external force. A sensor unit is positioned in direct contact with the deformable substrate and is configured to detect deformations of the deformable substrate. An elastic element within of the chamber is arranged to act between the package and the sensor unit to generate, on the sensor unit, a force keeping the sensor unit in contact with the deformable substrate. The deformable substrate may be a base of the package, and the elastic element may be a metal lamina arranged between the lid of the package and the sensor unit. The sensor unit may be a semiconductor die integrating piezoresistors.
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Patent Agency Ranking
公开(公告)号：US09561657B2
公开(公告)日：2017-02-07
申请号：US15138997
申请日：2016-04-26
Applicant: STMicroelectronics, Inc. , STMicroelectronics S.r.l. , STMicroelectronics Asia Pacific Pte Ltd
Inventor： Simon Dodd , Joe Scheffelin , Dana Gruenbacher , Roberto Brioschi , Teck Khim Neo , Dave Hunt , Faiz Sherman
IPC: B41J2/14 , B41J2/175 , B41J2/16 , B05B15/00 , B05B1/14 , H01L23/00 , H05K3/30 , H01L41/113 , H05K1/02 , H05K1/09 , B05B11/00 , H05K1/18
CPC classification number: B41J2/1623 , B05B1/14 , B05B11/0054 , B05B15/40 , B41J2/14024 , B41J2/14145 , B41J2/1433 , B41J2/162 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/83 , H01L24/85 , H01L24/97 , H01L41/1132 , H01L2224/2732 , H01L2224/29011 , H01L2224/29013 , H01L2224/2919 , H01L2224/32225 , H01L2224/48096 , H01L2224/48097 , H01L2224/48106 , H01L2224/48227 , H01L2224/73265 , H01L2224/83192 , H01L2224/838 , H01L2224/83862 , H01L2224/83874 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/19106 , H05K1/0272 , H05K1/09 , H05K1/181 , H05K3/305 , H05K2201/10083 , H05K2201/10515 , H05K2201/10545 , Y02P70/613 , Y10T156/1089 , H01L2224/83 , H01L2224/85 , H01L2224/45099 , H01L2924/00
Abstract: Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instance, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.
Abstract translation: 实施例涉及微流体补充盒及其组装方法。 微流体补充盒包括微流体递送构件，其包括用于过滤通过其中的流体的过滤器。 过滤器可以被配置为阻挡高于阈值尺寸的颗粒以防止喷嘴中的堵塞。 例如，具有大于喷嘴直径的尺寸的颗粒可以阻挡或减少通过喷嘴的流体流动。
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公开(公告)号：US20150367370A1
公开(公告)日：2015-12-24
申请号：US14310986
申请日：2014-06-20
Applicant: STMicroelectronics, Inc. , STMicroelectronics S.r.l. , STMicroelectronics Asia Pacific Pte Ltd
Inventor： Simon Dodd , Joe Scheffelin , Dana Gruenbacher , Roberto Brioschi , Teck Khim Neo , Dave Hunt , Faiz Sherman
CPC classification number: B41J2/1623 , B05B1/14 , B05B11/0054 , B05B15/40 , B41J2/14024 , B41J2/14145 , B41J2/1433 , B41J2/162 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/83 , H01L24/85 , H01L24/97 , H01L41/1132 , H01L2224/2732 , H01L2224/29011 , H01L2224/29013 , H01L2224/2919 , H01L2224/32225 , H01L2224/48096 , H01L2224/48097 , H01L2224/48106 , H01L2224/48227 , H01L2224/73265 , H01L2224/83192 , H01L2224/838 , H01L2224/83862 , H01L2224/83874 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/19106 , H05K1/0272 , H05K1/09 , H05K1/181 , H05K3/305 , H05K2201/10083 , H05K2201/10515 , H05K2201/10545 , Y02P70/613 , Y10T156/1089 , H01L2224/83 , H01L2224/85 , H01L2224/45099 , H01L2924/00
Abstract: Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instances, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.
Abstract translation: 实施例涉及微流体补充盒及其组装方法。 微流体补充盒包括微流体递送构件，其包括用于过滤通过其中的流体的过滤器。 过滤器可以被配置为阻挡高于阈值尺寸的颗粒以防止喷嘴中的堵塞。 例如，具有大于喷嘴直径的尺寸的颗粒可阻挡或减少通过喷嘴的流体流动。
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公开(公告)号：US11032629B2
公开(公告)日：2021-06-08
申请号：US16235927
申请日：2018-12-28
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS (MALTA) LTD
Inventor： Roberto Brioschi , Paul Anthony Barbara
Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.
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公开(公告)号：US20200095114A1
公开(公告)日：2020-03-26
申请号：US16560518
申请日：2019-09-04
Applicant: STMicroelectronics S.r.l.
Inventor： Anna Angela Pomarico , Giuditta Roselli , Daniele Caltabiano , Roberto Brioschi , Mohammad Abbasi Gavarti
Abstract: A device includes: a micromechanical sensing structure configured to provide an electrical detection quantity as a function of a load; and a package enclosing the micromechanical sensing structure and providing a mechanical and electrical interface with respect to an external environment. The package includes a housing structure defining a cavity housing the micromechanical sensing structure; and a package coating that coats, at least in part, the housing structure, the package coating including a mechanical interface configured to transfer, in a uniform manner, the load on the housing structure and on the micromechanical sensing structure, wherein the housing structure includes a deformable layer interposed and in contact between the micromechanical sensing structure and the package coating, and wherein the deformable layer defines a mechanical-coupling interface.
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10.发明授权公开(公告)号：US10338378B2
公开(公告)日：2019-07-02
申请号：US15264446
申请日：2016-09-13
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Roberto Brioschi
Abstract: The mirror group is formed by a monolithic frame bent along a bending line and including a first and a second supporting portions carrying, respectively, a first and a second chips forming two micromirrors made using MEMS technology. The first and second supporting portions are arranged on opposite sides of the bending line of the frame, angularly inclined with respect to each other. The mirror group is obtained by separating a shaped metal tape carrying a plurality of frames, having flexible electric connection elements. After attaching the chips, the frames are precut, bent along the bending line, and separated.
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