公开(公告)号：US20210351338A1

公开(公告)日：2021-11-11

申请号：US17137220

申请日：2020-12-29

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Domenico GIUSTI ,  Carlo Luigi PRELINI ,  Marco FERRERA ,  Carla Maria LAZZARI ,  Luca SEGHIZZI ,  Nicolo' BONI ,  Roberto CARMINATI ,  Fabio QUAGLIA

IPC: H01L41/09 ,  F16K99/00 ,  G05D7/06 ,  B01L3/00

Abstract: The MEMS actuator is formed by a substrate, which surrounds a cavity; by a deformable structure suspended on the cavity; by an actuation structure formed by a first piezoelectric region of a first piezoelectric material, supported by the deformable structure and configured to cause a deformation of the deformable structure; and by a detection structure formed by a second piezoelectric region of a second piezoelectric material, supported by the deformable structure and configured to detect the deformation of the deformable structure.

公开(公告)号：US20230381816A1

公开(公告)日：2023-11-30

申请号：US18320876

申请日：2023-05-19

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Domenico GIUSTI ,  Fabio QUAGLIA ,  Marco FERRERA

IPC: B06B1/06

CPC classification number: B06B1/0603 ,  B06B1/0629

Abstract: Micromachined pressure transducer including: a fixed body of semiconductor material, which laterally delimits a main cavity; a transduction structure, which is suspended on the main cavity and includes at least a pair of deformable structures and a movable region, which is formed by semiconductor material and is mechanically coupled to the fixed body through the deformable structures. Each deformable structure includes: a support structure of semiconductor material, which includes a first and a second beam, each of which has ends fixed respectively to the fixed body and to the movable region, the first beam being superimposed, at a distance, on the second beam; and at least one piezoelectric transduction structure, mechanically coupled to the first beam. The piezoelectric transduction structures are electrically controllable so that they cause corresponding deformations of the respective support structures and a consequent translation of the movable region along a translation direction.

公开(公告)号：US20220306456A1

公开(公告)日：2022-09-29

申请号：US17839131

申请日：2022-06-13

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Fabio QUAGLIA ,  Marco FERRERA ,  Marco DEL SARTO

IPC: B81B7/00 ,  B81C1/00

Abstract: A process for manufacturing MEMS devices, includes forming a first assembly, which comprises: a dielectric region; a redistribution region; and a plurality of unit portions. Each unit portion of the first assembly includes: a die arranged in the dielectric region; and a plurality of first and second connection elements, which extend to opposite faces of the redistribution region and are connected together by paths that extend in the redistribution region, the first connection elements being coupled to the die. The process further includes: forming a second assembly which comprises a plurality of respective unit portions, each of which includes a semiconductor portion and third connection elements; mechanically coupling the first and second assemblies so as to connect the third connection elements to corresponding second connection elements; and then removing at least part of the semiconductor portion of each unit portion of the second assembly, thus forming corresponding membranes.

公开(公告)号：US20210395075A1

公开(公告)日：2021-12-23

申请号：US17337296

申请日：2021-06-02

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Domenico GIUSTI ,  Fabio QUAGLIA

IPC: B81B7/00 ,  B81C1/00 ,  F16F15/00

Abstract: A microelectromechanical membrane transducer includes: a supporting structure; a cavity formed in the supporting structure; a membrane coupled to the supporting structure so as to cover the cavity on one side; a cantilever damper, which is fixed to the supporting structure around the perimeter of the membrane and extends towards the inside of the membrane at a distance from the membrane; and a damper piezoelectric actuator set on the cantilever damper and configured so as to bend the cantilever damper towards the membrane in response to an electrical actuation signal.

公开(公告)号：US20200024131A1

公开(公告)日：2020-01-23

申请号：US16518865

申请日：2019-07-22

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Fabio QUAGLIA ,  Marco FERRERA ,  Marco DEL SARTO

IPC: B81B7/00 ,  B81C1/00

Abstract: A process for manufacturing MEMS devices, includes forming a first assembly, which comprises: a dielectric region; a redistribution region; and a plurality of unit portions. Each unit portion of the first assembly includes: a die arranged in the dielectric region; and a plurality of first and second connection elements, which extend to opposite faces of the redistribution region and are connected together by paths that extend in the redistribution region, the first connection elements being coupled to the die. The process further includes: forming a second assembly which comprises a plurality of respective unit portions, each of which includes a semiconductor portion and third connection elements; mechanically coupling the first and second assemblies so as to connect the third connection elements to corresponding second connection elements; and then removing at least part of the semiconductor portion of each unit portion of the second assembly, thus forming corresponding membranes.