公开(公告)号：US20170233245A1

公开(公告)日：2017-08-17

申请号：US15337701

申请日：2016-10-28

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri DUQI ,  Bruno MURARI ,  Sebastiano CONTI

IPC: B81B7/00 ,  G01L9/00

CPC classification number: B81B7/0041 ,  B81B2201/0264 ,  G01L9/0054 ,  G01L9/0072 ,  G01L15/00 ,  G01L19/0645

Abstract: A packaged pressure sensor, comprising: a MEMS pressure-sensor chip; and an encapsulating layer of elastomeric material, in particular PDMS, which extends over the MEMS pressure-sensor chip and forms a means for transferring a force, applied on a surface thereof, towards the MEMS pressure-sensor chip.

公开(公告)号：US20160157023A1

公开(公告)日：2016-06-02

申请号：US15017514

申请日：2016-02-05

Applicant: Omron Corporation ,  STMICROELECTRONICS S.R.L.

Inventor： Takashi KASAI ,  Shobu SATO ,  Yuki UCHIDA ,  Igino PADOVANI ,  Filippo DAVID ,  Sebastiano CONTI

IPC: H04R19/01 ,  H04R19/00 ,  H04R1/02

CPC classification number: H04R19/04 ,  B81B3/0021 ,  H04R1/023 ,  H04R1/086 ,  H04R3/00 ,  H04R3/005 ,  H04R19/005 ,  H04R19/016 ,  H04R31/00 ,  H04R2201/003 ,  H04R2499/11

Abstract: Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.