公开(公告)号：US20170247249A1

公开(公告)日：2017-08-31

申请号：US15276613

申请日：2016-09-26

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri DUQI ,  Sebastiano CONTI ,  Lorenzo BALDO ,  Flavio Francesco VILLA

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0038 ,  B81B3/0086 ,  B81B7/0019 ,  B81B7/0061 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2207/012 ,  B81C1/00269

Abstract: A micro-electro-mechanical pressure sensor device, formed by a cap region and by a sensor region of semiconductor material. An air gap extends between the sensor region and the cap region; a buried cavity extends underneath the air gap, in the sensor region, and delimits a membrane at the bottom. A through trench extends within the sensor region and laterally delimits a sensitive portion housing the membrane, a supporting portion, and a spring portion, the spring portion connecting the sensitive portion to the supporting portion. A channel extends within the spring portion and connects the buried cavity to a face of the second region. The first air gap is fluidically connected to the outside of the device, and the buried cavity is isolated from the outside via a sealing region arranged between the sensor region and the cap region.

公开(公告)号：US20170233245A1

公开(公告)日：2017-08-17

申请号：US15337701

申请日：2016-10-28

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri DUQI ,  Bruno MURARI ,  Sebastiano CONTI

IPC: B81B7/00 ,  G01L9/00

CPC classification number: B81B7/0041 ,  B81B2201/0264 ,  G01L9/0054 ,  G01L9/0072 ,  G01L15/00 ,  G01L19/0645

Abstract: A packaged pressure sensor, comprising: a MEMS pressure-sensor chip; and an encapsulating layer of elastomeric material, in particular PDMS, which extends over the MEMS pressure-sensor chip and forms a means for transferring a force, applied on a surface thereof, towards the MEMS pressure-sensor chip.