公开(公告)号：US10961117B2

公开(公告)日：2021-03-30

申请号：US16431485

申请日：2019-06-04

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri Duqi ,  Lorenzo Baldo ,  Flavio Francesco Villa ,  Gabriele Barlocchi

IPC: B81C1/00 ,  B81B7/02

Abstract: A process for manufacturing a microelectromechanical device envisages: providing a wafer of semiconductor material; forming a buried cavity, completely contained within the wafer, and a structural layer formed by a surface portion of the wafer and suspended over the buried cavity; forming first trenches through the structural layer as far as the buried cavity, which define the suspended structure in the structural layer; filling the first trenches and the buried cavity with sacrificial material; forming a closing structure above the structural layer; removing the sacrificial material from the first trenches and from the buried cavity to release the suspended structure, the suspended structure being isolated and buried within the wafer in a buried environment formed by the first trenches and by the buried cavity.

公开(公告)号：US10906801B2

公开(公告)日：2021-02-02

申请号：US16509367

申请日：2019-07-11

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri Duqi ,  Lorenzo Baldo ,  Domenico Giusti

IPC: B81C1/00 ,  B81B7/00

Abstract: An integrated device includes: a first die; a second die coupled in a stacked way on the first die along a vertical axis; a coupling region arranged between facing surfaces of the first die and of the second die, which face one another along the vertical axis and lie in a horizontal plane orthogonal to the vertical axis, for mechanical coupling of the first and second dies; electrical-contact elements carried by the facing surfaces of the first and second dies, aligned in pairs along the vertical axis; and conductive regions arranged between the pairs of electrical-contact elements carried by the facing surfaces of the first and second dies, for their electrical coupling. Supporting elements are arranged at the facing surface of at least one of the first and second dies and elastically support respective electrical-contact elements.

公开(公告)号：US10527511B2

公开(公告)日：2020-01-07

申请号：US16101987

申请日：2018-08-13

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Enri Duqi ,  Lorenzo Baldo

IPC: G01L9/00 ,  G01L13/02

Abstract: Microelectromechanical transducer comprising a semiconductor body, four cavities buried within the semiconductor body and four membranes, each membrane being suspended over a respective cavity and being capable of being deflected by the action of a pressure external to the microelectromechanical transducer; the microelectromechanical transducer further comprising four transducer elements housed by a respective membrane and electrically coupled to one another in a Wheatstone bridge configuration to convert said external pressure into an electrical signal.

公开(公告)号：US10407301B2

公开(公告)日：2019-09-10

申请号：US15870429

申请日：2018-01-12

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri Duqi ,  Lorenzo Baldo ,  Roberto Carminati

IPC: B81B3/00 ,  B81C1/00 ,  B81B7/02

Abstract: MEMS device, in which a body made of semiconductor material contains a chamber, and a first column inside the chamber. A cap of semiconductor material is attached to the body and forms a first membrane, a first cavity and a first channel. The chamber is closed on the side of the cap. The first membrane, the first cavity, the first channel and the first column form a capacitive pressure sensor structure. The first membrane is arranged between the first cavity and the second face, the first channel extends between the first cavity and the first face or between the first cavity and the second face and the first column extends towards the first membrane and forms, along with the first membrane, plates of a first capacitor element.

公开(公告)号：US10392245B2

公开(公告)日：2019-08-27

申请号：US15591652

申请日：2017-05-10

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri Duqi ,  Lorenzo Baldo ,  Domenico Giusti

IPC: B81C1/00 ,  B81B7/00

Abstract: An integrated device includes: a first die; a second die coupled in a stacked way on the first die along a vertical axis; a coupling region arranged between facing surfaces of the first die and of the second die, which face one another along the vertical axis and lie in a horizontal plane orthogonal to the vertical axis, for mechanical coupling of the first and second dies; electrical-contact elements carried by the facing surfaces of the first and second dies, aligned in pairs along the vertical axis; and conductive regions arranged between the pairs of electrical-contact elements carried by the facing surfaces of the first and second dies, for their electrical coupling. Supporting elements are arranged at the facing surface of at least one of the first and second dies and elastically support respective electrical-contact elements.

公开(公告)号：US10125009B2

公开(公告)日：2018-11-13

申请号：US15636380

申请日：2017-06-28

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri Duqi ,  Mikel Azpeitia Urquia ,  Lorenzo Baldo

IPC: B81B3/00 ,  B81C1/00 ,  B81B7/00

Abstract: Method of manufacturing a transducer module, comprising the steps of: forming, on a substrate, a first MEMS transducer, in particular a gyroscope, and a second MEMS transducer, in particular an accelerometer, having a suspended membrane; forming, on the substrate, a conductive layer and defining the conductive layer in order to provide, simultaneously, at least one conductive strip electrically coupled to the first MEMS transducer and the membrane of the second MEMS transducer.

公开(公告)号：US10048148B2

公开(公告)日：2018-08-14

申请号：US15276617

申请日：2016-09-26

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Lorenzo Baldo ,  Sarah Zerbini ,  Enri Duqi

IPC: G01P15/08 ,  H01L21/00 ,  G01L9/00 ,  B81B3/00 ,  B81B7/00 ,  B81C1/00

Abstract: A process for manufacturing a MEMS pressure sensor having a micromechanical structure envisages: providing a wafer having a substrate of semiconductor material and a top surface; forming a buried cavity entirely contained within the substrate and separated from the top surface by a membrane suspended above the buried cavity; forming a fluidic-communication access for fluidic communication of the membrane with an external environment, set at a pressure the value of which has to be determined; forming, suspended above the membrane, a plate region made of conductive material, separated from the membrane by an empty space; and forming electrical-contact elements for electrical connection of the membrane and of the plate region, which are designed to form the plates of a sensing capacitor, the value of capacitance of which is indicative of the value of pressure to be detected. A corresponding MEMS pressure sensor having the micromechanical structure is moreover described.

公开(公告)号：US12066324B2

公开(公告)日：2024-08-20

申请号：US17530785

申请日：2021-11-19

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Michele Vaiana ,  Enri Duqi ,  Maria Eloisa Castagna

IPC: G01J1/36 ,  H01L33/46

CPC classification number: G01J1/36 ,  H01L33/465 ,  G01J2001/363

Abstract: Radiation sensor including a detection assembly and a chopper assembly, which are mechanically coupled to delimit a main cavity; and wherein the chopper assembly includes: a suspended movable structure, which extends in the main cavity; and an actuation structure, which is electrically controllable to cause a change of position of the suspended movable structure. The detection unit includes a detection structure, which faces the main cavity and includes a number of detection devices. The suspended movable structure includes a first shield of conductive material, which shields the detection devices from the radiation, the shielding of the detection devices being a function of the position of the suspended movable structure.

公开(公告)号：US10768408B2

公开(公告)日：2020-09-08

申请号：US15465019

申请日：2017-03-21

Applicant: STMicroelectronics S.r.l.

Inventor： Enri Duqi ,  Lorenzo Baldo ,  Roberto Carminati ,  Flavio Francesco Villa

IPC: G02B26/08 ,  B81C1/00 ,  B81B7/02 ,  G02B26/10 ,  H04N9/31

Abstract: A buried cavity is formed in a monolithic body to delimit a suspended membrane. A peripheral insulating region defines a supporting frame in the suspended membrane. Trenches extending through the suspended membrane define a rotatable mobile mass carried by the supporting frame. The mobile mass forms an oscillating mass, supporting arms, spring portions, and mobile electrodes that are combfingered to fixed electrodes of the supporting frame. A reflecting region is formed on top of the oscillating mass.

公开(公告)号：US10725286B2

公开(公告)日：2020-07-28

申请号：US16130765

申请日：2018-09-13

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Roberto Carminati ,  Enri Duqi ,  Sebastiano Conti

IPC: H04N3/08 ,  G02B26/08 ,  H02M1/12 ,  H02M1/15 ,  B81B7/00 ,  G02B26/10 ,  B81B3/00 ,  G05F3/26 ,  H02M1/42 ,  H02M3/335 ,  H04N9/31 ,  H02M1/00

Abstract: A micro-electro-mechanical device, wherein a platform is formed in a top substrate and is configured to turn through a rotation angle. The platform has a slit and faces a cavity. A plurality of integrated photodetectors is formed in a bottom substrate so as to detect the light through the slit and generate signals correlated to the light through the slit. The area of the slit varies with the rotation angle of the platform and causes diffraction, more or less marked as a function of the angle. The difference between the signals of two photodetectors arranged at different positions with respect to the slit yields the angle.