公开(公告)号：US11747611B2

公开(公告)日：2023-09-05

申请号：US17124027

申请日：2020-12-16

Applicant: STMicroelectronics (Research & Development) Limited ,  STMicroelectronics S.r.l.

Inventor： Christopher Townsend ,  Roberto Carminati

IPC: G02B26/10 ,  G01S17/894 ,  G02B26/08

CPC classification number: G02B26/101 ,  G01S17/894 ,  G02B26/0858

Abstract: An optical module includes an optical detector, laser emitter, and first and second support structures, each carried by a substrate. An optical layer includes first and second fixed portions carried by the support structures, a movable portion affixed between the fixed portions by a spring structure, and a lens system carried by the movable portion, the lens system including an objective lens and a beam shaping lens. The optical layer includes a comb drive with a first comb structure extending from the first fixed portion to interdigitate with a second comb structure extending from the movable portion, a third comb structure extending from the second fixed portion to interdigitate with a fourth comb structure extending from the movable portion, and actuation circuitry applying voltages to the comb structures to cause the movable portion of the optical layer to oscillate back and forth between the fixed portions.

公开(公告)号：US11673799B2

公开(公告)日：2023-06-13

申请号：US17155429

申请日：2021-01-22

Applicant: STMicroelectronics S.r.l.

Inventor： Enri Duqi ,  Nicolo′ Boni ,  Lorenzo Baldo ,  Massimiliano Merli ,  Roberto Carminati

IPC: B81C1/00 ,  H01L41/35

CPC classification number: B81C1/00158 ,  H01L41/35 ,  B81C2201/013

Abstract: To manufacture an oscillating structure, a wafer is processed by: forming torsional elastic elements; forming a mobile element connected to the torsional elastic elements; processing the first side of the wafer to form a mechanical reinforcement structure; and processing the second side of said wafer by steps of chemical etching, deposition of metal material, and/or deposition of piezoelectric material. Processing of the first side of the wafer is carried out prior to processing of the second side of the wafer so as not to damage possible sensitive structures formed on the first side of the wafer.

公开(公告)号：US11086122B2

公开(公告)日：2021-08-10

申请号：US16222027

申请日：2018-12-17

Applicant: STMicroelectronics S.r.l.

Inventor： Roberto Carminati ,  Massimiliano Merli ,  Nicolo′ Boni

IPC: G02B26/08 ,  G02B26/10 ,  B81B3/00 ,  H04N1/029 ,  H04N9/31

Abstract: A microelectromechanical device includes a body of semiconductor material, which forms a cavity, a mobile structure, and an actuation structure. The actuation structure includes at least one first deformable element which faces the cavity and is mechanically coupled to the body and to the mobile structure, and a piezoelectric-actuation system which can be controlled so as to deform the first deformable element and cause a consequent rotation of the mobile structure. The mobile structure includes a supporting region and at least one first pillar region, the first pillar region being mechanically coupled to the first deformable element, the supporting region being set on the first pillar region and overlying at least part of the first deformable element.

公开(公告)号：US10914938B2

公开(公告)日：2021-02-09

申请号：US15955107

申请日：2018-04-17

Applicant: STMicroelectronics S.r.l.

Inventor： Roberto Carminati ,  Sonia Costantini ,  Marta Carminati

IPC: G02B26/10 ,  G02B26/08

Abstract: An oscillating structure includes first and second torsional elastic elements that define an axis of rotation and a moving element that is interposed between the first and second torsional elastic elements. The moving element, the first torsional elastic element and the second torsional elastic element lie in a first plane and are not in direct contact with one another. A coupling structure mechanically couples the moving element, the first torsional elastic element and the second torsional elastic element together. The moving element, the first torsional elastic element and the second torsional elastic element lie in a second plane different from the first plane. Oscillation of the moving element occurs as a result of a twisting of the first and second torsional elastic elements.

公开(公告)号：US10473920B2

公开(公告)日：2019-11-12

申请号：US15245805

申请日：2016-08-24

Applicant: STMicroelectronics S.r.l.

Inventor： Giorgio Allegato ,  Sonia Costantini ,  Federico Vercesi ,  Roberto Carminati

IPC: G02B26/10 ,  B81C1/00 ,  G02B26/08

Abstract: Disclosed herein is a micro-electro mechanical (MEMS) device including a substrate, and a MEMS mirror stack on the substrate. A first bonding layer seals against ingress of environmental contaminants and mechanically anchors the MEMS mirror stack to the substrate. A cap layer is formed on the MEMS mirror stack. A second boding layer seals against ingress of environmental contaminants and mechanically anchors the cap layer to the MEMS mirror stack.

公开(公告)号：US10197794B2

公开(公告)日：2019-02-05

申请号：US15603614

申请日：2017-05-24

Applicant: STMicroelectronics S.r.l.

Inventor： Sonia Costantini ,  Marta Carminati ,  Daniela Angela Luisa Gatti ,  Laura Maria Castoldi ,  Roberto Carminati

IPC: G02B26/08 ,  B81B3/00 ,  B81C1/00 ,  G02B26/10

Abstract: A micro-electro-mechanical (MEMS) device is formed in a first wafer overlying and bonded to a second wafer. The first wafer includes a fixed part, a movable part, and elastic elements that elastically couple the movable part and the fixed part. The movable part further carries actuation elements configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections extending from the first wafer. The projections may, for example, be formed by selectively removing part of a semiconductor layer. A composite wafer formed by the first and second wafers is cut to form many MEMS devices.

公开(公告)号：US10175474B2

公开(公告)日：2019-01-08

申请号：US15165547

申请日：2016-05-26

Applicant: STMicroelectronics S.r.l.

Inventor： Domenico Giusti ,  Roberto Carminati ,  Massimiliano Merli

IPC: G02B26/08 ,  G02B26/10 ,  B81B3/00 ,  H04N9/31

Abstract: A micromechanical device includes a tiltable structure that is rotatable about a first rotation axis. The tiltable structure is coupled to a fixed structure through an actuation structure of a piezoelectric type. The actuation structure is formed by spring elements having a spiral shape. The spring elements each include actuation arms extending transversely to the first rotation axis. Each actuation arm carries a respective piezoelectric band of piezoelectric material. The actuation arms are divided into two sets with the piezoelectric bands thereof biased in phase opposition to obtain rotation in opposite directions of the tiltable structure about the first rotation axis.

公开(公告)号：US10113872B2

公开(公告)日：2018-10-30

申请号：US15610251

申请日：2017-05-31

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Luca Giuseppe Falorni ,  Carlo Valzasina ,  Roberto Carminati ,  Alessandro Tocchio

IPC: G01C19/00 ,  B81B3/00 ,  G01C19/5712 ,  G01C19/5733 ,  G01C19/5747

Abstract: MEMS device having a support region elastically carrying a suspended mass through first elastic elements. A tuned dynamic absorber is elastically coupled to the suspended mass and configured to dampen quadrature forces acting on the suspended mass at the natural oscillation frequency of the dynamic absorber. The tuned dynamic absorber is formed by a damping mass coupled to the suspended mass through second elastic elements. In an embodiment, the suspended mass and the damping mass are formed in a same structural layer, for example of semiconductor material, and the damping mass is surrounded by the suspended mass.

公开(公告)号：US10101578B2

公开(公告)日：2018-10-16

申请号：US15368184

申请日：2016-12-02

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Roberto Carminati ,  Enri Duqi ,  Sebastiano Conti

IPC: H04N3/08 ,  G02B26/08 ,  B81B3/00 ,  H04N9/31

Abstract: A micro-electro-mechanical device, wherein a platform is formed in a top substrate and is configured to turn through a rotation angle. The platform has a slit and faces a cavity. A plurality of integrated photodetectors is formed in a bottom substrate so as to detect the light through the slit and generate signals correlated to the light through the slit. The area of the slit varies with the rotation angle of the platform and causes diffraction, more or less marked as a function of the angle. The difference between the signals of two photodetectors arranged at different positions with respect to the slit yields the angle.

公开(公告)号：US09696157B2

公开(公告)日：2017-07-04

申请号：US14750840

申请日：2015-06-25

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Luca Giuseppe Falorni ,  Carlo Valzasina ,  Roberto Carminati ,  Alessandro Tocchio

IPC: G01C19/00 ,  G01C19/5712 ,  B81B3/00 ,  G01C19/5733 ,  G01C19/5747

CPC classification number: G01C19/5712 ,  B81B3/0018 ,  B81B3/0086 ,  B81B2201/025 ,  B81B2203/0163 ,  G01C19/5733 ,  G01C19/5747

Abstract: MEMS device having a support region elastically carrying a suspended mass through first elastic elements. A tuned dynamic absorber is elastically coupled to the suspended mass and configured to dampen quadrature forces acting on the suspended mass at the natural oscillation frequency of the dynamic absorber. The tuned dynamic absorber is formed by a damping mass coupled to the suspended mass through second elastic elements. In an embodiment, the suspended mass and the damping mass are formed in a same structural layer, for example of semiconductor material, and the damping mass is surrounded by the suspended mass.