公开(公告)号：US11894290B2

公开(公告)日：2024-02-06

申请号：US18150511

申请日：2023-01-05

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Cristiano Gianluca Stella ,  Fabio Vito Coppone ,  Francesco Salamone

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49537 ,  H01L23/3114 ,  H01L23/4952 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/49 ,  H01L2924/181

Abstract: A power device for surface mounting has a leadframe including a die-attach support and at least one first lead and one second lead. A die, of semiconductor material, is bonded to the die-attach support, and a package, of insulating material and parallelepipedal shape, surrounds the die and at least in part the die-attach support and has a package height. The first and second leads have outer portions extending outside the package, from two opposite lateral surfaces of the package. The outer portions of the leads have lead heights greater than the package height, extend throughout the height of the package, and have respective portions projecting from the first base.

公开(公告)号：US10720373B2

公开(公告)日：2020-07-21

申请号：US16370193

申请日：2019-03-29

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Francesco Salamone ,  Cristiano Gianluca Stella

IPC: H01L23/367 ,  H01L21/56 ,  H01L23/31 ,  H01L21/48 ,  H01L23/433 ,  H01L23/495 ,  H01L23/373 ,  H01L23/48 ,  H01L23/34 ,  H01L23/36 ,  H01L23/42 ,  H01L23/28

Abstract: A semiconductor power device has: a die, with a front surface and a rear surface, and with an arrangement of projecting regions on the front surface, which define between them windows arranged within which are contact regions; and a package, which houses the die inside it. A metal frame has a top surface and a bottom surface; the die is carried by the frame on the top surface; an encapsulation coating coats the frame and the die. A first insulation multilayer is arranged above the die and is formed by an upper metal layer, a lower metal layer, and an intermediate insulating layer; the lower metal layer is shaped according to an arrangement of the projecting regions and has contact projections, which extend so as to electrically contact the contact regions, and insulation regions, interposed between the contact projections, in positions corresponding to the projecting regions.

公开(公告)号：US20130285223A1

公开(公告)日：2013-10-31

申请号：US13859029

申请日：2013-04-09

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Francesco Salamone

IPC: H01L21/50 ,  H01L23/495

CPC classification number: H01L21/50 ,  H01L21/561 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/97 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A support structure includes a support cell with a support substrate, junction sacrificial portions surrounding the support substrate, and pin blocks extending from the junction sacrificial portion toward the support substrate. A semiconductor chip is mounted to the support substrate and electrically wire bonded to the pin blocks. An encapsulating body covers the chip, with the pin blocks extending from the body. A transversal groove is formed in each pin block. Surfaces of the pin block and groove are electroplated with solder material. Each pin block is sectioned at the groove to define a pin having a first end corresponding to a portion of the groove surface of the groove and a second end corresponding to the sectioned portion of the pin block that is not electroplated with solder material. Sectioning causes the separation of the chip-insulating body assembly from the junction sacrificial portions.

Abstract translation: 支撑结构包括具有支撑基板的支撑单元，围绕支撑基板的接合牺牲部分以及从接合牺牲部分向支撑基板延伸的销块。 将半导体芯片安装到支撑基板上并将电线电连接到引脚块上。 封装体覆盖芯片，引脚块从主体延伸。 在每个销块中形成横向槽。 针脚和凹槽的表面用焊料材料电镀。 每个销块在槽处被分段以限定具有对应于槽的凹槽表面的一部分的第一端的销和对应于未被焊料材料电镀的销块的截面部分的第二端。 切割导致芯片绝缘体组件与接合牺牲部分分离。