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公开(公告)号：US10425743B2
公开(公告)日：2019-09-24
申请号：US15901841
申请日：2018-02-21
Applicant: OMRON Corporation
Inventor： Takashi Kasai , Yusuke Nakagawa
Abstract: A capacitive transducer includes a substrate having an opening in a surface thereof, a back plate facing the opening in the substrate, a vibration electrode film facing the back plate across a space, the vibration electrode film being deformable to have a deformation converted into a change in capacitance between the vibration electrode film and the back plate, the vibration electrode film having a through-hole as a pressure relief hole, and a protrusion integral with and formed from the same member as the back plate, the protrusion being placeable in the pressure relief hole before the vibration electrode film deforms. The pressure relief hole and the protrusion have a gap therebetween defining an airflow channel as a pressure relief channel. The protrusion has a through-hole extending from a distal portion of the protrusion to a portion of the back plate opposite to the protrusion.
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公开(公告)号：US10405107B2
公开(公告)日：2019-09-03
申请号：US15814256
申请日：2017-11-15
Applicant: STMICROELECTRONICS S.R.L. , OMRON CORPORATION
Inventor： Takashi Kasai , Shobu Sato , Yuki Uchida , Igino Padovani , Filippo David , Sebastiano Conti
Abstract: Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.
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公开(公告)号：US10257617B2
公开(公告)日：2019-04-09
申请号：US15814256
申请日：2017-11-15
Applicant: STMICROELECTRONICS S.R.L. , OMRON CORPORATION
Inventor： Takashi Kasai , Shobu Sato , Yuki Uchida , Igino Padovani , Filippo David , Sebastiano Conti
Abstract: Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.
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公开(公告)号：US20180184211A1
公开(公告)日：2018-06-28
申请号：US15901841
申请日：2018-02-21
Applicant: OMRON Corporation
Inventor： Takashi Kasai , Yusuke Nakagawa
Abstract: A capacitive transducer includes a substrate having an opening in a surface thereof, a back plate facing the opening in the substrate, a vibration electrode film facing the back plate across a space, the vibration electrode film being deformable to have a deformation converted into a change in capacitance between the vibration electrode film and the back plate, the vibration electrode film having a through-hole as a pressure relief hole, and a protrusion integral with and formed from the same member as the back plate, the protrusion being placeable in the pressure relief hole before the vibration electrode film deforms. The pressure relief hole and the protrusion have a gap therebetween defining an airflow channel as a pressure relief channel. The protrusion has a through-hole extending from a distal portion of the protrusion to a portion of the back plate opposite to the protrusion.
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公开(公告)号：US09743195B2
公开(公告)日：2017-08-22
申请号：US15011655
申请日：2016-01-31
Applicant: OMRON Corporation
Inventor： Akihiro Okugawa , Takashi Kasai , Koji Momotani
CPC classification number: H04R19/005 , B81B2201/0257 , H04R19/04 , H04R31/006 , H04R2410/03
Abstract: An acoustic sensor adapted to convert acoustic vibration to a change in an electrostatic capacitance to detect the acoustic vibration is provided. The acoustic sensor includes a semiconductor substrate, a back plate including a fixed plate arranged to face a surface of the semiconductor substrate, and a fixed electrode film arranged on the fixed plate, and a vibrating electrode film arranged to face the back plate with a space formed therebetween. The vibrating electrode film includes a plate-like vibrating member that vibrates in response to sound pressure. The vibrating electrode film is fixed to the back plate with a fixing unit thereof including one or more fixing portions each including a fixing protruding end that is arranged on a protruding end of a leg portion protruding from an edge of the vibrating member. The vibrating member has an edge portion surrounding at least a part of the fixing protruding end.
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Patent Agency Ranking
公开(公告)号：US09674618B2
公开(公告)日：2017-06-06
申请号：US14972354
申请日：2015-12-17
Applicant: OMRON CORPORATION
Inventor： Yuki Uchida , Koji Momotani , Takashi Kasai
CPC classification number: H04R19/005 , H04R19/04 , H04R31/00 , H04R2201/003 , H04S7/00 , H04S2420/01
Abstract: An acoustic sensor is provided for improving shock resistance performance, along with a method for manufacturing the acoustic sensor. In the acoustic sensor, a fixing plate is provided by a semiconductor manufacturing process, a frame wall has a curved shape in at least a portion of the periphery of the fixing plate, the frame wall being coupled to the semiconductor substrate. A sacrifice layer removed from the inner side of the fixing plate in the manufacturing process remains at least on a portion of the inner side of the frame wall. Roughness of the remaining sacrifice layer is smaller than roughness of a sound shape reflecting structure in which a shape similar to the external shape of sound holes is repeated. Roughness of the sound shape reflecting structure is formed when removing the sacrifice layer using etching liquid supplied from the plurality of sound holes in the semiconductor manufacturing process.
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公开(公告)号：US09462364B2
公开(公告)日：2016-10-04
申请号：US14426536
申请日：2013-08-12
Applicant: OMRON Corporation
Inventor： Yuki Uchida , Takashi Kasai
Abstract: A capacitance type sensor has a substrate, a vibration electrode plate formed over the substrate, a back plate formed over the substrate so as to cover the vibration electrode plate, and a fixed electrode plate provided on the back plate so as to be opposite to the vibration electrode plate. At least one of the vibration electrode plate and the fixed electrode plate is separated into a plurality of regions, each of the plurality of regions being formed with a sensing section including the vibration electrode plate and the fixed electrode plate. A barrier electrode is provided between respective sensing sections of at least one adjacent pair of regions of the plurality of regions to prevent signal interference between the respective sensing sections.
Abstract translation: 电容式传感器具有基板，形成在基板上的振动电极板，形成在基板上的覆盖振动电极板的背板和设置在背板上的固定电极板，以与 振动电极板。 振动电极板和固定电极板中的至少一个被分离成多个区域，所述多个区域中的每个区域形成有包括振动电极板和固定电极板的感测部分。 阻挡电极设置在多个区域中的至少一个相邻的一对区域的相应感测部分之间，以防止各个感测部分之间的信号干扰。
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公开(公告)号：US20150230027A1
公开(公告)日：2015-08-13
申请号：US14426895
申请日：2013-08-12
Applicant: OMRON Corporation
Inventor： Tadashi Inoue , Takashi Kasai
IPC: H04R19/00
CPC classification number: H04R19/00 , B81B3/001 , B81B2201/0257 , B81B2203/0127 , H04R7/26 , H04R19/005 , H04R31/003 , H04R2207/021
Abstract: An acoustic transducer has a substrate having an opening in an upper surface thereof, a vibration electrode plate disposed above the substrate, and having an outer edge thereof facing the upper surface of the substrate with a gap therebetween, a fixed electrode plate facing the vibration electrode plate, and a plurality of projections protruding on a lower surface of the outer edge of the vibration electrode plate. The vibration electrode plate covers an upper side of the opening. The plurality of projections are disposed so as to not be positioned along a straight line or a curved line parallel to an edge of the opening in at least a part of one or at least two arrays formed on the lower surface of the outer edge.
Abstract translation: 声换能器具有在其上表面具有开口的基板，设置在基板上方的振动电极板，并且其外边缘面向基板的上表面，其间具有间隙，面向振动电极的固定电极板 板，以及在振动电极板的外缘的下表面上突出的多个突起。 振动电极板覆盖开口的上侧。 多个突起被设置成不沿着形成在外边缘的下表面上的一个或至少两个阵列的至少一部分中的平行于开口的边缘的直线或曲线定位。
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19.发明申请公开(公告)号：US20150043759A1
公开(公告)日：2015-02-12
申请号：US14340949
申请日：2014-07-25
Applicant: OMRON Corporation
Inventor： Momotani Koji , Takashi Kasai
CPC classification number: H04R31/006 , H04R19/005 , H04R19/04 , Y10T29/49005
Abstract: A microphone has a package, and an acoustic sensor, an under surface of which is fixed to an inner face of the package. The acoustic sensor has a substrate having a plurality of hollows penetrating the substrate from a top surface to an under surface, and a capacitor structure made by a movable electrode plate and a fixed electrode plate disposed above each of the hollows. A package sound hole is opened in the package in a position opposed to the under surface of the acoustic sensor. A dent which is communicated with each of the hollows and open below the under surface side of the substrate is formed below the under surface of the substrate. A height of the dent measured from the under surface of the substrate is equal to or less than half of a height of the hollow.
Abstract translation: 麦克风具有封装，声传感器的下表面固定在封装的内表面上。 声学传感器具有基板，其具有从上表面到下表面贯穿基板的多个中空部，以及由可动电极板和设置在每个中空部上方的固定电极板构成的电容器结构。 包装声孔在声音传感器的下表面相对的位置在包装件中打开。 在基板的下表面的下方形成有与各个中空部连通并在基板的下表面侧开口的凹部。 从基板的下表面测量的凹陷的高度等于或小于中空部的高度的一半。
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公开(公告)号：US10484798B2
公开(公告)日：2019-11-19
申请号：US15904209
申请日：2018-02-23
Applicant: Omron Corporation , STMicroelectronics S.r.l.
Inventor： Takashi Kasai , Shobu Sato , Yuki Uchida , Sebastiano Conti , Igino Padovani , Filippo David
Abstract: Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane, provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane, provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.
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