公开(公告)号：US20240145355A1

公开(公告)日：2024-05-02

申请号：US18385996

申请日：2023-11-01

Applicant: STMicroelectronics S.r.l.

Inventor： Mauro MAZZOLA

IPC: H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49575 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49541 ,  H01L24/40 ,  H01L24/48 ,  H01L2224/40245 ,  H01L2224/48247 ,  H01L2924/181

Abstract: A leadframe includes a die pad and electrically conductive leads arranged peripherally of the die pad. A semiconductor die is mounted to the die pad. The die is electrically coupled to the electrically conductive leads using an electrical coupling member applied onto the semiconductor die. The electrical coupling member includes a planar body configured to cover the semiconductor die and the electrically conductive leads. The planar body of the electrical coupling member includes strip-like, electrically conductive formations embedded in an electrically insulating material. Each strip-like, electrically conductive formation has a first end configured to contact the semiconductor die and a second end configured to contact the electrically conductive lead.

公开(公告)号：US20230245955A1

公开(公告)日：2023-08-03

申请号：US18101983

申请日：2023-01-26

Applicant: STMicroelectronics S.r.l.

Inventor： Mauro MAZZOLA ,  Fabio MARCHISI

IPC: H01L23/495 ,  B23K26/0622 ,  B23K26/21 ,  H01L23/00

CPC classification number: H01L23/4952 ,  B23K26/21 ,  B23K26/0622 ,  H01L23/49575 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247

Abstract: A semiconductor device includes an electrically conductive clip arranged in a bridge-like position between a semiconductor integrated circuit chip and an electrically conductive pad of a leadframe. The electrically conductive clip is soldered to the semiconductor integrated circuit chip and to the electrically conductive pad via soldering material applied at coupling surfaces facing towards the semiconductor integrated circuit chip and the electrically conductive pad. Prior to soldering, the clip is immobilized in the desired bridge-like position via one of welding (such as laser welding) or gluing at dedicated immobilization areas.

公开(公告)号：US20230114535A1

公开(公告)日：2023-04-13

申请号：US17959619

申请日：2022-10-04

Applicant: STMicroelectronics S.r.l.

Inventor： Matteo DE SANTA ,  Mauro MAZZOLA

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/495

Abstract: A semiconductor die and an electrically conductive ribbon are arranged on a substrate. The electrically conductive ribbon includes a roughened surface. An insulating encapsulation is molded onto the semiconductor die and the electrically conductive ribbon. The roughened surface of the electrically conductive ribbon provides a roughened coupling interface to the insulating encapsulation.

公开(公告)号：US20230031682A1

公开(公告)日：2023-02-02

申请号：US17870455

申请日：2022-07-21

Applicant: STMicroelectronics S.r.l.

Inventor： Mauro MAZZOLA

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/56

Abstract: A pre-molded substrate for semiconductor devices includes a sculptured electrically conductive (e.g., copper) laminar structure having spaces therein. The laminar structure includes one or more die pads having a first die pad surface configured to have semiconductor chips mounted thereon. A pre-mold material molded onto the laminar structure penetrates into the spaces therein and provides a laminar pre-molded substrate including the first die pad surface left exposed by the pre-mold material with the die pad(s) bordering on the pre-mold material. One or more stress-relief curved portions are provided at the periphery of one or more of the die pads. The stress-relief curved portions are configured to border on the pre-mold material over a smooth surface to effectively counter the formation of cracks in the pre-mold material as a result of the pre-molded substrate being bent.

公开(公告)号：US20240266259A1

公开(公告)日：2024-08-08

申请号：US18637906

申请日：2024-04-17

Applicant: STMicroelectronics S.r.l.

Inventor： Mauro MAZZOLA ,  Matteo DE SANTA

IPC: H01L23/495 ,  H01L21/50 ,  H01L23/00

CPC classification number: H01L23/4951 ,  H01L21/50 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/74

Abstract: In providing electrical wire-like connections between at least one semiconductor die arranged on a semiconductor die mounting area of a substrate and an array of electrically-conductive leads in the substrate, pressure force is applied to the electrically-conductive leads in the substrate during bonding the wire-like connections to the electrically-conductive leads. Such a pressure force is applied to the electrically-conductive leads in the substrate via a pair of mutually co-operating force transmitting surfaces. These surfaces include a first convex surface engaging a second concave surface.

公开(公告)号：US20220199500A1

公开(公告)日：2022-06-23

申请号：US17550925

申请日：2021-12-14

Applicant: STMicroelectronics S.r.l.

Inventor： Mauro MAZZOLA ,  Roberto TIZIANI

IPC: H01L23/495 ,  H01L21/48

Abstract: A leadframe includes a pattern of electrically-conductive formations with one or more sacrificial connection formations extending bridge-like between a pair of electrically-conductive formations. The sacrificial connection formation or formations are formed at one of the first surface and the second surface of the leadframe and have a thickness less than the leadframe thickness between the first surface and the second surface. A filling of electrically-insulating material is molded between the electrically-conductive formations of the leadframe, with electrically-insulating material molded between the connection formation(s) and the other surface of the leadframe. The sacrificial connection formation(s) counter deformation and displacement of parts during formation and pre-molding of the leadframe.

公开(公告)号：US20180374780A1

公开(公告)日：2018-12-27

申请号：US16007767

申请日：2018-06-13

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Mauro MAZZOLA ,  Matteo DE SANTA ,  Battista VITALI

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: A process for manufacturing a semiconductor flip chip package and a corresponding flip chip package. The process comprises associating conducting bump pads to a face corresponding to an active side of one or more electronic dice, flipping the one or more electronic dice so that said face corresponding to an active side of one or more electronic dies is facing a leadframe carrying contacting pads in correspondence of said conducting bump pads, bonding said contacting pads to said conducting bump pads and encasing said one or more electronic dice in a casing by a molding operation. The process includes providing a leadframe having contacting pads presenting a recessed surface in correspondence of the position of said conducting bump pads.