公开(公告)号：US20230162655A1

公开(公告)日：2023-05-25

申请号：US17823182

申请日：2022-08-30

Applicant: SAMSUNG DISPLAY CO., LTD

Inventor： YOUNGWOON CHOI ,  Sungjae Park ,  Seunghwan Park ,  Jinho Lee ,  Namjae Lim

IPC: G09G3/20 ,  G09G3/3233

CPC classification number: G09G3/2096 ,  G09G3/3233 ,  G09G3/2007 ,  G09G2300/0819 ,  G09G2300/0842 ,  G09G2330/028 ,  G09G2330/021

Abstract: A display device includes a display panel, a driving controller, and a voltage generator. The display panel includes a plurality of pixels. Each of the pixels receives a driving voltage through a first voltage line. The driving controller receives an input image signal including first to third color signals and outputs a voltage control signal for controlling a voltage level of the driving voltage based on the first to third color signals. The voltage generator provides the driving voltage to the first voltage line and determines the voltage level of the driving voltage based on the voltage control signal. The driving controller determines first to third gate-source voltages respectively corresponding to the first to third color signals and outputs the voltage control signal based on the first to third gate-source voltages.

公开(公告)号：US09755192B2

公开(公告)日：2017-09-05

申请号：US14967090

申请日：2015-12-11

Applicant: Samsung Display Co., Ltd.

Inventor： Junghwa You ,  Taeyong Kim ,  Hyojin Kim ,  Ilyoung Jeong ,  Gyoowan Han ,  Jekil Ryu ,  Jinho Lee

IPC: H01L21/00 ,  H01L51/56 ,  B23K26/38 ,  B23K26/0622 ,  B23K26/18 ,  B23K26/06 ,  B23K26/40 ,  B23K26/402 ,  H01L51/52 ,  B23K103/00

CPC classification number: H01L51/56 ,  B23K26/0608 ,  B23K26/0624 ,  B23K26/18 ,  B23K26/38 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/00 ,  B23K2103/42 ,  B23K2103/50 ,  H01L51/5253 ,  H01L2251/566

Abstract: A method of cutting a substrate includes: forming a first protective layer on a first surface of the substrate; forming a removal area where a portion of the first protective layer is removed by irradiating the first protective layer at the portion of the first protective layer with a first laser beam; and forming a cutting area by removing a portion of the substrate by irradiating the substrate with a second laser beam at the removal area, after irradiating the first protective layer with the first laser beam.

公开(公告)号：US20160315293A1

公开(公告)日：2016-10-27

申请号：US14967090

申请日：2015-12-11

Applicant: Samsung Display Co., Ltd.

Inventor： Junghwa You ,  Taeyong Kim ,  Hyojin Kim ,  Ilyoung Jeong ,  Gyoowan Han ,  Jekil Ryu ,  Jinho Lee

IPC: H01L51/56 ,  B23K26/18 ,  B23K26/0622 ,  H01L51/52 ,  B23K26/38

CPC classification number: H01L51/56 ,  B23K26/0608 ,  B23K26/0624 ,  B23K26/18 ,  B23K26/38 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/00 ,  B23K2103/42 ,  B23K2103/50 ,  H01L51/5253 ,  H01L2251/566

Abstract: A method of cutting a substrate includes: forming a first protective layer on a first surface of the substrate; forming a removal area where a portion of the first protective layer is removed by irradiating the first protective layer at the portion of the first protective layer with a first laser beam; and forming a cutting area by removing a portion of the substrate by irradiating the substrate with a second laser beam at the removal area, after irradiating the first protective layer with the first laser beam.

Abstract translation: 切割基板的方法包括：在所述基板的第一表面上形成第一保护层; 通过用第一激光束照射所述第一保护层的所述第一保护层，形成除去所述第一保护层的一部分的去除区域; 以及在用所述第一激光束照射所述第一保护层之后，通过在所述去除区域处用第二激光束照射所述基板来去除所述基板的一部分而形成切割区域。