Abstract:
A photosensitive resin composition includes an acid-labile resin of about 5 wt % to about 25 wt %, a monomer of about 5 wt % to about 10 wt %, a photoacid generator of about 5 wt % to about 10 wt %, a photoreaction accelerator of about 1 wt % to about 5 wt %, and a solvent of about 50 wt % to about 84 wt %, wherein the acid-labile resin comprises a repeating unit containing an acid group, and a protecting group configured to protect the repeating unit.