Display device and method of fabricating the same

    公开(公告)号:US11515370B2

    公开(公告)日:2022-11-29

    申请号:US17363834

    申请日:2021-06-30

    Abstract: A display device may include a display panel including a first substrate, a second substrate on the first substrate, and a light-emitting device between the first substrate and the second substrate, an input sensing portion including a sensing electrode on the second substrate and a first pad connected to the sensing electrode, a first circuit film near a side surface of the display panel adjacent to the first pad, the first circuit film including a first contact pad spaced from the first pad, a first conductive layer on the first pad, the first conductive layer being extended to the first contact pad to electrically connect the first pad to the first contact pad, and a protection layer on the first conductive layer.

    Backlight assembly and display device including the same

    公开(公告)号:US09612474B2

    公开(公告)日:2017-04-04

    申请号:US14273386

    申请日:2014-05-08

    Inventor: Si Joon Song

    Abstract: Provided are a backlight assembly and a display device including the same.The backlight assembly comprises: a housing; a plurality of light sources disposed on the housing; a plurality of optical lenses disposed on the light sources, respectively; a main reflective sheet covering an upper surface of the housing and comprising a reflective portion and a main opening which exposes each of the optical lenses; and a sub reflective sheet disposed under each of the optical lenses, wherein the sub reflective sheet comprises a body portion and a fitting portion partially separated from the body portion and is fitted to the main reflective sheet in the reflective portion.

    METHOD OF MANUFACTURING DISPLAY DEVICE AND MANUFACTURING DEVICE FOR DISPLAY DEVICE

    公开(公告)号:US20230015414A1

    公开(公告)日:2023-01-19

    申请号:US17956096

    申请日:2022-09-29

    Abstract: A method of manufacturing a display device includes: providing a first substrate, a second substrate, and a plurality of connection lines, wherein the first substrate has a base substrate, wherein the second substrate faces the first substrate, and wherein the plurality of connection lines are disposed between the base substrate and the second substrate; grinding a side surface of the base substrate, a side surface of the second substrate, and side surfaces of the plurality of connection lines; and simultaneously transferring a conductive film and laser-curing the conductive film, wherein the conductive film is transferred to the ground side surface of the base substrate, the ground side surface of the second substrate, and the ground side surfaces of the plurality of connection lines.

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