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    Display device, apparatus for manufacturing display device and method for manufacturing display device
    6.
    发明授权
    Display device, apparatus for manufacturing display device and method for manufacturing display device 有权

    公开(公告)号：US11409387B2

    公开(公告)日：2022-08-09

    申请号：US17403208

    申请日：2021-08-16

    Applicant: Samsung Display Co., LTD.

    Inventor： Eui Jeong Kang ,  Sang Hyuck Yoon ,  Seung Soo Ryu ,  Jeong Jin Park ,  Si Joon Song

    IPC: G06F3/041 ,  G06F3/044 ,  H01L27/32

    Abstract: A display device includes a display panel including display pads, display connection pads disposed on a side surface of the display panel and connected to the display pads, a touch member including touch pads disposed on a display surface perpendicular to the side surface of the display panel, and touch connection pads overlapping a top surface of the touch member and the side surface of the display panel and connected to the touch pads. The side surface of the display panel includes a first area overlapping the display connection pads, a second area overlapping the touch connection pads, and a third area which does not overlap the display connection pads and does not overlap the touch connection pads. The first area, the second area, and the third area are located on a same plane.

    Light source unit and backlight assembly having the same
    8.
    发明授权
    Light source unit and backlight assembly having the same 有权
    光源单元和背光组件具有相同的光源

    公开(公告)号：US09520386B2

    公开(公告)日：2016-12-13

    申请号：US14262438

    申请日：2014-04-25

    Applicant: Samsung Display Co., Ltd.

    Inventor： Si Joon Song ,  Hyuk Hwan Kim ,  Seok Hyun Nam ,  Byoung Dae Ye ,  Young Keun Lee

    IPC: F21S4/00 ,  F21V21/00 ,  H01L25/16 ,  F21V8/00

    CPC classification number: H01L25/167 ,  G02B6/0073 ,  G02B6/0083 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    Abstract: A method of protecting an LED chip from damage by ESD and EMI when the LED chip is housed in a light-emitting diode(s) housing package (LED package) and the LED package is mounted on a printed circuit board is provided. The method comprises a step of not including an ESD and EMI suppressing Zener diode within the combination of the printed circuit board and the LED package and of providing within the combination of the printed circuit board and the LED package a first conductive member and a spaced apart second conductive member which are electrically connected to the LED chip and which have defined between them at least one insulative ESD and/or EMI suppressing region which breaks down in its insulative properties when subjected to voltages of absolute magnitudes greater than a predetermined threshold voltage.

    Abstract translation: 提供了当LED芯片被容纳在发光二极管壳体封装（LED封装）中并且LED封装安装在印刷电路板上时，保护LED芯片免受ESD和EMI损坏的方法。 该方法包括在印刷电路板和LED封装的组合中不包括ESD和EMI抑制齐纳二极管的步骤，并且在印刷电路板和LED封装的组合内提供第一导电构件和间隔开的步骤 第二导电构件，其电连接到LED芯片，并且在它们之间限定至少一个绝缘ESD和/或EMI抑制区域，当经受大于预定阈值电压的绝对值的电压时，其绝缘性能分解。

    Display device and method of fabricating the same
    9.
    发明授权
    Display device and method of fabricating the same 有权

    公开(公告)号：US12004405B2

    公开(公告)日：2024-06-04

    申请号：US18058724

    申请日：2022-11-23

    Applicant: SAMSUNG DISPLAY CO., LTD.

    Inventor： Donghyun Lee ,  Si Joon Song

    IPC: G06F3/044 ,  G06F3/041 ,  H10K59/40 ,  H10K71/00

    CPC classification number: H10K59/40 ,  G06F3/0412 ,  G06F3/0443 ,  H10K71/00

    Abstract: A display device may include a display panel including a first substrate, a second substrate on the first substrate, and a light-emitting device between the first substrate and the second substrate, an input sensing portion including a sensing electrode on the second substrate and a first pad connected to the sensing electrode, a first circuit film near a side surface of the display panel adjacent to the first pad, the first circuit film including a first contact pad spaced from the first pad, a first conductive layer on the first pad, the first conductive layer being extended to the first contact pad to electrically connect the first pad to the first contact pad, and a protection layer on the first conductive layer.

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