-
公开(公告)号:US10801121B2
公开(公告)日:2020-10-13
申请号:US15881296
申请日:2018-01-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Hye Yeon Cha , Dong Hwan Lee , Jung Hyuk Jung , Chan Yoon , Hye Min Bang , Tae Young Kim
IPC: H01F27/28 , C25D7/00 , C25D5/02 , C25D5/10 , C25D5/16 , H01F17/00 , H01F17/04 , H01F27/29 , H01F41/04
Abstract: There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.
-
公开(公告)号:US10607765B2
公开(公告)日:2020-03-31
申请号:US15229315
申请日:2016-08-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Chan Yoon , Dong Hwan Lee , Young Ghyu Ahn
Abstract: A coil component and a board having the same are provided. The coil component includes: a first coil; a second coil sharing a magnetic core with the first coil; a main board disposed between the first and second coils; first and second external electrodes connected to the first coil; and third and fourth external electrodes connected to the second coil.
-
公开(公告)号:US10559413B2
公开(公告)日:2020-02-11
申请号:US15809606
申请日:2017-11-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Chan Yoon , Dong Hwan Lee , Young Ghyu Ahn
Abstract: A coil electronic component includes a first coil and a second coil disposed on and beneath a main board, respectively, wherein the first coil includes a first coil pattern and a second coil pattern connected to each other through a first via of a first insulating layer and disposed on and beneath the first insulating layer, respectively, and the second coil includes a third coil pattern and a fourth coil pattern connected to each other through a second via of a second insulating layer and disposed on and beneath the second insulating layer, respectively. In this case, the main board, the first insulating layer, and the second insulating layer include through-holes formed in central portions thereof, respectively.
-
公开(公告)号:US08928451B2
公开(公告)日:2015-01-06
申请号:US14073666
申请日:2013-11-06
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor: Won Chul Sim , Chan Yoon , Young Seuck Yoo , Sung Kwon Wi
CPC classification number: H01F17/0013 , H01F19/04 , H01F41/041 , H01F41/046 , H01F2017/0073 , Y10T29/49016
Abstract: Disclosed herein are a common mode filter and a method of manufacturing the same. The common mode filter includes: a primary coil that includes a primary coil body forming a plane in a vortex structure; and a secondary coil that includes a secondary coil body forming a co-plane in the same vortex structure as the primary coil body and forms a 180° rotational symmetry with the primary coil body, having the same length, width, and turn number as the primary coil body. Further, the method of manufacturing a common mode filter is proposed.
Abstract translation: 这里公开了共模滤波器及其制造方法。 共模滤波器包括:初级线圈,其包括在涡流结构中形成平面的初级线圈体; 以及次级线圈,其包括在与初级线圈体相同的涡旋结构中形成共面的次级线圈体,并与初级线圈体形成180度旋转对称,具有与所述初级线圈体相同的长度,宽度和匝数 初级线圈体。 此外,提出了制造共模滤波器的方法。
-
公开(公告)号:US12073971B2
公开(公告)日:2024-08-27
申请号:US17110976
申请日:2020-12-03
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Chan Yoon , Dong Hwan Lee , Dong Jin Lee , Sang Soo Park
CPC classification number: H01F17/045 , H01F27/324
Abstract: A coil component includes a core portion, and first and second coil portions wound to form at least one or more turns on the core portion. The core portion includes a first core portion on which the first coil portion is wound, a second core portion on which the second coil portion is wound, and a third core portion which is disposed to be spaced apart from and between the first and second core portions and on which the first and second coil portions are wound to overlap each other.
-
公开(公告)号:US12040123B2
公开(公告)日:2024-07-16
申请号:US17229930
申请日:2021-04-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Dong Hwan Lee , Dong Jin Lee , Chan Yoon , Young Ghyu Ahn
CPC classification number: H01F27/292 , H01F17/0013 , H01F27/324
Abstract: A coil component includes a body having end surfaces opposing each other and side surfaces connecting the end surfaces and opposing each other, a support substrate disposed within the body and having a first surface and a second surface opposing each other, first and second coil units disposed on the first surface and the second surface of the support substrate, respectively, and each including a plurality of turns, and lead portions connected to the first and second coil units and exposed to a first end surface and a second end surface of the body, respectively. A shortest distance from an outermost turn of the first coil unit to the second end surface of the body is greater than a shortest distance from the outermost turn of the first coil unit to a first side surface of the body.
-
公开(公告)号:US11875948B2
公开(公告)日:2024-01-16
申请号:US17681012
申请日:2022-02-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Hwi Dae Kim , Sang Soo Park , Chan Yoon , Woo Chul Shin , Ji Hong Jo
CPC classification number: H01G4/30 , H01G2/02 , H01G4/012 , H01G4/1209
Abstract: A multilayer capacitor includes a capacitor body having an active region, upper and lower cover regions, and width margins on opposing sides of the active region. The width margin includes a first region on an internal side thereof adjacent the first and second internal electrodes and a second region on an external side between the first region and a respective external surface of the capacitor body, and he upper and lower cover regions each include a third region on an internal side thereof adjacent the internal electrodes and a fourth region on an external side between the third region and a respective external surface of the capacitor body. The active region, the second region, and the fourth region have a same dielectric constant A, and the first and third regions have a same dielectric constant B, and A and B are different from each other and satisfy 0.5≤B/A.
-
公开(公告)号:US11875931B2
公开(公告)日:2024-01-16
申请号:US16990273
申请日:2020-08-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Hye Mi Yoo , Dong Hwan Lee , Hwi Dae Kim , Sang Soo Park , Chan Yoon , Dong Jin Lee
CPC classification number: H01F27/33 , H01F27/2804 , H01F27/2828 , H01F27/292 , H01F27/324 , H01F2027/2809
Abstract: A coil component includes a winding-type coil including a coil portion and first and second lead-out portions respectively connected to the coil portion; a body in which the winding-type coil is disposed, the first and second lead-out portions of the winding-type coil exposed from the body; a noise removal portion including a pattern portion spaced apart from a metal wire of the winding-type coil in the body and having both end portions spaced apart from each other to have an open-loop, and a third lead-out portion connected to the pattern portion and exposed from the body; an insulating layer disposed between the winding-type coil and the noise removal portion; and first to third external electrodes arranged on the body to be spaced apart from each other and respectively connected to the first to third lead-out portions.
-
公开(公告)号:US11783982B2
公开(公告)日:2023-10-10
申请号:US16986567
申请日:2020-08-06
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Hwi Dae Kim , Dong Hwan Lee , Sang Soo Park , Chan Yoon , Dong Jin Lee , Hye Mi Yoo
CPC classification number: H01F17/0013 , H01F17/04 , H01F27/292 , H01F27/324 , H01F2017/048
Abstract: A coil component includes a body; a coil portion disposed inside the body; a noise removal portion disposed to contact a surface of the body; an insulating layer disposed inside the noise removal portion; first and second external electrodes each connected to the coil portion and disposed on the insulating layer to overlap the noise removal portion; and a third external electrode disposed to be spaced apart from the first and second external electrodes and contacting the noise removal portion.
-
公开(公告)号:US11348727B2
公开(公告)日:2022-05-31
申请号:US16776146
申请日:2020-01-29
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Hwi Dae Kim , Ji Hong Jo , Woo Chul Shin , Sang Soo Park , Chan Yoon
Abstract: A multilayer ceramic electronic component includes a ceramic body comprising dielectric layers and first and second internal electrodes laminatedly disposed in a third direction with respective dielectric layers interposed therebetween, and first electrode and second external electrodes disposed on both surfaces of the ceramic body in the first direction and electrically connected to the first and second internal electrodes. When an absolute value of a horizontal angle in the second direction of the first internal electrode with respect to the first surface of the ceramic body is referred to a first angle of the internal electrode, a total sum of the first angles is less than 10°.
-
-
-
-
-
-
-
-
-