公开(公告)号：US20230187832A1

公开(公告)日：2023-06-15

申请号：US17969888

申请日：2022-10-20

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Chin Mo KIM ,  Juhyoung PARK ,  Hyunjun CHOI ,  Jae Yeong KIM ,  Sungyong AN

IPC: H01Q9/04

CPC classification number: H01Q9/045 ,  H01Q9/0414

Abstract: An antenna includes a first insulating layer; a second insulating layer disposed on the first insulating layer in a height direction; a third insulating layer disposed between the first and second insulating layers, a feed via including a first portion passing through the first insulating layer, a second portion passing through the second insulating layer, and a third portion passing through the third insulating layer and connected to the first and second portions; and an antenna patch disposed on the first insulating layer and fed from the feed via, wherein a permittivity of the third insulating layer is lower than permittivities of the first and second insulating layers, and in a direction perpendicular to the height direction, a width of the third portion is wider than a width of the first portion and/or a width of the second portion.

公开(公告)号：US20220216586A1

公开(公告)日：2022-07-07

申请号：US17343235

申请日：2021-06-09

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Chin Mo KIM ,  Sungyong AN ,  Jae Yeong KIM

IPC: H01Q1/22 ,  H05K1/18 ,  H05K1/11 ,  H05K3/10 ,  H01Q9/04

Abstract: A chip antenna includes a substrate having a concavo-convex pattern on a surface thereof, and a conductor pattern disposed on the surface of the substrate having the concavo-convex pattern, wherein a convex portion extending in one direction and a concave portion extending in one direction are alternately disposed in the concavo-convex pattern.

公开(公告)号：US20200335870A1

公开(公告)日：2020-10-22

申请号：US16802798

申请日：2020-02-27

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Yeong KIM ,  Chin Mo KIM ,  Ji Hyung JUNG ,  Sung Nam CHO ,  Sung Yong AN

IPC: H01Q9/04 ,  H01Q1/38 ,  H01Q1/48

Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.

公开(公告)号：US20200313279A1

公开(公告)日：2020-10-01

申请号：US16732762

申请日：2020-01-02

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Yeong KIM ,  Sung Nam CHO ,  Sung Yong AN ,  Ji Hyung JUNG ,  Chin Mo KIM

IPC: H01Q1/22 ,  H01Q9/40 ,  H01Q1/38 ,  H01Q21/06 ,  H01Q1/48 ,  H01Q9/04

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.

公开(公告)号：US20190172641A1

公开(公告)日：2019-06-06

申请号：US16267534

申请日：2019-02-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Woo KIM ,  Jong Ho LEE ,  Min Gi SIN ,  Hak Kwan KIM ,  Chin Mo KIM ,  Chi Hwa LEE ,  Hong Seok KIM ,  Woo Sup KIM ,  Chang Hwa PARK

IPC: H01G4/12 ,  H01G4/10 ,  H01G4/33 ,  C04B35/468 ,  H01G4/30 ,  C04B35/628 ,  C01G23/00

Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.

公开(公告)号：US20230216202A1

公开(公告)日：2023-07-06

申请号：US17980203

申请日：2022-11-03

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Juhyoung PARK ,  Daeki LIM ,  Won Cheol LEE ,  Jeongki RYOO ,  Sungyong AN ,  Chin Mo KIM

IPC: H01Q9/04 ,  H01Q5/307 ,  H01Q21/08

CPC classification number: H01Q9/0414 ,  H01Q9/045 ,  H01Q5/307 ,  H01Q21/08

Abstract: An antenna device according to embodiment includes: a first dielectric layer; a second dielectric layer disposed on the first dielectric layer; a third dielectric layer disposed on the second dielectric layer; a first antenna including a first feed via passing through the first dielectric layer and a first antenna patch disposed in a first surface of the first dielectric layer; and a second antenna including a second feed via passing through the first dielectric layer and a second antenna patch disposed in the first surface of the first dielectric layer, wherein a dielectric constant of the second dielectric layer is lower than a dielectric constant of the first dielectric layer and a dielectric constant of the third dielectric layer, and the second dielectric layer has a cavity overlapping the second antenna patch.

公开(公告)号：US20220231430A1

公开(公告)日：2022-07-21

申请号：US17713453

申请日：2022-04-05

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Yeong KIM ,  Ji Hyung JUNG ,  Chin Mo KIM ,  Sung Nam CHO ,  Sung Yong AN

IPC: H01Q21/06 ,  H01Q1/52 ,  H01Q1/22 ,  H01Q1/38

Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.

公开(公告)号：US20220029274A1

公开(公告)日：2022-01-27

申请号：US17499212

申请日：2021-10-12

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Yeong KIM ,  Sung Nam CHO ,  Sung Yong AN ,  Ji Hyung JUNG ,  Chin Mo KIM

IPC: H01Q1/22 ,  H01Q21/06 ,  H01Q1/48 ,  H01Q1/38 ,  H01Q9/40 ,  H01Q9/04

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.

公开(公告)号：US20210151257A1

公开(公告)日：2021-05-20

申请号：US17133828

申请日：2020-12-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Hwa PARK ,  Jin Woo KIM ,  Min Gi SIN ,  Byung Hyun PARK ,  Chin Mo KIM

IPC: H01G4/30 ,  H01L21/02 ,  H01G4/12 ,  C01G23/00 ,  H01L49/02 ,  H01L23/29

Abstract: A dielectric powder includes a core-shell structure including a core region formed in an inner portion thereof and a shell region covering the core region. The core region includes barium titanate (BaTiO3) doped with a metal oxide, and the shell region is formed of a ferroelectric material.

公开(公告)号：US20210066814A1

公开(公告)日：2021-03-04

申请号：US16732661

申请日：2020-01-02

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Yeong KIM ,  Ji Hyung JUNG ,  Chin Mo KIM ,  Sung Nam CHO ,  Sung Yong AN

IPC: H01Q21/06 ,  H01Q1/38 ,  H01Q1/22 ,  H01Q1/52

Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.