公开(公告)号：US20190172641A1

公开(公告)日：2019-06-06

申请号：US16267534

申请日：2019-02-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Woo KIM ,  Jong Ho LEE ,  Min Gi SIN ,  Hak Kwan KIM ,  Chin Mo KIM ,  Chi Hwa LEE ,  Hong Seok KIM ,  Woo Sup KIM ,  Chang Hwa PARK

IPC: H01G4/12 ,  H01G4/10 ,  H01G4/33 ,  C04B35/468 ,  H01G4/30 ,  C04B35/628 ,  C01G23/00

Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.

公开(公告)号：US20140083755A1

公开(公告)日：2014-03-27

申请号：US13713747

申请日：2012-12-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sun Cheol LEE ,  Woo Sup KIM ,  Dong Gun KIM ,  Kyeong Jun KIM ,  Kyu Ho LEE

IPC: H05K1/18 ,  H05K1/03 ,  H01C7/00 ,  H01L41/083 ,  H01G4/12 ,  H01C7/10

CPC classification number: H05K1/181 ,  H01C7/008 ,  H01C7/10 ,  H01G2/06 ,  H01G2/24 ,  H01G4/06 ,  H01G4/12 ,  H01G4/30 ,  H01L41/083 ,  H05K1/0306 ,  Y02P70/611

Abstract: A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer.

Abstract translation: 层叠芯片电子部件包括：陶瓷体，其包括内部电极和电介质层; 形成为在长度方向上覆盖陶瓷体的两端部的外部电极; 其中内部电极以相对的方式设置在其间插入电介质层的有源层以形成电容; 以及在有源层的厚度方向的上部和下部形成的上部和下部覆盖层，所述下部覆盖层的厚度大于上部覆盖层的厚度。

公开(公告)号：US20160181019A1

公开(公告)日：2016-06-23

申请号：US14799461

申请日：2015-07-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kum Jin PARK ,  Chang Hak CHOI ,  Chi Hwa LEE ,  Min Gi SIN ,  Woo Sup KIM ,  Jong Hoon YOO

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/224

CPC classification number: H01G4/30 ,  C04B35/4682 ,  C04B2235/3208 ,  C04B2235/3224 ,  C04B2235/5454 ,  C04B2235/6025 ,  H01G4/12 ,  H01G4/1227

Abstract: A multilayer ceramic electronic component and a method of manufacturing the same are provided. The multilayer ceramic electronic component includes: a ceramic body including dielectric layers; and internal electrodes disposed on the dielectric layers within the ceramic body and containing a ceramic material trapped therein. The ceramic material is a dielectric material doped with an additive.

Abstract translation: 提供了一种多层陶瓷电子部件及其制造方法。 多层陶瓷电子部件包括：包括电介质层的陶瓷体; 以及内部电极，其设置在陶瓷体内的电介质层上并含有被困在其中的陶瓷材料。 陶瓷材料是掺杂有添加剂的介电材料。

公开(公告)号：US20180130601A1

公开(公告)日：2018-05-10

申请号：US15684645

申请日：2017-08-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Woo KIM ,  Jong Ho LEE ,  Min Gi SIN ,  Hak Kwan KIM ,  Chin Mo KIM ,  Chi Hwa LEE ,  Hong Seok KIM ,  Woo Sup KIM ,  Chang Hwa PARK

IPC: H01G4/12 ,  H01G4/33 ,  H01G4/10 ,  C04B35/468 ,  C04B35/628

Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.

公开(公告)号：US20160104578A1

公开(公告)日：2016-04-14

申请号：US14878868

申请日：2015-10-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Bum Suk KANG ,  Su Jin LEE ,  Hew Young KIM ,  Hee Sang KANG ,  Woo Sup KIM ,  Seong Min CHIN

IPC: H01G4/248 ,  H01G4/012 ,  H01G4/12 ,  H01G4/30

CPC classification number: H01G4/30 ,  H01G4/0085 ,  H01G4/1227 ,  H01G4/2325

Abstract: The present invention relates to a multi-layer ceramic capacitor which includes a ceramic main body formed by stacking internal electrodes and dielectric layers alternately and an external electrode formed by stacking a coating layer and a plating layer on both ends of the ceramic main body sequentially, wherein the coating layer includes conductive metal powder and a(Si, B)-b(Li, K)-c(Ba, Ca)-d(Mn, V, Zn)-e(Ti, Sn, Zr, Al) component of glass frit (herein, 20≦a≦60, 10≦b≦35, 2≦c≦30, 2≦d≦20 and 0.5≦e≦30 mol %, a+b+c+d=100 mol %).

Abstract translation: 多层陶瓷电容器技术领域本发明涉及一种多层陶瓷电容器，其包括通过交替堆叠内部电极和电介质层而形成的陶瓷主体，以及通过依次堆叠陶瓷主体的两端上的涂层和镀层而形成的外部电极， 其中所述涂层包括导电金属粉末和（Si，B）-b（Li，K）-c（Ba，Ca）-d（Mn，V，Zn）-e（Ti，Sn，Zr，Al）组分 的玻璃料（本文中为20＆lt; nlE; a＆nlE; 60,10和nlE; b＆nlE; 35,2和nlE; 30,2和nlE; 20和0.5和nlE; e＆nlE; 30mol％，a + b + c + d = ）。