公开(公告)号：US20250022844A1

公开(公告)日：2025-01-16

申请号：US18444359

申请日：2024-02-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： CHOONGBIN YIM ,  JONGKOOK KIM

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/522 ,  H01L23/528 ,  H01L25/00 ,  H01L25/18

Abstract: A semiconductor package according to an embodiment may include, a redistribution layer structure; a first semiconductor stack structure on an upper surface of the redistribution layer structure, wherein the first semiconductor stack structure includes a first chiplet and a second chiplet disposed on the first chiplet; a second semiconductor stack structure on an upper surface of the redistribution layer structure side by side with the first semiconductor stack structure; a bridge die forming an electrical connection between the first semiconductor stack structure and the second semiconductor stack structure, the bridge die being disposed above the first semiconductor stack structure and the second semiconductor stack structure; and a surface mount device (SMD) disposed on an upper surface of at least one of the first semiconductor stack structure and the second semiconductor stack structure.

公开(公告)号：US20240395720A1

公开(公告)日：2024-11-28

申请号：US18395821

申请日：2023-12-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： CHOONGBIN YIM ,  JONGKOOK KIM

IPC: H01L23/538 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L25/00 ,  H01L25/065 ,  H01L25/10 ,  H10B80/00

Abstract: A semiconductor package includes: a first redistribution layer structure; a first semiconductor die disposed on the first redistribution layer structure; a second semiconductor die disposed adjacent to the first semiconductor die on the first redistribution layer structure; a molding material positioned on the first redistribution layer structure, and covering the first semiconductor die and the second semiconductor die; a bridge die positioned on the molding material, the first semiconductor die, and the second semiconductor die, and electrically connecting the first semiconductor die and the second semiconductor die to each other; a substrate positioned on the molding material, the first semiconductor die, and the second semiconductor die, and at least partially surrounding the bridge die; and a second redistribution layer structure disposed on the bridge die and the substrate.

公开(公告)号：US20210407923A1

公开(公告)日：2021-12-30

申请号：US17167789

申请日：2021-02-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： DONGHO KIM ,  JONGBO SHIM ,  HWAN PIL PARK ,  CHOONGBIN YIM ,  JUNGWOO KIM

IPC: H01L23/538 ,  H01L23/13 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065 ,  H01L25/10

Abstract: A semiconductor package substrate includes a substrate having a bottom surface including a cavity structure defined therein. The cavity structure includes a floor surface. A passive device structure has at least a partial portion of the passive device structure disposed in the cavity structure. The passive device structure includes a first passive device and a second passive device that are each electrically connected to the floor surface of the cavity structure. At least partial portions of the first passive device and the second passive device vertically overlap each other.