公开(公告)号：US20240139947A1

公开(公告)日：2024-05-02

申请号：US18410563

申请日：2024-01-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dohoon KIM ,  Hyunki HONG

IPC: B25J9/16 ,  B25J9/00

CPC classification number: B25J9/1664 ,  B25J9/0084

Abstract: A robot includes: at least one sensor; a driver configured to move the robot; a memory configured to store at least one instruction; and a processor configured to execute the at least one instruction to: identify sub spaces of a traveling space of the robot, obtain navigability information corresponding to the respective sub spaces based on sensing data obtained by the at least one sensor while the robot is traveling, obtain time information on time required for passing through the respective sub spaces based on a traveling map, the traveling map being obtained based on the navigability information, identify a moving path of the robot based on the time information, and control the driver based on the moving path, wherein the navigability information includes at least one of region information associated with a sub space, information associated with at least one other robot, and information associated with a dynamic object.

公开(公告)号：US20230070341A1

公开(公告)日：2023-03-09

申请号：US17843394

申请日：2022-06-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dohoon KIM ,  Aron Baik ,  Chanho Yoon ,  Eunsoll Chang

IPC: G05D1/02

Abstract: A robot is provided. The robot includes a driving part, a three dimensional (3D) depth sensor, a memory storing instructions, and a processor connected to the driving part, the 3D depth sensor, and the memory. The processor is configured to execute the instructions to acquire a depth image of a driving surface photographed by the 3D depth sensor while the robot is driving in a space, acquire, based on the acquired depth image, location information of a boundary area where tilt information of the driving surface is changed, acquire type information corresponding to an outside area of the boundary area based on the acquired location information of the boundary area and the changed tilt information, and control the driving part based on the acquired type information.

公开(公告)号：US20220310407A1

公开(公告)日：2022-09-29

申请号：US17701846

申请日：2022-03-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dohoon KIM ,  Wonwoong CHUNG ,  Taehyung KIM ,  Heejun PARK ,  Handuck SONG ,  Heonjong JEONG ,  Younglae KIM ,  Byeongok CHO

IPC: H01L21/467 ,  H01L21/311 ,  C09K13/00

Abstract: An etching gas composition includes a first organofluorine compound having 3 to 6 carbon atoms, and an organosulfur compound having 1 to 4 sulfur atoms. The organosulfur compound may include a carbon-fluorine (C—F) bond, a carbon-sulfur (C—S) bond, at least one carbon-carbon double (—C═C—) bond. When the etching gas composition is used, excellent etch selectivity may be obtained, and the linearity and verticality of a pattern may be greatly increased by improving line edge roughness (LER) and line width roughness (LWR) due to an improvement in the roughness of an etched surface.

公开(公告)号：US20220210957A1

公开(公告)日：2022-06-30

申请号：US17694529

申请日：2022-03-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyelim YUN ,  Bongkyu MIN ,  Dohoon KIM ,  Taewoo KIM ,  Jinyong PARK ,  Jungje BANG ,  Hyeongju LEE

IPC: H05K9/00 ,  H05K1/18 ,  H05K1/11 ,  H05K7/14 ,  H05K1/14

Abstract: An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.

公开(公告)号：US20200173455A1

公开(公告)日：2020-06-04

申请号：US16697950

申请日：2019-11-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kisup LEE ,  Jinbaek KIM ,  Kyunghoon KIM ,  Jaehyoung SIM ,  Dohoon KIM ,  Seonghyun YOON ,  Joonho YOON

IPC: F04D29/28

Abstract: A double suction fan includes first and second rings spaced at a predetermined distance apart from and in parallel to each other, an intermediate plate disposed between the first and second rings and including a shaft hole, a plurality of first blades disposed between the first ring and the intermediate plate, a plurality of second blades disposed between the second ring and the intermediate plate, and first and second rotating hubs disposed on both side surfaces of the intermediate plate, wherein each of the first and second rotating hubs is formed of a plurality of hub plates which are disposed perpendicular to the intermediate plate around the shaft hole, and wherein the plurality of hub plates are formed to evenly distribute air introduced through the first and second rings in a longitudinal direction of the plurality of first and second blades when the intermediate plate rotates.

公开(公告)号：US20200093040A1

公开(公告)日：2020-03-19

申请号：US16575679

申请日：2019-09-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyelim YUN ,  Bongkyu MIN ,  Dohoon KIM ,  Taewoo KIM ,  Jinyong PARK ,  Jungje BANG ,  Hyeongju LEE

IPC: H05K9/00 ,  H05K1/18 ,  H05K1/11 ,  H05K1/14 ,  H05K7/14

Abstract: Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.