公开(公告)号：US20230163866A1

公开(公告)日：2023-05-25

申请号：US18055921

申请日：2022-11-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dooseok Choi ,  Youngki Lee ,  Joonhoi Hur

IPC: H04B17/12 ,  H04B17/10

CPC classification number: H04B17/12 ,  H04B17/102

Abstract: A wireless communications device may include a controller configured to, in a calibration mode, obtain a first output value of a first power detector after setting a first power amplifier to a first gain and obtain a second output value of the first power detector after setting the first power amplifier to a second gain, wherein the controller may estimate, in a normal mode, output power of a first antenna from an output value of the first power detector, based on a correction coefficient calculated using the first output value and the second output value.

公开(公告)号：US20230062464A1

公开(公告)日：2023-03-02

申请号：US17821523

申请日：2022-08-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngmin Kim ,  Dooseok Choi ,  Minyoung Yoon

IPC: H01Q21/08 ,  H04B1/40

Abstract: Provided is an antenna array structure including a plurality of first antenna elements for transmitting and receiving a signal at a first frequency and a plurality of second antenna elements for transmitting and receiving a signal at a second frequency, wherein the plurality of first antenna elements are disposed in a first layer and aligned to a line extending in a first direction and the plurality of second antenna elements are disposed in a second layer and aligned to the line.

公开(公告)号：US11437733B2

公开(公告)日：2022-09-06

申请号：US17038883

申请日：2020-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngki Lee ,  Sunwoo Lee ,  Dooseok Choi

IPC: H01Q21/06 ,  H01Q5/40 ,  H01Q5/35 ,  H01Q5/48

Abstract: An antenna device includes a first antenna, a second antenna, a barrier, and a signal processing device. The first antenna transceives a first radio frequency (RF) signal in a first communication band, and the second antenna transceives a second RF signal in a second communication band. The first antenna includes a first radiator and a second radiator having a shape symmetrical to a shape of the first radiator. The second antenna includes third and fourth radiators having shape identical to those of the first and second radiators but having a size corresponding to the second communication band. The barrier includes a penetration region, and reflects the first and second RF signals. A center frequency of the second communication band is higher than a center frequency of the first communication band, and the first and second antennas are connected with the signal processing device through the penetration region of the barrier.

公开(公告)号：US11355850B2

公开(公告)日：2022-06-07

申请号：US16731546

申请日：2019-12-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngki Lee ,  Sunwoo Lee ,  Dooseok Choi ,  Seungchan Heo

IPC: H01Q9/04 ,  H01Q1/38

Abstract: Provided is an antenna module including a plurality of conductive layers stacked in a first direction, the antenna module including a first patch antenna including at least one radiator provided in at least one conductive layer, and an electromagnetic band gap (EBG) structure including a plurality of pillars spaced apart from the at least one radiator in a direction perpendicular to the first direction, the plurality of pillars surrounding the at least one radiator, wherein each of the plurality of pillars includes two or more plates provided parallel with each other in two or more conductive layers, respectively, and at least one via connecting the two or more plates.

公开(公告)号：US11177550B2

公开(公告)日：2021-11-16

申请号：US16181543

申请日：2018-11-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dooseok Choi ,  Thomas Byunghak Cho ,  Seung-chan Heo

IPC: H01Q1/22 ,  H01Q1/48 ,  H01Q21/06 ,  H01Q9/04 ,  H01Q25/00 ,  H01Q3/34

Abstract: A radio frequency (RF) device may include a radio frequency integrated circuit (RFIC) chip and an antenna module on an upper surface of the RFIC chip. The antenna module may include a first patch parallel to the RFIC chip and having an upper surface configured to emit radiation in a vertical direction opposite the first patch from the RFIC chip, a ground plate parallel to the first patch, and between the first patch and the RFIC chip, and a first plurality of feed lines connected to a lower surface of the first patch and configured to supply at least one first differential signal to the first patch from the RFIC chip.

公开(公告)号：US11095318B2

公开(公告)日：2021-08-17

申请号：US16743478

申请日：2020-01-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngmin Kim ,  Hongjong Park ,  Daeyoung Yoon ,  Sunwoo Lee ,  Youngki Lee ,  Dooseok Choi

IPC: H04N1/44 ,  H04B1/00 ,  H01L23/498 ,  H01Q21/00 ,  H05K1/02

Abstract: An antenna module includes a multilayer board, a radio frequency (RF) chip, and a first active device array. The multilayer board includes an antenna that transmits and receives electromagnetic waves. The RF chip is on a bottom surface of the multilayer board, and includes transmission circuits each of which constitutes a part of each of transmission paths for generating RF signals to be provided to the antenna. The first active device array is on the bottom surface of the multilayer board, and includes a first group of active devices respectively included in a portion of power amplifiers in the transmission paths of the transmission circuits, and first input pins and first output pins respectively connected to electrodes of the first group of active devices.

公开(公告)号：US11038546B2

公开(公告)日：2021-06-15

申请号：US16864251

申请日：2020-05-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dooseok Choi ,  Young Min Kim ,  Jei Young Lee ,  Dae Young Yoon ,  Sun Woo Lee

IPC: H04B1/04 ,  H03F1/30 ,  H03F1/52 ,  H04B1/40 ,  H03F3/19 ,  H03F3/21 ,  H03F3/24

Abstract: An electronic device including: a modem configured to process a baseband signal; an intermediate frequency (IF) transceiver configured to convert the baseband signal provided from the modem into an IF band signal; and a radio frequency (RF) transceiver configured to convert the IF band signal provided from the IF transceiver into an RF band signal, wherein the RF transceiver includes a power amplifier configured to amplify the RF band signal, and a temperature sensor unit to detect a temperature of the power amplifier, and wherein the modem includes a controller configured to control an input power inputted to the RF transceiver based on the temperature of the power amplifier detected by the temperature sensor unit.

公开(公告)号：US10979150B2

公开(公告)日：2021-04-13

申请号：US16356088

申请日：2019-03-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dooseok Choi ,  Dae-young Yoon ,  Sun-woo Lee ,  Thomas Byunghak Cho ,  Seung-chan Heo

IPC: G01R29/08 ,  H04B17/00 ,  H03F3/24 ,  H04B1/44

Abstract: A method of testing a radio frequency (RF) integrated circuit includes: forming, performed by the RF integrated circuit, a test loop that passes through a first transceiver circuit, a first front-end circuit, and a second transceiver circuit, based on a test control signal transmitted from a test device; adjusting, performed by the RF integrated circuit, a shift degree of at least one phase shifter in the first front-end circuit, based on the test control circuit; and receiving, performed by the RF integrated circuit, a test input signal via the first transceiver circuit from the test device, and outputting, to the test device, the test input signal that has passed through the test loop, wherein the test input signal is output as a test output signal via the second transceiver circuit.