公开(公告)号：US11742358B2

公开(公告)日：2023-08-29

申请号：US17383992

申请日：2021-07-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwoon Jang ,  Wonsoon Park ,  Dongmyung Son ,  Sangmin Shin ,  Changjoon Lee ,  Youngki Jung ,  Seongphil Cho ,  Gyun Heo ,  Soonmin Hong

IPC: H01L27/12 ,  H01L25/16

CPC classification number: H01L27/124 ,  H01L25/167

Abstract: A display panel is provided. The display panel according to an embodiment includes a thin film transistor glass substrate, a plurality of micro light emitting diodes (LEDs) arranged on one surface of the thin film transistor glass substrate, and a plurality of side wirings formed at an edge of the thin film transistor glass substrate to electrically connect the one surface of the thin film transistor glass substrate to an opposite surface to the one surface.

公开(公告)号：US11658162B2

公开(公告)日：2023-05-23

申请号：US16629768

申请日：2018-06-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngchul Lee ,  Taesang Park ,  Kyoree Lee ,  Tackmo Lee ,  Gyun Heo ,  Youngjun Moon ,  Won Choi

IPC: H01L25/075 ,  H01L25/16 ,  H01L33/00 ,  H01L33/62 ,  H01L33/52

CPC classification number: H01L25/0753 ,  H01L25/167 ,  H01L33/0095 ,  H01L33/62 ,  H01L33/0093 ,  H01L33/52 ,  H01L2933/005 ,  H01L2933/0066

Abstract: The disclosure describes a micro Light Emitting Diode (LED) display. The display may include a Printed Circuit Board (PCB) including a plurality of solder pads, a micro LED package including a plurality of micro LED chips, and a plurality of solder electrodes which bond the micro LED chips onto the solder pads of the PCB. The micro LED package may be re-arranged in an Red Green Blue (RGB) state on a temporary fixing film by using a pickup device in accordance with a display pixel configuration, after the micro LED chips are attached to a carrier film.

公开(公告)号：US11056630B2

公开(公告)日：2021-07-06

申请号：US16786514

申请日：2020-02-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soonmin Hong ,  Gyuhwa Kim ,  Jeonggen Yoon ,  Tackmo Lee ,  Gyun Heo ,  Youngjun Moon ,  Kyungwoon Jang

IPC: H01L33/62 ,  H01L27/12 ,  H01L25/16

Abstract: A display module includes a glass substrate having a front surface and a back surface opposite to the front surface; a TFT layer; LEDs mounted on the TFT layer; and a plurality of side wirings formed at intervals in an edge area of the glass substrate, and the edge area includes a first area corresponding to a side surface of the glass substrate, a second area adjacent to the side surface, and a third area adjacent to the side surface, and a first chamfered surface formed by chamfering a corner at which the first area and the second area meet, and a second chamfered surface formed by chamfering a corner at which the first area and the third area meet, and each of the plurality of side wirings is disposed along the second area, the first chamfered surface, the first area, the second chamfered surface, and the third area.