公开(公告)号：US20200264661A1

公开(公告)日：2020-08-20

申请号：US16688494

申请日：2019-11-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Han KIM ,  Minah KOH ,  Hyoungshin PARK ,  Jiseung SONG

IPC: G06F1/16 ,  H04B5/00

Abstract: A cover accessory capable of operating a light emitting device without a separate power source and an electronic device including the cover accessory are provided. A cover accessory includes a cover that is detachably combinable with an electronic device and formed to surround a rear plate and a lateral member of the electronic device. The cover includes a recess formed to correspond to the rear plate of the electronic device. The cover accessory includes a circuit board disposed in the recess such that a surface thereof faces the recess, a light source layer including a plurality of light emitting devices disposed on the surface of the circuit board, a wireless power receiving module disposed on one of the surface or an opposite surface of the circuit board, and a cover processor disposed on one of the surface or the opposite surface of the circuit board and electrically connected to the wireless power receiving module and the plurality of light emitting devices of the light source layer.

公开(公告)号：US20200219783A1

公开(公告)日：2020-07-09

申请号：US16821305

申请日：2020-03-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Han KIM ,  Jae Hyun LIM ,  Yoon Seok SEO ,  Sang Jong LEE

IPC: H01L23/367 ,  H01L25/10 ,  H01L23/498 ,  H01L23/31

Abstract: A semiconductor package includes a first semiconductor package including a core member having a through-hole, a first semiconductor chip disposed in the through-hole and having an active surface with a connection pad disposed thereon, a first encapsulant for encapsulating at least a portion of the first semiconductor chip, and a connection member disposed on the active surface of the first semiconductor chip and including a redistribution layer electrically connected to the connection pad of the first semiconductor chip, a second semiconductor package disposed on the first semiconductor package and including a wiring substrate electrically connected to the connection member, at least one second semiconductor chip disposed on the wiring substrate, and a second encapsulant for encapsulating at least a portion of the second semiconductor chip, and a heat dissipation member covering a lateral surface of the second semiconductor package and exposing an upper surface of the second encapsulant.

公开(公告)号：US20200161266A1

公开(公告)日：2020-05-21

申请号：US16682084

申请日：2019-11-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jungho SHIM ,  Han KIM ,  Chulkyu KIM

IPC: H01L23/00 ,  H01L23/538 ,  H01L23/14 ,  H01L23/31 ,  H01L25/18 ,  H01L25/16 ,  H01L21/683 ,  H01L21/56 ,  H01L21/48

Abstract: A semiconductor package includes a first connection structure having first and second surfaces and including a first redistribution layer, a first semiconductor chip disposed on the first surface and having a first connection pad electrically connected to the first redistribution layer, a second semiconductor chip disposed around the first semiconductor chip on the first surface and having a second connection pad electrically connected to the first redistribution layer, an interconnection bridge disposed on the second surface to be spaced apart from the second surface and connected to the first redistribution layer through a connection member to electrically connect the first and second connection pads to each other, and a second connection structure disposed on the second surface to embed the interconnection bridge and including a second redistribution layer electrically connected to the first redistribution layer.

公开(公告)号：US20200083137A1

公开(公告)日：2020-03-12

申请号：US16282642

申请日：2019-02-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seong Chan PARK ,  Sang Hyun KWON ,  Han KIM ,  Hye Lee KIM ,  Seung On KANG

IPC: H01L23/373 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522 ,  H01L23/367

Abstract: A fan-out semiconductor package includes a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, a heat dissipation member attached to the inactive surface of the semiconductor chip and having a thickness greater than a thickness of the semiconductor chip, an encapsulant encapsulating at least a portion of each of the semiconductor chip and the heat dissipation member, and a connection member disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the connection pads, wherein the heat dissipation member is a complex of carbon and a metal.

公开(公告)号：US20190341355A1

公开(公告)日：2019-11-07

申请号：US16197764

申请日：2018-11-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Mi Ja HAN ,  Han KIM ,  Seong Chan PARK

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00

Abstract: A fan-out semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, an encapsulant encapsulating the semiconductor chip, and an electromagnetic radiation blocking layer disposed above the semiconductor chip and including a base layer in which a plurality of degassing holes are formed and a porous blocking portion filled in the plurality of degassing holes.

公开(公告)号：US20190333837A1

公开(公告)日：2019-10-31

申请号：US16189025

申请日：2018-11-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung On KANG ,  Seong Chan PARK ,  Chul Kyu KIM ,  Kee Ju UM ,  Myoung Hoon KIM ,  Han KIM

IPC: H01L23/373 ,  H01L23/31 ,  H01L23/498 ,  H01L23/367 ,  H01L23/433 ,  H01L25/10

Abstract: A fan-out semiconductor package includes a core member having a through-hole; a semiconductor chip disposed in the through-hole of the core member and having an active surface on which connection pads are disposed and an inactive surface disposed to oppose the active surface; a heat radiating member directly bonded to the inactive surface of the semiconductor chip; an encapsulant encapsulating at least a portion of the semiconductor chip; and a connection member disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the connection pads of the semiconductor chip.

公开(公告)号：US20140185206A1

公开(公告)日：2014-07-03

申请号：US14147090

申请日：2014-01-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Han KIM ,  Won-Kyu SUNG

IPC: A45C11/00 ,  H05K5/03 ,  H05K5/00

CPC classification number: A45C11/00 ,  A45C2011/002 ,  A45C2011/003 ,  A45C2200/05 ,  A45C2200/10 ,  H05K5/0017 ,  H05K5/03

Abstract: Disclosed is a cover device for a portable electronic device that includes a cover unit that covers a screen of a display unit of the portable electronic device in such a manner that at least a portion of the screen remains exposed. When the portable electronic device is covered, the cover unit is connected with the portable electronic device such that information displayed on the screen of the display unit is displayed at a position corresponding to the at least a position of the screen that remains exposed.

Abstract translation: 公开了一种用于便携式电子设备的盖装置，其包括覆盖单元，该盖单元以使屏幕的至少一部分保持暴露的方式覆盖便携式电子设备的显示单元的屏幕。 当便携式电子设备被覆盖时，盖单元与便携式电子设备连接，使得显示在显示单元的屏幕上的信息被显示在与保持暴露的屏幕的至少一个位置相对应的位置处。