公开(公告)号：US20210202426A1

公开(公告)日：2021-07-01

申请号：US17201538

申请日：2021-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jungho SHIM ,  Han KIM ,  Chulkyu KIM

IPC: H01L23/00 ,  H01L23/538 ,  H01L23/14 ,  H01L23/31 ,  H01L25/18 ,  H01L25/16 ,  H01L21/683 ,  H01L21/56 ,  H01L21/48

Abstract: A semiconductor package includes a first connection structure having first and second surfaces and including a first redistribution layer, a first semiconductor chip disposed on the first surface and having a first connection pad electrically connected to the first redistribution layer, a second semiconductor chip disposed around the first semiconductor chip on the first surface and having a second connection pad electrically connected to the first redistribution layer, an interconnection bridge disposed on the second surface to be spaced apart from the second surface and connected to the first redistribution layer through a connection member to electrically connect the first and second connection pads to each other, and a second connection structure disposed on the second surface to embed the interconnection bridge and including a second redistribution layer electrically connected to the first redistribution layer.

公开(公告)号：US20200161266A1

公开(公告)日：2020-05-21

申请号：US16682084

申请日：2019-11-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jungho SHIM ,  Han KIM ,  Chulkyu KIM

IPC: H01L23/00 ,  H01L23/538 ,  H01L23/14 ,  H01L23/31 ,  H01L25/18 ,  H01L25/16 ,  H01L21/683 ,  H01L21/56 ,  H01L21/48

Abstract: A semiconductor package includes a first connection structure having first and second surfaces and including a first redistribution layer, a first semiconductor chip disposed on the first surface and having a first connection pad electrically connected to the first redistribution layer, a second semiconductor chip disposed around the first semiconductor chip on the first surface and having a second connection pad electrically connected to the first redistribution layer, an interconnection bridge disposed on the second surface to be spaced apart from the second surface and connected to the first redistribution layer through a connection member to electrically connect the first and second connection pads to each other, and a second connection structure disposed on the second surface to embed the interconnection bridge and including a second redistribution layer electrically connected to the first redistribution layer.

公开(公告)号：US20240105662A1

公开(公告)日：2024-03-28

申请号：US18528322

申请日：2023-12-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jungho SHIM ,  Han KIM ,  Chulkyu KIM

IPC: H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/14 ,  H01L23/31 ,  H01L23/538 ,  H01L25/16 ,  H01L25/18

CPC classification number: H01L24/24 ,  H01L21/486 ,  H01L21/568 ,  H01L21/6836 ,  H01L23/147 ,  H01L23/3128 ,  H01L23/5381 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/13111 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/24137 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19102

Abstract: A semiconductor package includes a first connection structure having first and second surfaces and including a first redistribution layer, a first semiconductor chip disposed on the first surface and having a first connection pad electrically connected to the first redistribution layer, a second semiconductor chip disposed around the first semiconductor chip on the first surface and having a second connection pad electrically connected to the first redistribution layer, an interconnection bridge disposed on the second surface to be spaced apart from the second surface and connected to the first redistribution layer through a connection member to electrically connect the first and second connection pads to each other, and a second connection structure disposed on the second surface to embed the interconnection bridge and including a second redistribution layer electrically connected to the first redistribution layer.

公开(公告)号：US20220352107A1

公开(公告)日：2022-11-03

申请号：US17863818

申请日：2022-07-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jungho SHIM ,  Han KIM ,  Chulkyu KIM

IPC: H01L23/00 ,  H01L23/538 ,  H01L23/14 ,  H01L23/31 ,  H01L25/18 ,  H01L25/16 ,  H01L21/683 ,  H01L21/56 ,  H01L21/48

Abstract: A semiconductor package includes a first connection structure having first and second surfaces and including a first redistribution layer, a first semiconductor chip disposed on the first surface and having a first connection pad electrically connected to the first redistribution layer, a second semiconductor chip disposed around the first semiconductor chip on the first surface and having a second connection pad electrically connected to the first redistribution layer, an interconnection bridge disposed on the second surface to be spaced apart from the second surface and connected to the first redistribution layer through a connection member to electrically connect the first and second connection pads to each other, and a second connection structure disposed on the second surface to embed the interconnection bridge and including a second redistribution layer electrically connected to the first redistribution layer.