公开(公告)号：US11525208B2

公开(公告)日：2022-12-13

申请号：US17100485

申请日：2020-11-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Inbang Song ,  Hyeonuk Na ,  Kyoungmin Park ,  Jaebok Lee ,  Hojin Lee ,  Seokho Ju ,  Sangyeon Pyo ,  Yeonsoo Ham

IPC: D06F71/34 ,  D06F71/04 ,  D06F71/29 ,  D06F71/40 ,  D06F34/30 ,  D06F58/44 ,  D06F58/10 ,  D06F58/26 ,  D06F58/20

Abstract: A clothes treatment apparatus includes a cabinet; an inner door disposed to be rotatable in a front surface of the cabinet and provided with an opening; an outer door disposed to form a space in which clothes are mounted between a front surface of the inner door and the outer door, the outer door disposed to rotate with respect to the cabinet together with the inner door or with respect to the inner door separately from the inner door; a heating plate disposed on a rear surface of the outer door; a holding device disposed in an upper portion of the space between the inner door and the outer door and formed to hold one end of the clothes; and a pair of clips disposed under the holding device in the space between the inner door and the outer door and formed to hold both sides of the clothes.

公开(公告)号：US11371183B2

公开(公告)日：2022-06-28

申请号：US17009274

申请日：2020-09-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeonsoo Ham ,  Jiho Seo ,  Jaebok Lee ,  Hojin Lee ,  Seokho Ju ,  Yongjun Hwang

IPC: D06F73/02 ,  D06F71/04 ,  D06F71/20 ,  D06F71/34

Abstract: A clothes care apparatus including a main body including a clothes care room, a support device arranged inside the clothes care room and configured to support clothes, and a steam generating device configured to supply steam into the clothes care room, wherein the support device includes a first support member, and a second support member and a third support member that are arranged in a first direction with respect to the first support member, the first support member and each of the second support member and the third support member are separated by a first separation distance, the second support member and the third support member are separated by a second separation distance in a second direction which is perpendicular to the first direction, wherein each of the first separation distances, and the second separation distance are variable to, when the clothes are supported on the support device and steam is supplied by the steam generating device, prevent wrinkles.

公开(公告)号：US12165571B2

公开(公告)日：2024-12-10

申请号：US18085162

申请日：2022-12-20

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  FOUNDATION OF SOONGSIL UNIVERSITY-INDUSTRY COOPERATION

Inventor： Junsik Hwang ,  Geonwook Yoo ,  Hojin Lee ,  Yongchan Kim ,  Kyungwook Hwang

IPC: G09G3/32

Abstract: A driving circuit board includes a driving circuit board includes: a plurality of driving electrode regions on a surface of the driving circuit board; a plurality of driving electrodes symmetrically arranged on the plurality of driving electrode regions; and a driving circuit electrically connected to at least one of the plurality of driving electrodes, wherein the plurality of driving electrodes include at least one dummy electrode that is not connected to the driving circuit.

公开(公告)号：US20240153851A1

公开(公告)日：2024-05-09

申请号：US18406602

申请日：2024-01-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JAEWON HWANG ,  Kwangjin Moon ,  Hojin Lee ,  Hyungjun Jeon

IPC: H01L23/485 ,  H01L23/00 ,  H01L23/48 ,  H01L23/535

CPC classification number: H01L23/485 ,  H01L23/481 ,  H01L23/535 ,  H01L24/29 ,  H01L24/45

Abstract: A semiconductor device includes a semiconductor substrate having a first surface adjacent to an active layer; a first insulating layer disposed on the first surface of the semiconductor substrate; a second insulating layer disposed on the first insulating layer; an etch stop structure interposed between the first insulating layer and the second insulating layer and including a plurality of etch stop layers; a contact wiring pattern disposed inside the second insulating layer and surrounded by at least one etch stop layer of the plurality of etch stop layers; and a through electrode structure configured to pass through the semiconductor substrate, the first insulating layer, and at least one etch stop layer of the plurality of etch stop layers in a vertical direction and contact the contact wiring pattern.

公开(公告)号：US20220367320A1

公开(公告)日：2022-11-17

申请号：US17560495

申请日：2021-12-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hojin Lee ,  Kwangjin Moon ,  Seungha Oh

IPC: H01L23/48 ,  H01L21/768 ,  H01L25/065 ,  H01L23/498 ,  H01L23/00

Abstract: An integrated circuit device includes a semiconductor substrate having a first surface and a second surface opposite to the first surface, a first insulating layer on the first surface of the semiconductor substrate, an electrode landing pad positioned on the first surface of the semiconductor substrate and having a sidewall surrounded by the first insulating layer, a top surface apart from the first surface of the semiconductor substrate, and a bottom surface opposite to the top surface, and a through-electrode configured to penetrate through the semiconductor substrate and contact the top surface of the electrode landing pad, wherein a horizontal width of the top surface of the electrode landing pad is less than a horizontal width of the bottom surface of the electrode landing pad and greater than a horizontal width of a bottom surface of the through-electrode in contact with the top surface of the electrode landing pad.

公开(公告)号：US11466876B2

公开(公告)日：2022-10-11

申请号：US17117649

申请日：2020-12-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Juwan Park ,  Nakhyun Kim ,  Juyoung Kim ,  Changhyun Park ,  Moonsun Shin ,  Wonhee Lee ,  Hojin Lee ,  Changwoo Jung ,  Sunghyun Chun

IPC: B01F23/21 ,  F24F6/16 ,  F24F6/04 ,  F24F6/00

Abstract: Disclosed herein is a humidifier including an improved structure of a water collection tank. The humidifier includes a main body, a water supply tank provided in an upper portion of the main body, a humidifying fabric arranged in an inside of the main body and disposed below the water supply tank to receive water, a fan configured to move air through the humidifying fabric, a water collection tank configured to collect water from the humidifying fabric, a pump configured to pump water from the water collection tank to the water supply tank, and a humidifier lower cover coupleable to and decoupleable from a lower end of the main body. The water collection tank includes a water collection tank top cover provided in an upper portion of the water collection tank, and a water collection tank lower cover configured to be accessible through the lower end of the main body.

公开(公告)号：US20210028112A1

公开(公告)日：2021-01-28

申请号：US16863126

申请日：2020-04-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinnam Kim ,  Kwangjin Moon ,  Hojin Lee ,  Pilkyu Kang ,  Hoonjoo Na

IPC: H01L23/535 ,  H01L29/78 ,  H01L29/08 ,  H01L29/06 ,  H01L29/417 ,  H01L23/48 ,  H01L21/768 ,  H01L29/66

Abstract: A semiconductor device includes a substrate having a first surface and a second surface opposite to each other, and having an active region located on the first surface and defined by a first isolation region; a plurality of active fins arranged on the active region, extending in a first direction, and defined by a second isolation region having a second depth smaller than a first depth of the first isolation region; a buried conductive wiring in a trench adjacent to the plurality of active fins, and extending in a direction of the trench; a filling insulation portion in the trench, and having the buried conductive wiring therein; an interlayer insulation layer on the first and second isolation regions and on the buried conductive wiring; a contact structure penetrating the interlayer insulation layer, and contacting the buried conductive wiring; and a conductive through structure extending through the substrate from the second surface to the trench, and contacting the buried conductive wiring.