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公开(公告)号:USD908650S1
公开(公告)日:2021-01-26
申请号:US29697045
申请日:2019-07-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer: Chulyong Cho , Minsun Kang , Jinsu Park , Danbi Kang
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公开(公告)号:US12262496B2
公开(公告)日:2025-03-25
申请号:US17974002
申请日:2022-10-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sukchul Park , Beommo Seong , Sanghoon Jung , Woonbae Kim , Jinsu Park , Byounguk Yoon
IPC: H05K5/00 , H04B1/3818 , H05K5/02
Abstract: An electronic device includes a circuit board, a socket on the circuit board and electrically connected to the circuit board, and a tray removably insertable into the socket from outside the electronic device, the tray including a body portion, a first protrusion extended from the body portion, and a second protrusion extended from the body and spaced apart from the first protrusion. The socket includes a detection portion which is engageable with the first protrusion of the tray and detects insertion of the tray in the socket, together with the circuit board, and a supporting portion which is engageable with the second protrusion of the tray. The tray which is inserted into the socket disposes the first protrusion contacting the detection portion, and a portion of the tray corresponding to the second protrusion supported by the supporting portion.
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公开(公告)号:US12040349B2
公开(公告)日:2024-07-16
申请号:US17575088
申请日:2022-01-13
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kiwon Park , Hyunsoo Kim , Jinsu Park , Suyeol Lee , Shiyoung Lee , Chiyoon Lee
CPC classification number: H01L27/156 , H01L24/02 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L2224/02381 , H01L2224/0239 , H01L2224/05554 , H01L2224/05569 , H01L2224/05573 , H01L2224/06153 , H01L2224/06155 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48105 , H01L2224/48228 , H01L2924/182
Abstract: A light emitting device includes a printed circuit board (PCB) including a connection pad, a base substrate mounted on the PCB and including a pixel region and a pad region, light emitting structures arranged on the pixel region, a barrier rib structure disposed on the pixel region and disposed at a vertical level different from the light emitting structures, the barrier rib structure including barrier ribs connected with each other to define each of pixel spaces, a phosphor layer filling each pixel space, a dam structure surrounding the barrier rib structure, a pad disposed on the pad region and adjacent to at least one side of an outer boundary of the light emitting structures, a bonding wire connecting the connection pad to the pad, and a molding structure covering the pad, the connection pad, the bonding wire, and at least a portion of the dam structure.
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公开(公告)号:USD938940S1
公开(公告)日:2021-12-21
申请号:US29696890
申请日:2019-07-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer: Jinsu Park , Chulyong Cho , Minsun Kang , Danbi Kang
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公开(公告)号:US20210193720A1
公开(公告)日:2021-06-24
申请号:US16941835
申请日:2020-07-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jaekwan Seo , Boram Kim , Nosan Park , Jungkuk Park , Jinsu Park , Seunghwan Lee
IPC: H01L27/146
Abstract: Provided is an image sensor including a semiconductor substrate including a first surface and a second surface and a plurality of pixel regions spaced apart, the plurality of pixel regions including a first region including a plurality of image pixels configured to generate image data and a second region including a plurality of phase difference detection pixels configured to perform autofocusing, a first grid pattern including a plurality of groove portions disposed on the second surface, a plurality of first microlenses selectively disposed on bottom surfaces of the plurality of groove portions corresponding to at least one of the first region and the second region, a plurality of color filters filling the plurality of groove portions, respectively, a second grid pattern superimposed on the first grid pattern, and a plurality of second microlenses separated by the second grid pattern and disposed on the plurality of color filters, respectively.
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公开(公告)号:USD908651S1
公开(公告)日:2021-01-26
申请号:US29697051
申请日:2019-07-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer: Chulyong Cho , Minsun Kang , Jinsu Park , Danbi Kang
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公开(公告)号:US20200258928A1
公开(公告)日:2020-08-13
申请号:US16583788
申请日:2019-09-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jae-Kwan Seo , Jaihoon Kang , Boram Kim , Jinsu Park , Seul-Young Jeong , Sunwook Heo
IPC: H01L27/146
Abstract: An image sensor includes a substrate having a plurality of pixel regions, a lower layer on the substrate; a plurality of color filters on the lower layer, and a micro-lens layer on or covering top surfaces of the color filters. The micro-lens layer extends to a location between two of the color filters and contacts the lower layer on one of the pixel regions. The color filters are spaced apart from the lower layer.
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公开(公告)号:USD830983S1
公开(公告)日:2018-10-16
申请号:US29601829
申请日:2017-04-26
Applicant: Samsung Electronics Co., Ltd.
Designer: Jinsu Park
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公开(公告)号:USD770460S1
公开(公告)日:2016-11-01
申请号:US29499135
申请日:2014-08-12
Applicant: Samsung Electronics Co., Ltd.
Designer: Taeyeon Won , Sangyong Park , Jinsu Park
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