公开(公告)号：US09899337B2

公开(公告)日：2018-02-20

申请号：US15174411

申请日：2016-06-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gun-ho Chang ,  Tae-je Cho ,  Jong-bo Shim

IPC: H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L21/56 ,  H01L23/538

CPC classification number: H01L23/562 ,  H01L21/486 ,  H01L21/561 ,  H01L21/568 ,  H01L23/147 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/0557 ,  H01L2224/12105 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/27002 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/92224 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2224/83 ,  H01L2224/27 ,  H01L2924/00

Abstract: A semiconductor package includes a package member and a stress controlling layer. The package member includes an encapsulation layer and at least one chip. The encapsulation layer encapsulates the at least one chip. The stress controlling layer is disposed on a surface of the package member. The stress controlling layer has an internal stress to the extent that the stress controlling layer prevents the package member from having warpage.