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11.
公开(公告)号:US20230400604A1
公开(公告)日:2023-12-14
申请号:US18196583
申请日:2023-05-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyungwook HWANG , Dongho KIM , Junsik HWANG , Sanghoon SONG
CPC classification number: G02B1/005 , G02F1/0151 , H01L33/10 , G02B2207/107 , G02B1/14 , G02B3/0037 , G02B5/206
Abstract: Disclosed are a color conversion structure, a display apparatus, and a method for manufacturing the color conversion structure. The color conversion structure includes a base, a photonic crystal structure provided on the base, and quantum dots included in the photonic crystal structure. The color conversion structure has a transferable structure.
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12.
公开(公告)号:US20230377509A1
公开(公告)日:2023-11-23
申请号:US18085162
申请日:2022-12-20
Inventor: Junsik HWANG , Geonwook YOO , Hojin LEE , Yongchan KIM , Kyungwook HWANG
IPC: G09G3/32
CPC classification number: G09G3/32 , G09G2300/0426 , G09G2310/0275
Abstract: A driving circuit board includes a driving circuit board includes: a plurality of driving electrode regions on a surface of the driving circuit board; a plurality of driving electrodes symmetrically arranged on the plurality of driving electrode regions; and a driving circuit electrically connected to at least one of the plurality of driving electrodes, wherein the plurality of driving electrodes include at least one dummy electrode that is not connected to the driving circuit.
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公开(公告)号:US20220285581A1
公开(公告)日:2022-09-08
申请号:US17526556
申请日:2021-11-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seogwoo HONG , Kyungwook HWANG , Hyunjoon KIM , Junsik HWANG
Abstract: Provided is a display device including a driving substrate, a barrier layer disposed on an upper surface of the driving substrate and including a plurality of recesses, a micro-semiconductor light emitting device disposed in each of the plurality of recesses, and a side reflective structure disposed in the barrier layer and provided adjacent to a sidewall of each of the plurality of recesses.
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公开(公告)号:US20220246584A1
公开(公告)日:2022-08-04
申请号:US17506135
申请日:2021-10-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Junsik HWANG , Seogwoo Hong , Kyungwook Hwang , Hyunjoon Kim , Joonyong Park
IPC: H01L25/075 , H01L33/00 , H01L21/68 , G09G3/32 , H01L21/683
Abstract: A display transferring structure includes a transferring substrate including a mold including a plurality of recesses, and a plurality of protrusions provided on an outer surface of the mold connected to the plurality of recesses; and micro semiconductor chips arranged in the recesses. When the micro semiconductor chips are wet aligned, by such protrusions, sliding of the micro semiconductor chips toward the inside of the recesses may be improved.
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公开(公告)号:US20220190223A1
公开(公告)日:2022-06-16
申请号:US17506359
申请日:2021-10-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyungwook HWANG , Junsik HWANG , Joonyong PARK , Seogwoo HONG
Abstract: A display apparatus and a method of manufacturing the display method are provided. The display apparatus includes a transfer substrate, and micro display elements spaced apart from each other in units of sub-pixels on the transfer substrate, wherein each of the micro display elements includes a micro light emitting unit and a drive unit, wherein the drive unit includes drive electrodes and drives the micro light emitting unit.
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公开(公告)号:US20220189931A1
公开(公告)日:2022-06-16
申请号:US17483103
申请日:2021-09-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Junsik HWANG , Seogwoo HONG , Kyungwook HWANG
IPC: H01L25/075 , H01L33/20 , H01L33/00 , H01L33/62 , H01L33/50
Abstract: A display transferring structure includes a transfer substrate including a plurality of recesses, each of the plurality of recesses including a first trap having a space in which a predetermined object can be moved and a second trap connected to the first trap and having a shape and size in which the object can be seated; and a micro-semiconductor chip positioned in the second trap. The micro-semiconductor chip may be self-aligned in a correct position by the display transferring structure.
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公开(公告)号:US20220139887A1
公开(公告)日:2022-05-05
申请号:US17399683
申请日:2021-08-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyunjoon KIM , Kyungwook HWANG , Joonyong PARK , Seogwoo HONG , Junsik HWANG
IPC: H01L25/075 , H01L33/62
Abstract: A method of manufacturing a micro-light-emitting diode (LED) array includes: providing a first substrate including a plurality of circular grooves formed on a first surface thereof; supplying a plurality of micro-LEDs onto the first surface of the first substrate; and aligning the plurality of micro-LEDs with the plurality of circular grooves, wherein at least two electrodes are formed on a second surface of each of the plurality of micro-LEDs to be apart from each other, and the at least two electrodes include a first electrode formed to be relatively close to a center of the second surface and at least one second electrode formed at an edge of the second surface.
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公开(公告)号:US20220115359A1
公开(公告)日:2022-04-14
申请号:US17232964
申请日:2021-04-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyunjoon KIM , Kyungwook HWANG , Joonyong PARK , Seogwoo HONG , Junsik HWANG
IPC: H01L25/075 , H01L25/16
Abstract: Provided is a micro-LED display, a micro-LED transferring substrate, and a method of transferring micro-LEDs using the micro-LED transferring substrate. The micro-LED includes a backplane substrate; and a plurality of sub-pixels provided on the backplane substrate, wherein at least one sub-pixel from among the plurality of sub-pixels includes a first micro-LED; and a second micro-LED different from the first micro-LED.
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公开(公告)号:US20220077346A1
公开(公告)日:2022-03-10
申请号:US17194942
申请日:2021-03-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyungwook HWANG , Junsik HWANG , Seogwoo HONG
IPC: H01L33/04 , H01L33/32 , H01L33/62 , H01L25/075
Abstract: Provided is a micro light emitting device and a display apparatus having the micro light emitting device. The micro light emitting device includes a first-type semiconductor layer provided on a substrate, a superlattice layer provided on the first-type semiconductor layer, a current blocking layer provided on a side portion of the superlattice layer, an active layer provided on the superlattice layer and the current blocking layer, and a second-type semiconductor layer provided on the active layer.
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公开(公告)号:US20220013400A1
公开(公告)日:2022-01-13
申请号:US17324609
申请日:2021-05-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyungwook HWANG , Junsik HWANG
IPC: H01L21/683 , H01L25/075 , H01L33/50 , H01L33/52 , H01L33/62
Abstract: A wet alignment method for a micro-semiconductor chip and a display transfer structure are provided. The wet alignment method for a micro-semiconductor chip includes: supplying a liquid to a transfer substrate including a plurality of grooves; supplying the micro-semiconductor chip onto the transfer substrate; scanning the transfer substrate by using an absorber capable of absorbing the liquid. According to the wet alignment method, the micro-semiconductor chip may be transferred onto a large area.
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