公开(公告)号：US11322592B2

公开(公告)日：2022-05-03

申请号：US16881133

申请日：2020-05-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Shigenobu Maeda ,  Seunghan Seo ,  Yeohyun Sung

IPC: H01L29/06 ,  H01L29/16 ,  H01L29/08 ,  H01L29/10 ,  H01L29/165 ,  H01L29/20 ,  H01L29/22 ,  H01L29/24 ,  H01L29/267 ,  H01L29/66 ,  H01L29/778 ,  H01L29/78 ,  H01L29/786 ,  H01L29/04 ,  H01L29/51

Abstract: A semiconductor device, a field effect transistor, and a fin field effect transistor are provided. The semiconductor device may include a channel layer, a source/drain layer, and a gate electrode. The channel layer is provided on a substrate and extends in a direction perpendicular to a top surface of the substrate. The source/drain layer is disposed at a side of the channel layer and is electrically connected to the channel layer. The gate electrode is provided adjacent to at least one of surfaces of the channel layer. The channel layer includes a two-dimensional atomic layer made of a first material.

公开(公告)号：US11160161B2

公开(公告)日：2021-10-26

申请号：US16848121

申请日：2020-04-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunghan Seo ,  Jongpill Lee ,  Changwon Jang

IPC: H05K1/02 ,  H01Q1/24 ,  H01Q1/22

Abstract: Electronic device includes a housing including a conductive portion, an antenna module disposed in an inner space of the housing and including printed circuit board (PCB) disposed in the inner space, including a first surface and a second surface facing a direction opposite to the first surface, at least one antenna element disposed on the first surface of the PCB or near the first surface in the PCB, a wireless communication circuit disposed on the second surface and configured to transmit and/or receive a radio signal through the at least one antenna element, a protective member disposed on the second surface of the PCB to surround at least partially the wireless communication circuit, and a conductive shielding layer disposed on the protective layer, and a conductive member connected to the conductive portion of the housing and facing the conductive shielding layer of the antenna module at least in part.

公开(公告)号：US10939539B2

公开(公告)日：2021-03-02

申请号：US16900371

申请日：2020-06-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunghan Seo ,  Jongpill Lee ,  Changwon Jang

IPC: H05K1/02 ,  H01Q1/24 ,  H01Q1/22

Abstract: Electronic device includes a housing including a conductive portion, an antenna module disposed in an inner space of the housing and including printed circuit board (PCB) disposed in the inner space, including a first surface and a second surface facing a direction opposite to the first surface, at least one antenna element disposed on the first surface of the PCB or near the first surface in the PCB, a wireless communication circuit disposed on the second surface and configured to transmit and/or receive a radio signal through the at least one antenna element, a protective member disposed on the second surface of the PCB to surround at least partially the wireless communication circuit, and a conductive shielding layer disposed on the protective layer, and a conductive member connected to the conductive portion of the housing and facing the conductive shielding layer of the antenna module at least in part.

公开(公告)号：US20200329550A1

公开(公告)日：2020-10-15

申请号：US16900371

申请日：2020-06-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunghan Seo ,  Jongpill Lee ,  Changwon Jang

IPC: H05K1/02 ,  H01Q1/24 ,  H01Q1/22

Abstract: Electronic device includes a housing including a conductive portion, an antenna module disposed in an inner space of the housing and including printed circuit board (PCB) disposed in the inner space, including a first surface and a second surface facing a direction opposite to the first surface, at least one antenna element disposed on the first surface of the PCB or near the first surface in the PCB, a wireless communication circuit disposed on the second surface and configured to transmit and/or receive a radio signal through the at least one antenna element, a protective member disposed on the second surface of the PCB to surround at least partially the wireless communication circuit, and a conductive shielding layer disposed on the protective layer, and a conductive member connected to the conductive portion of the housing and facing the conductive shielding layer of the antenna module at least in part.