Printed circuit board for reducing power noise and electronic device including the same

    公开(公告)号:US12108523B2

    公开(公告)日:2024-10-01

    申请号:US17948339

    申请日:2022-09-20

    IPC分类号: H05K1/02 G06F1/16

    摘要: An electronic device according to an example embodiment includes a printed circuit board (PCB) configured to connect a first electronic component and a second electronic component and block power noise in a target frequency band. The PCB may include a first signal layer including a first signal plate having a length pattern with a length corresponding to a first parameter of the target frequency band, a first ground layer including a first ground plate with a first area, a second signal layer including a second signal plate, a first dielectric having a first thickness and a first permittivity, a second ground layer including a second ground plate with a second area corresponding to a second parameter of the target frequency band, and a second dielectric having a second thickness and a second permittivity corresponding to the second parameter.

    Electronic device for vehicle and operating method thereof

    公开(公告)号:US12058610B2

    公开(公告)日:2024-08-06

    申请号:US17689241

    申请日:2022-03-08

    摘要: A vehicular electronic device and method thereof are disclosed herein. The electronic device includes memory, a network access device and a processor. The processor implements the method, including: monitoring, via at least one processor, whether a network access device of the electronic device enters a preset operation mode in which the network access device remains activated while a processor of the electronic device is in a sleep mode, based on detecting that the network access device enters the preset operation mode, identifying a network state of the network access device, based at least on the network state of the network access device, changing a search cycle of a network search as executed by the network access device, and executing the network search based on the changed search cycle.

    Flexible flat cable and method of producing the same

    公开(公告)号:US11742109B2

    公开(公告)日:2023-08-29

    申请号:US17969757

    申请日:2022-10-20

    摘要: Provided are a flexible flat cable and a method of producing the same. The flexible flat cable includes a plate-shaped first insulation portion comprising an insulating material; a first ground, a second ground, and a third ground disposed at predetermined intervals on the first insulation portion; at least one first signal transmission line positioned between the first ground and the second ground and disposed on the first insulation portion; at least one second signal transmission line positioned between the second ground and the third ground and disposed on the first insulation portion; a first second insulation portion disposed on at least a portion of the first ground and at least a portion of the at least one first signal transmission line and the second ground; a second second insulation portion disposed on at least a portion of the second ground and at least a portion of the at least one second signal transmission line, and the third ground; a conductive adhesive layer configured to enclose the first insulation portion, the first second insulation portion, and the second second insulation portion; and a shielding portion comprising a shielding material adhered to an outside of the conductive adhesive layer. Therefore, by improving shielding efficiency of a plurality of signal transmission lines, while having good electromagnetic interference and crosstalk characteristics, a plurality of signals can be simultaneously transmitted.

    Flexible flat cable and method for manufacturing the same

    公开(公告)号:US11961640B2

    公开(公告)日:2024-04-16

    申请号:US16970275

    申请日:2020-07-15

    IPC分类号: H01B7/00 H01B7/08 H01B11/20

    CPC分类号: H01B7/08 H01B11/203

    摘要: A flexible flat cable according to various embodiments of the disclosure may include a first insulation layer having a plate shape, a first conductive pattern disposed on the first insulation layer, a second conductive pattern disposed on the first insulation layer to be spaced apart from the first conductive pattern at a predetermined interval, a second insulation layer covering at least a portion of the first conductive pattern and disposed on the first insulation layer to cover the first conductive pattern, a first shield member including a first shield layer disposed on the first insulation layer and the second insulation layer to cover the first conductive pattern and the second conductive pattern, and a second shield layer disposed on the first shield layer to cover the first shield layer, and a third insulation layer surrounding the first shield layer such that at least a portion of the first shield layer of the first shield member, which is exposed between the first insulation layer and the second shield layer of the first shield member is covered.

    Electronic device including antenna and heat dissipation structure

    公开(公告)号:US11832381B2

    公开(公告)日:2023-11-28

    申请号:US17974083

    申请日:2022-10-26

    IPC分类号: H05K1/02 H01Q1/24 H01Q1/22

    摘要: Electronic device includes a housing; an antenna module accommodated in the housing, the antenna module including a PCB including a first side and a second side opposite to the first side; one or more antenna elements disposed at the first side of the PCB; and a wireless communication circuit disposed at the second side of the PCB and configured to transmit and/or receive a radio signal through an antenna element of the one or more antenna elements; and a conductive member accommodated in the housing and including a supporting portion and a connecting portion extended from the supporting portion and connected to the conductive portion of the housing, the supporting portion configured to support the antenna module such that the first side of the PCB faces in a direction toward the lateral surface of the electronic device, and the connecting portion including a hole through which a fastening member is disposed to fasten the conductive member to the conductive portion of the housing. Heat generated by the antenna module is transferred to the conductive portion of the housing.

    Electronic device including antenna and heat dissipation structure

    公开(公告)号:US11516903B2

    公开(公告)日:2022-11-29

    申请号:US17460588

    申请日:2021-08-30

    IPC分类号: H05K1/02 H01Q1/24 H01Q1/22

    摘要: Electronic device includes a housing including a conductive portion extended from at least a portion of a lateral surface of the electronic device to an inner space of the electronic device; an antenna module accommodated in the housing, the antenna module including a PCB including a first side and a second side opposite to the first side, one or more antenna elements disposed at the first side of the PCB, and a wireless communication circuit disposed at the second side of the PCB and configured to transmit and/or receive a radio signal through at least one antenna element of the one or more antenna elements; and a conductive member accommodated in the housing and including a supporting portion and a connecting portion extended from the supporting portion and connected to the conductive portion of the housing, the supporting portion configured to support the antenna module such that the first side of the PCB faces in a direction toward the lateral surface of the electronic device, and the connecting portion including a hole through which a fastening member is disposed to fasten the conductive member to the conductive portion of the housing. Heat generated by the antenna module is to be transferred to the conductive portion of the housing.

    Flexible flat cable and method of producing the same

    公开(公告)号:US11482350B2

    公开(公告)日:2022-10-25

    申请号:US16749419

    申请日:2020-01-22

    摘要: Provided are a flexible flat cable and a method of producing the same. The flexible flat cable includes a plate-shaped first insulation portion comprising an insulating material; a first ground, a second ground, and a third ground disposed at predetermined intervals on the first insulation portion; at least one first signal transmission line positioned between the first ground and the second ground and disposed on the first insulation portion; at least one second signal transmission line positioned between the second ground and the third ground and disposed on the first insulation portion; a first second insulation portion disposed on at least a portion of the first ground and at least a portion of the at least one first signal transmission line and the second ground; a second insulation portion disposed on at least a portion of the second ground and at least a portion of the at least one second signal transmission line, and the third ground; a conductive adhesive layer configured to enclose the first insulation portion, the first second insulation portion, and the second insulation portion; and a shielding portion comprising a shielding material adhered to an outside of the conductive adhesive layer. Therefore, by improving shielding efficiency of a plurality of signal transmission lines, while having good electromagnetic interference and crosstalk characteristics, a plurality of signals can be simultaneously transmitted.

    Flexible flat cable and method for manufacturing the same

    公开(公告)号:US11923111B2

    公开(公告)日:2024-03-05

    申请号:US16970275

    申请日:2020-07-15

    IPC分类号: H01B7/00 H01B7/08 H01B11/20

    CPC分类号: H01B7/08 H01B11/203

    摘要: A flexible flat cable according to various embodiments of the disclosure may include a first insulation layer having a plate shape, a first conductive pattern disposed on the first insulation layer, a second conductive pattern disposed on the first insulation layer to be spaced apart from the first conductive pattern at a predetermined interval, a second insulation layer covering at least a portion of the first conductive pattern and disposed on the first insulation layer to cover the first conductive pattern, a first shield member including a first shield layer disposed on the first insulation layer and the second insulation layer to cover the first conductive pattern and the second conductive pattern, and a second shield layer disposed on the first shield layer to cover the first shield layer, and a third insulation layer surrounding the first shield layer such that at least a portion of the first shield layer of the first shield member, which is exposed between the first insulation layer and the second shield layer of the first shield member is covered.

    Electronic device including antenna and heat dissipation structure

    公开(公告)号:US11160161B2

    公开(公告)日:2021-10-26

    申请号:US16848121

    申请日:2020-04-14

    IPC分类号: H05K1/02 H01Q1/24 H01Q1/22

    摘要: Electronic device includes a housing including a conductive portion, an antenna module disposed in an inner space of the housing and including printed circuit board (PCB) disposed in the inner space, including a first surface and a second surface facing a direction opposite to the first surface, at least one antenna element disposed on the first surface of the PCB or near the first surface in the PCB, a wireless communication circuit disposed on the second surface and configured to transmit and/or receive a radio signal through the at least one antenna element, a protective member disposed on the second surface of the PCB to surround at least partially the wireless communication circuit, and a conductive shielding layer disposed on the protective layer, and a conductive member connected to the conductive portion of the housing and facing the conductive shielding layer of the antenna module at least in part.