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公开(公告)号：US11770167B2
公开(公告)日：2023-09-26
申请号：US16969870
申请日：2020-07-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Mingyu Kang , Seunghan Seo , Woochul Jeong , Euichang Jung
IPC: H04B7/06 , H04B17/12 , H04B7/0456
CPC classification number: H04B7/0617 , H04B7/0456 , H04B17/12
Abstract: An electronic device is provided. The electronic device includes an antenna module, a memory, and at least one processor configured to, in response to modulating a signal for transmitting by a first carrier frequency, identify a first beam book corresponding to the first carrier frequency stored in the memory, the first beam book including information related to a first phase value corresponding to each of antenna elements included in the antenna module, perform beamforming based on the identified first beam book via the antenna module, in response to modulating the signal for transmitting by a second carrier frequency different from the first carrier frequency, identify a second beam book corresponding to the second carrier frequency, the second beam book including information related to a second phase value corresponding to each of the antenna elements, the second phase value is a value compensated from the first phase value based on the second carrier frequency, and perform beamforming based on the identified second beam book via the antenna module.
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公开(公告)号：US10819018B2
公开(公告)日：2020-10-27
申请号：US16573290
申请日：2019-09-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seunghan Seo , Seunggil Jeon , Sungchul Park
Abstract: An electronic device is provided. The electronic device includes a housing including a first plate facing in a first direction, a second plate opposite to the first plate and facing in a second direction, and a side member enclosing a space between the first plate and the second plate, an antenna structure including at least one antenna element disposed substantially parallel to the second plate in the space and disposed to face the second plate, a conductive structure disposed in the space and including an opening, the antenna structure being disposed to at least partially overlap the opening when viewed from above the second plate, and a wireless communication circuit configured to form a directional beam through the at least one antenna element. In addition, various embodiments may be available.
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公开(公告)号：US10749000B2
公开(公告)日：2020-08-18
申请号：US15911182
申请日：2018-03-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Shigenobu Maeda , Seunghan Seo , Yeohyun Sung
IPC: H01L29/06 , H01L29/16 , H01L29/165 , H01L29/267 , H01L29/778 , H01L29/786 , H01L29/24 , H01L29/66 , H01L29/04 , H01L29/08 , H01L29/10 , H01L29/20 , H01L29/22 , H01L29/78 , H01L29/51
Abstract: A semiconductor device, a field effect transistor, and a fin field effect transistor are provided. The semiconductor device may include a channel layer, a source/drain layer, and a gate electrode. The channel layer is provided on a substrate and extends in a direction perpendicular to a top surface of the substrate. The source/drain layer is disposed at a side of the channel layer and is electrically connected to the channel layer. The gate electrode is provided adjacent to at least one of surfaces of the channel layer. The channel layer includes a two-dimensional atomic layer made of a first material.
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公开(公告)号：US11695044B2
公开(公告)日：2023-07-04
申请号：US17352989
申请日：2021-06-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Shigenobu Maeda , Seunghan Seo , Yeohyun Sung
IPC: H01L29/16 , H01L29/165 , H01L29/267 , H01L29/778 , H01L29/786 , H01L29/24 , H01L29/66 , H01L29/04 , H01L29/08 , H01L29/10 , H01L29/20 , H01L29/22 , H01L29/78 , H01L29/51
CPC classification number: H01L29/1606 , H01L29/04 , H01L29/0847 , H01L29/1037 , H01L29/1054 , H01L29/165 , H01L29/2003 , H01L29/22 , H01L29/24 , H01L29/267 , H01L29/66742 , H01L29/778 , H01L29/78 , H01L29/786 , H01L29/78618 , H01L29/78681 , H01L29/78684 , H01L29/78696 , H01L29/517
Abstract: A semiconductor device is provided and includes a substrate and a stack on the substrate. The stack includes plural active layers that are vertically stacked and spaced apart from each other, and plural gate electrodes that are on the active layers, respectively, and vertically stacked. Each active layer includes a channel layer under a corresponding one of the gate electrodes, and a source/drain layer disposed at a side of the channel layer and electrically connected to the channel layer. The channel layer is made of a two-dimensional atomic layer of a first material.
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5.发明授权公开(公告)号：US10804608B2
公开(公告)日：2020-10-13
申请号：US16573359
申请日：2019-09-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seunghan Seo , Seunggil Jeon
Abstract: An electronic device is provided. The electronic device includes a housing that has a first plate facing a first direction, a second plate facing a second direction and opposite to the first plate, and a lateral member surrounding a space between the first plate and the second plate. The electronic device further includes an antenna structure disposed to be substantially parallel to the second plate in the space, and including at least one antenna element disposed to face the second plate. Also, the electronic device includes a dielectric disposed, in the space, to overlap, at least in part, with the antenna structure without exceeding a half area of the antenna structure when the second plate is viewed from above, and a wireless communication circuit configured to form a directional beam, at least in part, through the at least one antenna element.
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Patent Agency Ranking
公开(公告)号：US09941360B2
公开(公告)日：2018-04-10
申请号：US15340199
申请日：2016-11-01
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Shigenobu Maeda , Seunghan Seo , Yeohyun Sung
IPC: H01L29/165 , H01L29/16 , H01L29/04 , H01L29/08 , H01L29/10 , H01L29/20 , H01L29/22 , H01L29/78 , H01L29/267 , H01L29/778 , H01L29/786 , H01L29/24 , H01L29/51
CPC classification number: H01L29/1606 , H01L29/04 , H01L29/0847 , H01L29/1037 , H01L29/1054 , H01L29/165 , H01L29/2003 , H01L29/22 , H01L29/24 , H01L29/267 , H01L29/517 , H01L29/778 , H01L29/78 , H01L29/786
Abstract: A field effect transistor and a semiconductor device including the same are provided. The semiconductor device may include a channel layer, which is provided on a substrate and includes a two-dimensional atomic layer made of a first material, and a source/drain layer, which is provided on the substrate and includes a second material. The first material may be one of phosphorus allotropes, the second material may be one of carbon allotropes, and the channel layer and the source/drain layer may be connected to each other by covalent bonds between the first and second materials.
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公开(公告)号：US11895253B2
公开(公告)日：2024-02-06
申请号：US17652725
申请日：2022-02-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seunghan Seo , Jaehoon Song , Dongil Son
CPC classification number: H04M1/0218 , H01Q1/2283 , H01Q1/243 , H04M1/0268
Abstract: According to various embodiments of the disclosure, an electronic device may comprise: a first housing including a first insulating portion, a second housing including a second insulating portion adjacent to the first insulating portion, a hinge connecting the first housing and the second housing to be pivotable from a folded state to an unfolded state with respect to a pivot shaft, a hinge cover exposed to an outside and covering the hinge in the folded state and including a third insulating portion in at least a partial area thereof, a flexible display configured to be deformable in response to relative motion of the second housing with respect to the first housing, and an antenna structure including an antenna circuit board disposed in at least a partial area of the hinge and a plurality of antenna elements comprising at least one antenna forming an array on or in the antenna circuit board. In the unfolded state, the plurality of antenna elements may be disposed to overlap the first insulating portion and/or the second insulating portion, and in the folded state, the plurality of antenna elements may be disposed to overlap the third insulating portion of the hinge cover.
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公开(公告)号：US11832381B2
公开(公告)日：2023-11-28
申请号：US17974083
申请日：2022-10-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seunghan Seo , Jongpill Lee , Changwon Jang
CPC classification number: H05K1/021 , H01Q1/2283 , H01Q1/243 , H05K1/0224 , H05K2201/10098
Abstract: Electronic device includes a housing; an antenna module accommodated in the housing, the antenna module including a PCB including a first side and a second side opposite to the first side; one or more antenna elements disposed at the first side of the PCB; and a wireless communication circuit disposed at the second side of the PCB and configured to transmit and/or receive a radio signal through an antenna element of the one or more antenna elements; and a conductive member accommodated in the housing and including a supporting portion and a connecting portion extended from the supporting portion and connected to the conductive portion of the housing, the supporting portion configured to support the antenna module such that the first side of the PCB faces in a direction toward the lateral surface of the electronic device, and the connecting portion including a hole through which a fastening member is disposed to fasten the conductive member to the conductive portion of the housing. Heat generated by the antenna module is transferred to the conductive portion of the housing.
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公开(公告)号：US11516903B2
公开(公告)日：2022-11-29
申请号：US17460588
申请日：2021-08-30
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seunghan Seo , Jongpill Lee , Changwon Jang
Abstract: Electronic device includes a housing including a conductive portion extended from at least a portion of a lateral surface of the electronic device to an inner space of the electronic device; an antenna module accommodated in the housing, the antenna module including a PCB including a first side and a second side opposite to the first side, one or more antenna elements disposed at the first side of the PCB, and a wireless communication circuit disposed at the second side of the PCB and configured to transmit and/or receive a radio signal through at least one antenna element of the one or more antenna elements; and a conductive member accommodated in the housing and including a supporting portion and a connecting portion extended from the supporting portion and connected to the conductive portion of the housing, the supporting portion configured to support the antenna module such that the first side of the PCB faces in a direction toward the lateral surface of the electronic device, and the connecting portion including a hole through which a fastening member is disposed to fasten the conductive member to the conductive portion of the housing. Heat generated by the antenna module is to be transferred to the conductive portion of the housing.
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公开(公告)号：US11462846B2
公开(公告)日：2022-10-04
申请号：US16659970
申请日：2019-10-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seunghan Seo , Jongpil Lee
Abstract: According to various embodiments, an electronic device may include a housing including a first plate, a second plate facing away from the first plate, and a side housing surrounding a space between the first plate and the second plate and joined to the second plate or provided integrally with the second plate, a display viewable through at least part of the first plate, a first Printed Circuit Board (PCB) disposed between the first plate and the second plate and including at least one first ground layer, a Flexible Printed Circuit Board (FPCB) at least partially overlapping the first PCB when viewed from above the first plate and including a first end electrically coupled to the first PCB, a second end, and at least one second ground layer, and a conductive structure comprising a conductive material disposed between the first PCB and the FPCB and electrically coupling the first ground layer and the second ground layer.
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