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    Heat pump and flow path switching apparatus
    11.
    发明授权
    Heat pump and flow path switching apparatus 有权

    公开(公告)号：US10401064B2

    公开(公告)日：2019-09-03

    申请号：US14337674

    申请日：2014-07-22

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Suk Ho Lee ,  Il Yong Cho ,  Hyung Mo Koo ,  Min Chang

    IPC: F25B41/04 ,  F25B13/00 ,  F25B30/02

    Abstract: A heat pump performs a simultaneous air-conditioning and heating operation through the addition of a flow path switching apparatus. The heat pump may include a plurality of outdoor units, a plurality of indoor units, and a plurality of flow path switching apparatuses that switch a flow path between an outdoor unit and an indoor unit. A refrigerant flow path may be formed from the outdoor unit to the indoor unit via a high-pressure gas pipe. The flow path switching apparatuses may switch a flow path so that a refrigerant flow path is formed from the indoor unit to the outdoor unit via a low-pressure gas pipe. The heat pump may further include an indoor unit mode controller that is connected to the plurality of outdoor units through a liquid pipe, and which is connected to each of the plurality of flow path switching apparatuses.

    Semiconductor package
    13.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US10665535B2

    公开(公告)日：2020-05-26

    申请号：US15913429

    申请日：2018-03-06

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jae Ean Lee ,  Tae Sung Jeong ,  Young Gwan Ko ,  Suk Ho Lee ,  Jung Soo Byun

    IPC: H01L23/495 ,  H01L23/498 ,  H01L21/48 ,  H01L23/31 ,  H01L23/29 ,  H01L23/00

    Abstract: A semiconductor package includes a semiconductor chip; a connection member having a first surface on which the semiconductor chip is disposed and a second surface opposing the first surface, an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip, a passivation layer on the second surface of the connection member; and an UBM layer partially embedded in the passivation layer, wherein the UBM layer includes an UBM via embedded in the passivation layer and connected to the redistribution layer of the connection member and an UBM pad connected to the UBM via and protruding from a surface of the passivation layer, and a width of a portion of the UBM via in contact with the UBM pad is narrower than a width of a portion of the UBM via in contact with the redistribution layer.

    Semiconductor package
    14.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US10607945B1

    公开(公告)日：2020-03-31

    申请号：US16542470

    申请日：2019-08-16

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Suk Ho Lee ,  Dong Joon Oh ,  Ju Suk Kang

    IPC: H01L23/552 ,  H01L23/00 ,  H01L23/498 ,  H01L21/56

    Abstract: A semiconductor package includes a frame having a first through-hole, a semiconductor chip disposed on the first through-hole an having an active surface on which a connection pad is disposed and an inactive surface, a first encapsulant covering at least a portion of the inactive surface and a side surface of the semiconductor chip, a connection structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad of the semiconductor chip and a ground pattern layer, a side surface cover layer covering at least an outer side surface of the frame, and a metal layer disposed on the upper surface of the first encapsulant and extending downwardly along the side surface cover layer to cover the side surface cover layer and a portion of the side surface of the connection structure.

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