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    Semiconductor package
    3.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US11189552B2

    公开(公告)日：2021-11-30

    申请号：US16867004

    申请日：2020-05-05

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jae Ean Lee ,  Tae Sung Jeong ,  Young Gwan Ko ,  Suk Ho Lee ,  Jung Soo Byun

    IPC: H01L23/495 ,  H01L23/498 ,  H01L21/48 ,  H01L23/31 ,  H01L23/29 ,  H01L23/00

    Abstract: A semiconductor package includes a semiconductor chip; a connection member having a first surface on which the semiconductor chip is disposed and a second surface opposing the first surface, an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip, a passivation layer on the second surface of the connection member; and an UBM layer partially embedded in the passivation layer, wherein the UBM layer includes an UBM via embedded in the passivation layer and connected to the redistribution layer of the connection member and an UBM pad connected to the UBM via and protruding from a surface of the passivation layer, and a width of a portion of the UBM via in contact with the UBM pad is narrower than a width of a portion of the UBM via in contact with the redistribution layer.

    OIL LEVEL DETECTING APPARATUS AND CONTROL METHOD THEREOF, OIL FLOW DETECTING APPARATUS AND CONTROL METHOD THEREOF, METHOD FOR CONTROL OIL RETURN USING OIL LEVEL AND OIL FLOW
    6.
    发明申请
    OIL LEVEL DETECTING APPARATUS AND CONTROL METHOD THEREOF, OIL FLOW DETECTING APPARATUS AND CONTROL METHOD THEREOF, METHOD FOR CONTROL OIL RETURN USING OIL LEVEL AND OIL FLOW 有权
    油水位检测装置及其控制方法，油流量检测装置及其控制方法，使用油位和油流控制油回收的方法

    公开(公告)号：US20160187173A1

    公开(公告)日：2016-06-30

    申请号：US14829747

    申请日：2015-08-19

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yong Hee JANG ,  Hyo Sang Lee ,  Hyung Mo Koo ,  Suk Ho Lee ,  Byoung Guk Lim ,  II Yong Cho ,  Byung Ik Choi ,  Jeong Su Han

    IPC: G01F1/68 ,  G05D7/06 ,  G01F23/26

    CPC classification number: G05D7/0635 ,  F01M11/12 ,  F04B39/023 ,  F04B51/00 ,  F04B2201/0404 ,  F04C18/0215 ,  F04C23/008 ,  F04C29/02 ,  F04C2240/809 ,  F04C2240/81 ,  G01F1/6847 ,  G01F23/0007 ,  G01F23/265 ,  G01F23/266 ,  G01F23/268 ,  G05D9/12 ,  Y10T137/7306

    Abstract: An apparatus for detecting an oil level and a method for controlling the same, an apparatus for detecting oil flow and a method for controlling the same, and a method for controlling oil return using the detected oil level and the detected oil flow are disclosed. The level of oil stored in a compressor is measured at two or more positions. The frequency comparison scheme using two electrodes can correctly detect the level of oil stored in the compressor, a refrigerant state, and the level of mixed oils, and can determine an internal state of the compressor and a normal or abnormal state of the oil return system, such that the oil return control can be actively controlled. The flow of oil in the oil return pipe is detected so as to determine whether the oil is normally supplied in real time, such that a malfunction of the compressor is prevented and a valve state can be checked. The level of oil stored in the compressor is adjusted not only using the oil level detection result but also the oil flow detection result, and the oil return operation can be controlled.

    Abstract translation: 公开了一种用于检测油位的装置及其控制方法，用于检测油流的装置及其控制方法，以及使用所检测的油位和所检测的油流来控制回油的方法。 存储在压缩机中的油的水平在两个或更多个位置处被测量。 使用两个电极的频率比较方案可以正确地检测压缩机中存储的油水平，制冷剂状态和混合油的水平，并且可以确定压缩机的内部状态和回油系统的正常或异常状态 ，使得能够主动地控制回油控制。 检测回油管中的油流，以便确定油是否正常供油，从而防止压缩机的故障，并且可以检查阀的状态。 不仅使用油位检测结果，而且调节油流量检测结果，还可以调节储存在压缩机中的油位，并且可以控制回油操作。

    MULTI TYPE AIR CONDITIONER AND COOLING AND HEATING CONTROL METHOD THEREOF
    7.
    发明申请
    MULTI TYPE AIR CONDITIONER AND COOLING AND HEATING CONTROL METHOD THEREOF 有权
    多种类型的空气调节器及其冷却和加热控制方法

    公开(公告)号：US20130319018A1

    公开(公告)日：2013-12-05

    申请号：US13899104

    申请日：2013-05-21

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Byoung Guk LIM ,  Kyoung Rock Kim ,  Kyung Hoon Kim ,  Suk Ho Lee ,  Min Chang ,  Cha Wang Jang ,  Dong II Jung ,  Il Yong Cho ,  Tae Hoon Ha

    IPC: F25B49/02

    CPC classification number: F25B49/022 ,  F24F3/065 ,  F24F11/30 ,  F24F11/46 ,  F24F11/62 ,  F24F2110/00 ,  F25B13/00 ,  F25B49/027 ,  F25B2313/023 ,  F25B2313/02741 ,  F25B2600/027

    Abstract: A cooling and heating control method of a multi type air conditioner in which a target pressure of a compressor is adjusted based on conditions of respective indoor units so as to reduce power consumption is provided. The cooling control method includes determining the indoor unit desired to execute power saving control, judging whether or not a difference between a temperature of a space in which the indoor unit desired to execute power saving control is located and a set temperature of the indoor unit is less than a reference value, raising a target evaporation temperature of the indoor unit upon judging that the difference is less than the reference value, comparing an evaporation temperature of the indoor unit with the raised target evaporation temperature, and raising an evaporation pressure of a compressor, when the evaporation temperature of the indoor unit is lower than the raised target evaporation temperature.

    Abstract translation: 提供了一种根据各室内单元的条件来调节压缩机的目标压力以降低功耗的多型空调机的制冷加热控制方法。 冷却控制方法包括：确定所需的执行省电控制的室内机，判断所需要执行节电控制的室内机的空间的温度与室内机的设定温度之间的差是否为 小于参考值，在判断出差小于基准值时提高室内机的目标蒸发温度，将室内机的蒸发温度与提高的目标蒸发温度进行比较，提高压缩机的蒸发压力 当室内机的蒸发温度低于升高的目标蒸发温度时。

    Semiconductor package
    10.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US10896881B2

    公开(公告)日：2021-01-19

    申请号：US16819413

    申请日：2020-03-16

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Suk Ho Lee ,  Dong Joon Oh ,  Ju Suk Kang

    IPC: H01L23/552 ,  H01L23/00 ,  H01L21/56 ,  H01L23/498

    Abstract: A semiconductor package includes a frame having a first through-hole, a semiconductor chip disposed on the first through-hole an having an active surface on which a connection pad is disposed and an inactive surface, a first encapsulant covering at least a portion of the inactive surface and a side surface of the semiconductor chip, a connection structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad of the semiconductor chip and a ground pattern layer, a side surface cover layer covering at least an outer side surface of the frame, and a metal layer disposed on the upper surface of the first encapsulant and extending downwardly along the side surface cover layer to cover the side surface cover layer and a portion of the side surface of the connection structure.

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