Baking apparatus
    12.
    发明授权

    公开(公告)号:US12211711B2

    公开(公告)日:2025-01-28

    申请号:US17666796

    申请日:2022-02-08

    Abstract: A baking apparatus, may include a processing chamber including a lower chamber and an upper chamber connected by a ring shutter; a baking plate in the processing chamber adjacent to a region in which the lower chamber and the ring shutter overlap; an active flow controller including a first module and a second module in the lower chamber adjacent to the baking plate; a first auxiliary flow controller on a lower part of the ring shutter, adjacent to the lower chamber; and a second auxiliary flow controller in the upper chamber adjacent to the ring shutter. The active controller may be configured to move based on movement of the first module in a first direction perpendicular to an upper surface of the baking plate. The active flow controller may be configured to control airflow around the second module by movement of the second module.

    APPARATUS FOR CLEANING WAFER
    13.
    发明公开

    公开(公告)号:US20230402299A1

    公开(公告)日:2023-12-14

    申请号:US18200619

    申请日:2023-05-23

    CPC classification number: H01L21/67092 B08B1/04 B08B1/001

    Abstract: A wafer cleaning apparatus includes a base, a roller installation table installed on the base, a wafer support unit disposed at the roller installation table and having a support roller for rotatably supporting an edge of a wafer, a pressing roller installed on the roller installation table and above the wafer support unit, and configured to press opposite surfaces of the wafer, and a driving unit providing a force in a direction, crossing a direction of a central axis of the pressing roller, so that a shape of the pressing roller is deformed. The pressing roller deformed by the driving unit applies a first pressure to a central portion of the wafer and a second pressure, different from the first pressure, to an edge portion of the water.

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