公开(公告)号：US20230184691A1

公开(公告)日：2023-06-15

申请号：US17881367

申请日：2022-08-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yusin Yang ,  Sungyoon Ryu ,  Younghoon Sohn

IPC: G01N21/88 ,  G01N21/956 ,  G01N21/95 ,  G06T7/00

CPC classification number: G01N21/8806 ,  G01N21/956 ,  G01N21/9501 ,  G06T7/0004 ,  G01N2021/8887 ,  G01N2021/8835 ,  G01N2021/8848 ,  G06T2200/04 ,  G06T2207/30148 ,  G06T2207/10152 ,  G06T2207/10012 ,  G06T2207/10148

Abstract: A wafer inspection apparatus includes: a stage configured such that a wafer is arranged on the stage; an optical apparatus configured to align the wafer on the stage and generate an optical intensity image including an optical intensity profile; a focus adjusting unit configured to align light incident onto the wafer to be in-focus; and an image processor configured to integrate the optical intensity image with vertical level data of the in-focus to generate and analyze a three-dimensional (3D) image.

公开(公告)号：US20230008686A1

公开(公告)日：2023-01-12

申请号：US17561276

申请日：2021-12-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungil Choi ,  Yeeun Park ,  Kyungbeom Kim ,  Sungyoon Ryu ,  Jinwoo Ahn ,  Sunhong Jun

IPC: G02B21/00 ,  G01J3/28 ,  G02B21/36 ,  G02B21/02

Abstract: An inspection system includes a main support die configured to receive a target specimen; an auxiliary support die adjacent to the main support die and configured to receive a reference specimen; a cleaning device configured to remove contaminants from the reference specimen; an objective lens unit configured to direct light to main support die from a light source adjacent to the objective lens unit; a spectroscope between the objective lens unit and the light source; a detector adjacent to the objective lens unit; an imaging device between the objective lens unit and the detector; and a computer system in communication with the detector.