公开(公告)号：US10162771B2

公开(公告)日：2018-12-25

申请号：US15346342

申请日：2016-11-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-Hyun Kim ,  Won-Hyung Song

IPC: G11C11/408 ,  G06F13/16 ,  G11C11/4096 ,  G06F17/50 ,  G06F13/40 ,  G11C5/02 ,  G11C7/10

Abstract: Provided are a semiconductor device and a semiconductor system. A semiconductor device includes a memory cell array; a standard cell region in which first type standard cells implemented to perform a first operation for accessing the memory cell array and second type standard cells performing the first operation and having performance characteristics different from performance characteristics of the first type standard cells are arranged; and a ROM including a program that performs place and route for the standard cells arranged in the standard cell region.

公开(公告)号：US09601163B2

公开(公告)日：2017-03-21

申请号：US15168961

申请日：2016-05-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Won-Hyung Song ,  Kyoungsun Kim ,  Yong-Jin Kim ,  Jaejun Lee ,  Sangseok Kang ,  Jungjoon Lee

IPC: G11C5/04 ,  H01L25/07 ,  H01L25/065 ,  G11C5/02 ,  G06F13/10 ,  G06F13/40 ,  G06F13/42 ,  H01L23/00

CPC classification number: G11C5/04 ,  G06F13/102 ,  G06F13/4068 ,  G06F13/42 ,  G11C5/02 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/074 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/15331 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A memory module is provided which includes a printed circuit board; first semiconductor packages provided on one surface of the printed circuit board; and second semiconductor packages provided on the other surface of the printed circuit board, the first semiconductor packages and the second semiconductor packages having semiconductor dies that form ranks. A number of the ranks formed by the first semiconductor packages being different from a number of the ranks formed by the second semiconductor packages. Semiconductor packages forming a same one of the ranks receive a chip selection signal in common and semiconductor packages forming other ranks receive a different chip selection signal.

公开(公告)号：US09361948B2

公开(公告)日：2016-06-07

申请号：US14712530

申请日：2015-05-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Won-Hyung Song ,  Kyoungsun Kim ,  Yong-jin Kim ,  Jaejun Lee ,  Sangseok Kang ,  Jungjoon Lee

IPC: G11C5/02 ,  H01L25/07 ,  H01L25/065 ,  H01L23/00

CPC classification number: G11C5/04 ,  G06F13/102 ,  G06F13/4068 ,  G06F13/42 ,  G11C5/02 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/074 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/15331 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A memory module is provided which includes a printed circuit board; first semiconductor packages provided on one surface of the printed circuit board; and second semiconductor packages provided on the other surface of the printed circuit board, the first semiconductor packages and the second semiconductor packages having semiconductor dies that form ranks. A number of the ranks formed by the first semiconductor packages being different from a number of the ranks formed by the second semiconductor packages. Semiconductor packages forming a same one of the ranks receive a chip selection signal in common and semiconductor packages forming other ranks receive a different chip selection signal.

公开(公告)号：US09070572B2

公开(公告)日：2015-06-30

申请号：US13826612

申请日：2013-03-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Won-Hyung Song ,  Kyoungsun Kim ,  Yong-jin Kim ,  Jaejun Lee ,  Sangseok Kang ,  Jungjoon Lee

IPC: H01L25/07

CPC classification number: G11C5/04 ,  G06F13/102 ,  G06F13/4068 ,  G06F13/42 ,  G11C5/02 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/074 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/15331 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A memory module is provided which includes a printed circuit board; first semiconductor packages provided on one surface of the printed circuit board; and second semiconductor packages provided on the other surface of the printed circuit board, the first semiconductor packages and the second semiconductor packages having semiconductor dies that form ranks. A number of the ranks formed by the first semiconductor packages being different from a number of the ranks formed by the second semiconductor packages. Semiconductor packages forming a same one of the ranks receive a chip selection signal in common and semiconductor packages forming other ranks receive a different chip selection signal.

Abstract translation: 提供了一种包括印刷电路板的存储器模块; 设置在印刷电路板的一个表面上的第一半导体封装; 以及设置在所述印刷电路板的另一个表面上的第二半导体封装，所述第一半导体封装和所述第二半导体封装具有形成等级的半导体管芯。 由第一半导体封装形成的多个等级由与第二半导体封装形成的等级数不同。 形成相同行列的半导体封装共同接收芯片选择信号，形成其他级别的半导体封装接收不同的芯片选择信号。